Claims
- 1. A microelectronic device comprising:
- a first silicon piece having an electronic device that has an electrical characteristic which varies with strain formed at a first surface thereof, said first piece being sufficiently thin to deflect in response to variations in ambient pressure sufficiently to provide a measurable variation in said electrical characteristic, access holes extending from a second surface of said first piece to said electronic device;
- electrical conductors extending from said electronic device outward through said access holes;
- a second silicon piece having a cavity formed at a first surface thereof;
- said first surfaces of said pieces facing each other with said device adjacent said cavity; and
- said pieces bonded together with borosilicate glass extending between said first surfaces except in the region of said device and said cavity.
Parent Case Info
This is a division of application Ser. No. 334,759 filed on Dec. 28, 1981, now U.S. Pat. No. 4,426,768.
US Referenced Citations (7)
Divisions (1)
|
Number |
Date |
Country |
Parent |
334759 |
Dec 1981 |
|