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Interconnection or interfacing through or under capping or via rear of substrate in microsensors
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CPC
G01B2210/64
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
G
PHYSICS
G01
Measuring instruments
G01B
MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
G01B2210/00
Aspects not specifically covered by any group under G01B
Current Industry
G01B2210/64
Interconnection or interfacing through or under capping or via rear of substrate in microsensors
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