Pressure sensors

Industry

CPC
B81B2201/0264

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2201/00Specific applications of micro-electromechanical systems

Current Industry

B81B2201/0264Pressure sensors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Parasitic insensitive sampling in sensors
- Patent number 12,253,426
- Issue date Mar 18, 2025
- Murata Manufacturing Co., Ltd.
- Vishnu Srinivasan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package substrate, sensor module having the same, and sensor...
- Patent number 12,240,751
- Issue date Mar 4, 2025
- TDK Corporation
- Kazutoshi Tsuyutani
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated microfluidic system and method of fabrication
- Patent number 12,194,464
- Issue date Jan 14, 2025
- Corporation for National Research Initiatives
- Michael A. Huff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electromechanical transducer with suspended mass
- Patent number 12,195,324
- Issue date Jan 14, 2025
- Sonion Nederland B.V.
- Raymond Mogelin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices with support structures and associated production methods
- Patent number 12,195,325
- Issue date Jan 14, 2025
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electromechanical transducer with reduced size
- Patent number 12,195,329
- Issue date Jan 14, 2025
- Sonion Nederland B.V.
- Adrianus Maria Lafort
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic sensors with sensor die in package structure cavity
- Patent number 12,187,601
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Barry Jon Male
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor with integrated heater
- Patent number 12,180,067
- Issue date Dec 31, 2024
- Invensense, Inc.
- Pei-Wen Yen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package and method of producing the sensor package
- Patent number 12,180,066
- Issue date Dec 31, 2024
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component for a sensor device having a capacitor se...
- Patent number 12,163,851
- Issue date Dec 10, 2024
- Robert Bosch GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component for a sensor device or microphone device
- Patent number 12,151,936
- Issue date Nov 26, 2024
- Robert Bosch GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor as well as method for operating a mems sensor
- Patent number 12,145,840
- Issue date Nov 19, 2024
- Robert Bosch GmbH
- Arne Dannenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor with high stability
- Patent number 12,139,398
- Issue date Nov 12, 2024
- Invensense, Inc.
- Weng Shen Su
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure for CMOS-MEMS thin film encapsulation
- Patent number 12,134,555
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced light reflection package
- Patent number 12,133,049
- Issue date Oct 29, 2024
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for sensing a motion of a deflective surface
- Patent number 12,133,050
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Darragh Francis Corrigan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor and package assembly thereof
- Patent number 12,091,312
- Issue date Sep 17, 2024
- Robert Bosch GmbH
- Ken Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Barometric pressure sensor arrays for detecting presence and motion...
- Patent number 12,092,834
- Issue date Sep 17, 2024
- Sony Interactive Entertainment Inc.
- Dennis Castleman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical sensor device and corresponding production method
- Patent number 12,077,429
- Issue date Sep 3, 2024
- Robert Bosch GmbH
- Lars Tebje
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Analysis method of a device, performed through a MEMS sensor, and s...
- Patent number 12,054,386
- Issue date Aug 6, 2024
- STMicroelectronics S.r.l.
- Enrico Rosario Alessi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Detection device having a piezoresistive element having increased c...
- Patent number 12,055,450
- Issue date Aug 6, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Antoine Nowodzinski
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Load-lock gauge
- Patent number 12,055,452
- Issue date Aug 6, 2024
- MKS Instruments, Inc.
- Gerardo A. Brucker
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
On-chip integrated silicon carbide pressure and temperature sensors
- Patent number 12,044,585
- Issue date Jul 23, 2024
- United States Government Administrator of NASA
- Robert S. Okojie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a wafer connection
- Patent number 12,030,773
- Issue date Jul 9, 2024
- Robert Bosch GmbH
- Friedjof Heuck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing a sensor device and moulding support structure
- Patent number 12,024,418
- Issue date Jul 2, 2024
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor integrated device with electrical contacts between st...
- Patent number 12,024,422
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing electronic devices and corresponding electr...
- Patent number 12,017,910
- Issue date Jun 25, 2024
- STMicroelectronics (Malta) Ltd.
- Kevin Formosa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Light-based tactile sensing with directional sensitivity
- Patent number 12,018,990
- Issue date Jun 25, 2024
- The Regents of the University of Michigan
- Pei-Cheng Ku
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress isolated device package and method of manufacture
- Patent number 12,012,328
- Issue date Jun 18, 2024
- NXP USA, INC.
- Chad Dawson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor including a microelectromechanical transducer and r...
- Patent number 12,006,207
- Issue date Jun 11, 2024
- STMicroelectronics S.r.l.
- Mario Giuseppe Pavone
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE SENSOR AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC D...
- Publication number 20250085175
- Publication date Mar 13, 2025
- Beijing BOE Technology Development Co., Ltd.
- Kui LIANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR WITH INTEGRATED FLUID CAVITY
- Publication number 20250085179
- Publication date Mar 13, 2025
- Apple Inc.
- Michael J. GLICKMAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH RELIABILITY SENSOR
- Publication number 20250074765
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Daiki Komatsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENVIRONMENTAL SENSOR AND METHOD FOR OPERATING AN ENVIRONMENTAL SENSOR
- Publication number 20250066186
- Publication date Feb 27, 2025
- ROBERT BOSCH GmbH
- David Slogsnat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE FOR SENSING A MOTION OF A DEFLECTIVE SURFACE
- Publication number 20250016509
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Darragh Francis Corrigan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR
- Publication number 20250002329
- Publication date Jan 2, 2025
- Rohm Co., Ltd.
- Masahiro SAKURAGI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SENSOR DEVICE WITH WAFER-LEVEL INTEGRATION O...
- Publication number 20250002332
- Publication date Jan 2, 2025
- STMicroelectronics International N.V.
- Giorgio ALLEGATO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL DEVICE, MICROELECTROMECHANICAL PRESSURE SENS...
- Publication number 20240425351
- Publication date Dec 26, 2024
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE
- Publication number 20240425363
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Bernhard Rieder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Capacitive MEMS Sensing Diagnostic Mode
- Publication number 20240426689
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Philipp Greiner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE
- Publication number 20240400377
- Publication date Dec 5, 2024
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF
- Publication number 20240391761
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Lan CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MEMS PRESSURE TRANSDUCER AND RELATED MANUFACTURING PROCESS
- Publication number 20240391760
- Publication date Nov 28, 2024
- STMicroelectronics International N.V.
- Silvia NICOLI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT
- Publication number 20240383745
- Publication date Nov 21, 2024
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME, AND SENSOR
- Publication number 20240359972
- Publication date Oct 31, 2024
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Lihui WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL COMPONENT
- Publication number 20240343554
- Publication date Oct 17, 2024
- ROBERT BOSCH GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL ACOUSTIC COMPONENT
- Publication number 20240343552
- Publication date Oct 17, 2024
- ROBERT BOSCH GmbH
- Christoph SCHELLING
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE
- Publication number 20240343558
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Petteri KILPINEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL DIAPHRAGM SYSTEM
- Publication number 20240343557
- Publication date Oct 17, 2024
- ROBERT BOSCH GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DIES EMBEDDED IN GLASS CORES
- Publication number 20240327201
- Publication date Oct 3, 2024
- Intel Corporation
- Numair Ahmed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSING MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20240327205
- Publication date Oct 3, 2024
- Coretronic MEMS Corporation
- Mei-Ling Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240317580
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Fumiya KUROKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240317578
- Publication date Sep 26, 2024
- Murata Manufacturing Co., Ltd.
- Fumiya KUROKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIGHT-BASED TACTILE SENSING WITH DIRECTIONAL SENSITIVITY
- Publication number 20240310226
- Publication date Sep 19, 2024
- The Regents of the University of Michigan
- Pei-Cheng Ku
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Die and Method for Attaching a Semiconductor Die to a...
- Publication number 20240312944
- Publication date Sep 19, 2024
- TE Connectivity Solutions GMBH
- Kaspar Jenni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH TEMPERATURE PIEZO-RESISTIVE PRESSURE SENSOR AND PACKAGING ASSE...
- Publication number 20240302237
- Publication date Sep 12, 2024
- Rosemount Aerospace Inc.
- Jun Zheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LENS AND EYEWEAR
- Publication number 20240286891
- Publication date Aug 29, 2024
- HS Vision Ltd.
- Alexander MacDonald
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR WAFER DIE ASSEMBLY BONDING
- Publication number 20240253974
- Publication date Aug 1, 2024
- Rosemount Aerospace Inc.
- Roger Backman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Multi-Parametric Machine Olfaction
- Publication number 20240255483
- Publication date Aug 1, 2024
- Brown University
- Jacob K. Rosenstein
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSOR STRUCTURE AND PRESSURE SENSOR DEVICE
- Publication number 20240246811
- Publication date Jul 25, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke NIWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Pressure sensors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Parasitic insensitive sampling in sensors

Sensor package substrate, sensor module having the same, and sensor...

Integrated microfluidic system and method of fabrication

Micro-electromechanical transducer with suspended mass

MEMS devices with support structures and associated production methods

Micro-electromechanical transducer with reduced size

Electronic sensors with sensor die in package structure cavity

Sensor with integrated heater

Sensor package and method of producing the sensor package

Micromechanical component for a sensor device having a capacitor se...

Micromechanical component for a sensor device or microphone device

MEMS sensor as well as method for operating a mems sensor

Pressure sensor with high stability

Method and structure for CMOS-MEMS thin film encapsulation

Reduced light reflection package

Device for sensing a motion of a deflective surface

Sensor and package assembly thereof

Barometric pressure sensor arrays for detecting presence and motion...

Micromechanical sensor device and corresponding production method

Analysis method of a device, performed through a MEMS sensor, and s...

Detection device having a piezoresistive element having increased c...

Load-lock gauge

On-chip integrated silicon carbide pressure and temperature sensors

Method for producing a wafer connection

Method of manufacturing a sensor device and moulding support structure

Semiconductor integrated device with electrical contacts between st...

Method of manufacturing electronic devices and corresponding electr...

Light-based tactile sensing with directional sensitivity

Stress isolated device package and method of manufacture

Pressure sensor including a microelectromechanical transducer and r...

Patents Applicationslast 30 patents

PRESSURE SENSOR AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC D...

PRESSURE SENSOR WITH INTEGRATED FLUID CAVITY

HIGH RELIABILITY SENSOR

ENVIRONMENTAL SENSOR AND METHOD FOR OPERATING AN ENVIRONMENTAL SENSOR

DEVICE FOR SENSING A MOTION OF A DEFLECTIVE SURFACE

MEMS SENSOR

MICROELECTROMECHANICAL SENSOR DEVICE WITH WAFER-LEVEL INTEGRATION O...

MICROELECTROMECHANICAL DEVICE, MICROELECTROMECHANICAL PRESSURE SENS...

COMBINED SOUND TRANSDUCER AND PRESSURE SENSOR PACKAGE

Capacitive MEMS Sensing Diagnostic Mode

MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE

SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF

CAPACITIVE MEMS PRESSURE TRANSDUCER AND RELATED MANUFACTURING PROCESS

MICROMECHANICAL COMPONENT

PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME, AND SENSOR

MICROELECTROMECHANICAL COMPONENT

MICROELECTROMECHANICAL ACOUSTIC COMPONENT

DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE

MICROMECHANICAL DIAPHRAGM SYSTEM

MEMS DIES EMBEDDED IN GLASS CORES

PRESSURE SENSING MODULE AND MANUFACTURING METHOD THEREOF

MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE

MEMS DEVICE AND MANUFACTURING METHOD OF MEMS DEVICE

LIGHT-BASED TACTILE SENSING WITH DIRECTIONAL SENSITIVITY

Semiconductor Die and Method for Attaching a Semiconductor Die to a...

HIGH TEMPERATURE PIEZO-RESISTIVE PRESSURE SENSOR AND PACKAGING ASSE...

LENS AND EYEWEAR

SYSTEMS AND METHODS FOR WAFER DIE ASSEMBLY BONDING

Multi-Parametric Machine Olfaction

PRESSURE SENSOR STRUCTURE AND PRESSURE SENSOR DEVICE