Claims
- 1. An end effector for transporting susceptors and semiconductor substrates, comprising:
a first contact surface configured for supporting semiconductor substrates; and a second contact surface for supporting susceptors, the second contact surface being displaced relative to the first contact surface.
- 2. The end effector of claim 1, wherein the second contact surface is vertically displaced relative to the first contact surface.
- 3. The end effector of claim 2, wherein the second contact surface is provided at a lower level than the first contact surface.
- 4. The end effector of claim 2, wherein the first contact surface surrounds a recessed part, the recessed part connected to a vacuum source.
- 5. The end effector of claim 4, wherein the recessed part is a groove.
- 6. The end effector of claim 5, wherein the first contact surface comprises a ring.
- 7. The end effector of claim 5, wherein the first contact surface comprises two annular rings, separated by said groove.
- 8. The end effector of claim 5, wherein the first contact surface is a C-shaped ring surrounding the groove, the groove also being C-shaped.
- 9. The end effector of claim 2, wherein the second contact surface comprises a ring.
- 10. The end effector of claim 9, wherein the second contact surface further comprises a central disk positioned concentrically within the ring.
- 11. The end effector of claim 10, wherein the first contact surface comprises an elevated ring positioned vertically spaced above and horizontally positioned between the second contact surface ring and the second contact surface central disk.
- 12. The end effector of claim 11, wherein the elevated ring comprises a C-shaped ring provided with a passage so that, when supporting a wafer on the elevated ring, a volume enclosed by the first contact surface elevated ring, the second contact surface disk and the wafer is in communication with a surrounding environment.
- 13. The end effector of claim 2, wherein the first contact surface and the second contact surface are configured to peripherally support the susceptor plates and wafers, respectively.
- 14. The end effector of claim 13, wherein the first contact surface is spaced below the second contact surface.
- 15. The end effector of claim 14, wherein the first contact surface and the second contact surface conform to a single sloped annulus.
- 16. The end effector of claim 14, wherein the first contact surface and the second contact surface conform to stepped arcuate platforms.
- 17. The end effector of claim 16, wherein each of the first contact surface and the second contact surface is defined by discontiguous contact pads conforming to an annulus.
- 18. A system for transporting wafers and susceptors, comprising:
an end effector having a first contact surface at a first level and a second contact surface at a second level vertically spaced from the first level, the first contact surface configured to support a wafer; and a susceptor configured to be supported upon the second contact surface without touching the first contact surface, the susceptor sized and shaped to receive the wafer.
- 19. The system of claim 18, wherein the first contact surface is configured to support the wafer without contact between the wafer and the second contact surface.
- 20. The system of claim 18, wherein the first contact surface is vertically displaced above the second contact surface.
- 21. The system of claim 20, wherein the susceptor comprises a plate, which is configured with a recess having a size sufficient to accommodate the first contact surface therein while the susceptor plate is supported upon the second contact surface of the end effector, the recess having a depth greater than a vertical displacement between the first contact surface and the second contact surface.
- 22. The system of claim 19, wherein the first contact surface conforms to a first annular surface having an outer diameter slightly exceeding the outer diameter of the wafer and the second contact surface conforms to a second annular surface having an outer diameter slightly exceeding the outer diameter of the susceptor.
- 23. The system of claim 22, wherein the first contact surface is spaced below the second contact surface.
- 24. The system of claim 23, wherein the first contact surface and the second contact surface are both defined by a plurality of discontinuous sloped pads.
- 25. The system of claim 23, wherein
the first contact surface is defined by a plurality of pads conforming to an annular platform shape having a first outer diameter; and the second contact surface is defined by a plurality of pads conforming to a second annular platform having a second outer diameter larger than the first outer diameter.
- 26. A method for transporting a wafer and a susceptor, the method comprising:
providing an end effector with a first contact surface and a second contact surface; transporting the wafer upon the first contact surface; and transporting the susceptor upon the second contact surface without the susceptor touching the first contact surface.
- 27. The method of claim 26, further comprising transforming the wafer to a position supported upon the susceptor.
- 28. The method of claim 27, wherein transporting the susceptor comprises placing the susceptor at a transfer station and transporting the wafer comprises placing the wafer at the transfer station after transporting the susceptor.
- 29. The method of claim 26, further comprising drawing a vacuum through the end effector to secure the wafer to the first contact surface while transporting the wafer.
REFERENCE TO RELATED APPLICATIONS
[0001] This application claims the priority benefit under 35 U.S.C. §119(e) of U.S. provisional application No. 60/377,904, filed May 2, 2002. Additionally, this application claims the priority benefit under 35 U.S.C. §119(e) of U.S. provisional application No. 60/365,122, filed Mar. 15, 2002 and U.S. Provisional application No. 60/379,885, filed May 10, 2002.
Provisional Applications (3)
|
Number |
Date |
Country |
|
60377904 |
May 2002 |
US |
|
60365122 |
Mar 2002 |
US |
|
60379885 |
May 2002 |
US |