Claims
- 1. A process of machining a bandpass filter microstructure having a milled depth to milled horizontal cut ratio of greater than about 10 within a target substrate comprising:
- placing a target substrate within an ultrahigh vacuum environment;
- producing a computer data file adapted for operation of a computer-controlled focused ion beam so as to form a milled bandpass filter microstructure in said target substrate; and,
- exposing said target substrate to said computer-controlled focused ion beam, said computer-controlled focused ion beam controlled by software utilizing said computer data file whereby a milled bandpass filter microstructure having a milled depth to milled horizontal cut ratio of greater than about 10 is formed in said target substrate.
- 2. A process of machining a data storage medium microstructure having a milled depth to milled horizontal cut ratio of greater than about 10 within a target substrate comprising:
- placing a target substrate within an ultrahigh vacuum environment;
- producing a computer data file adapted for operation of a computer-controlled focused ion beam so as to form a milled data storage medium microstructure in said target substrate; and,
- exposing said target substrate to said computer-controlled focused ion beam, said computer-controlled focused ion beam controlled by software utilizing said computer data file whereby a milled data storage medium microstructure having a milled depth to milled horizontal cut ratio of greater than about 10 is formed in said target substrate.
Government Interests
This invention is the result of a contract with the Department of Energy (Contract No. W-7405-ENG-36).
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
5401972 |
Talbot et al. |
Mar 1995 |
|
5402410 |
Yoshimura et al. |
Mar 1995 |
|
5453594 |
Konecny |
Sep 1995 |
|