Patent Application
20210307206
The technical field relates to a vacuum heat transfer element, and more particularly to an improved vapor chamber structure.
Since the computing power of various electronic products keeps improving, and thermal dissipation becomes an issue, therefore vapor chambers (also known as flat heat pipes) are indispensable heat dissipating components.
However, electronic products tend to be designed with a light and thin design, so that the vapor chamber (or flat heat pipe) has to be thin. Therefore, the capillary effect of a capillary tissue in the vapor chamber will be affected by the requirement for the thin design. If a thin material used for the capillary tissue cannot be found, it will be difficult to meet the requirement for the thin design and the vapor chamber (or flat heat pipe) will not be suitable for the thin design of the electronic products.
In view of the aforementioned drawback of the conventional vapor chamber, the discloser of this disclosure based on years of experience in the related industry to conduct extensive research and experiment, and finally provided a feasible solution to overcome the drawbacks of the prior art.
Therefore, it is a primary object of this disclosure to provide a vapor chamber structure with a material layer coated onto an inner surface of a housing of the vapor chamber and provided for improving the structural rigidity of the housing, so that such structure can be applicable for a thin vapor chamber.
To achieve the aforementioned and other objectives, this disclosure provides a vapor chamber structure, comprising: a thin-sheet housing, with an interior in a substantially hollow form; and a capillary layer, installed in the thin-sheet housing; wherein, the thin-sheet housing has the hollow form formed therein by an etching method, and a plurality of first support portions is formed therein, and a first material layer and a second material layer are coated onto two inner walls of the thin-sheet housing respectively, and the capillary layer is attached onto the first material layer closely.
The technical contents of this disclosure will become apparent with the detailed description of preferred embodiments accompanied with the illustration of related drawings as follows. It is intended that the embodiments and drawings disclosed herein are to be considered illustrative rather than restrictive.
With reference to
The hollow interior of the thin-sheet housing 1 is formed by covering a first plate 10 and a second plate 11 with each other. In the first embodiment of this disclosure, the first plate 10 has a first thin-sheet portion 100, and a first sealing edge 101 formed continuously around the periphery of the first thin-sheet portion 100, and a first recessed space 102 is formed and enclosed by the first thin-sheet portion 100 and the first sealing edge 101, and then the second plate 11 is covered onto the first sealing edge 101 to seal the first recessed space 102, so as to form the thin-sheet housing 1. In addition, the first recessed space 102 is formed by recessing a surface of the first thin-sheet portion 100 inwardly by an etching method, and the non-etched portion of the first recessed space 102 is reserved for forming a plurality of first support portions 103 provided the second plate 11 to seal the first recessed space 102 and stacked onto the first plate 10, so that the first support portions 103 can abut against the inner surface of the second plate 11 to serve as a support structure.
The capillary layer 2 is disposed in the thin-sheet housing 1. In the first embodiment of this disclosure, the capillary layer 2 is disposed in the first recessed space 102, and the capillary layer 2 is formed by braiding a plurality of metal filaments, and a plurality of positioning holes 20 configured to be corresponsive to the first support portions 103 may be formed on the capillary layer 2 for fixing the capillary layer 2 into the first recessed space 102 of the first plate 10.
With reference to
By the aforementioned structural assembly, the improved vapor chamber structure of this disclosure is achieved.
With reference to
In summation of the description above, this disclosure definitely can achieve the expected objectives and overcome the drawbacks of the prior art, and the disclosure complies with the patent application requirements, and thus is duly filed for patent application.
While this disclosure has been described by means of specific embodiments, numerous modifications and variations could be made thereto by those skilled in the art without departing from the scope and spirit of this disclosure set forth in the claims.
