This invention relates to a roof structure, especially a vehicle overhead system including a headliner with an integral wire harness, a method for manufacturing this roof structure and a system comprising such a roof structure, a connector and a conductive pad.
Many vehicle overhead systems include electrical wiring behind the vehicle headliner to provide power to and/or communication with various controls, such as, for example, garage door opener or compass, and/or features such as, for example, a dome light. With conventional overhead systems, standard wires such as, for example, stranded, insulated copper or other metallic wires are installed between the headliner and the vehicle roof.
Overhead systems are currently installed in motor vehicles in a series of steps at a plurality of stations on a vehicle assembly line. Individual overhead system components that require electricity as a power source or to provide a signal are individually connected to the vehicle body electrical system at the time of assembly. A wire harness, including all of the wiring necessary for the overhead system components, is attached to the back of the headliner with, for example, tape or hot melt glue. The various wires forming the wire harness are typically located between the headliner and the roof of the vehicle. When the wires are located between the headliner and the roof, they sometimes contact the roof structural supports. This contact between the wire and the roof structural supports may result in the wire being pinched, cut, or having the insulation rubbed off to cause a short circuit as the wire contacts the vehicle body. The insulation and/or other wrappings required for traditional wire harnesses also add significantly to headliner weight.
The invention provides, in one aspect, an interior panel for use in a vehicle that includes a plurality of electrical devices and a vehicle component frame. The interior panel includes printed electrical connection means for connecting the electrical devices in the vehicle and a substrate layer that has an inner surface directed towards the vehicle component frame. The electrical connection means are printed on the inner surface of the substrate layer using an electrically conductive ink.
The invention provides, in another aspect, a method for manufacturing an interior panel of a vehicle that includes a plurality of electrical devices. The method includes printing electrical connection means on the interior panel using an electrically conductive ink and piercing the interior panel with an electrical connector to connect one of the electrical devices to the electrical connection means.
The invention provides, in yet another aspect, a system including an electrical device and an interior panel with printed electrical connection means and a printed conductive pad. An electrical connector pierces through the interior panel to connect the electrical device with the conductive pad, and the electrical connection means are printed on the interior panel using an electrically conductive ink.
The invention provides, in a further aspect, an interior panel for use in a vehicle that includes a plurality of electrical devices and a vehicle component frame. The interior panel includes a printed wire harness for connecting the electrical devices in the vehicle and a substrate layer having an inner surface directed towards the vehicle component frame. The wire harness is printed on the inner surface of the substrate layer using an electrically conductive ink.
Other aspects of the invention will become apparent by consideration of the detailed description and accompanying drawings.
Various exemplary embodiments of the systems and methods according to the present disclosure will be described in detail, with reference to the following figures, wherein:
In various exemplary embodiments, this invention relates to a overhead systems with a wire harness for electrically connecting to components integrated into the headliner. For example, the wire harness may be formed by printing the wiring or circuitry on part of the headliner core using a conductive ink and methods for making the same. The wiring or circuitry may be printed either before or after the overhead system is fully assembled. The wiring or circuitry may be printed in various parts of the overhead system, including, for example, on a scrim layer, on a substrate layer, or on a film attached to overhead systems. The overhead systems of this invention are produced at a lower cost, require less space, and weigh less than conventional overhead systems (e.g., headliners and wire harnesses) due to the reduced cost, size, and weight of the wire harness.
In various exemplary embodiments, the wire harness is incorporated into a film layer that is attached to or otherwise incorporated into the headliner. For example, the wire harness could be formed from flex circuits attached to an overhead systems component.
In various exemplary embodiments, the wire harness 210 may be located on various surfaces within a headliner 200. In an exemplary embodiment, shown on
It should be noted that references to relative positions (e.g., “top” and “bottom”) in this description are merely used to identify various elements as are oriented in the figures. It should be recognized that the orientation of particular components may vary greatly depending on the application in which they are used.
It should be understood that the drawings are not necessarily to scale. In certain instances, details that are not necessary to the understanding of the invention or render other details difficult to perceive may have been omitted. It should be understood, of course, that the invention is not necessarily limited to the particular embodiments illustrated herein.
It should be appreciated that the construction and arrangement of the wire harness, as shown in the various exemplary embodiments, is illustrative only. While the wire harness, according to this invention, has been described in conjunction with the exemplary embodiments outlined above, various alternatives, modifications, variations, improvements, and/or substantial equivalents, whether known or that are or may be presently unforeseen, may become apparent. Accordingly, the exemplary embodiments of the console according to this invention, as set forth above, are intended to be illustrative, not limiting. Various changes may be made without departing from the spirit and scope of the invention. Therefore, the description provided above is intended to embrace all known or later-developed alternatives, modifications variations, improvements, and/or substantial equivalents.
Various features and advantages of the invention are set forth in the following claims.
This application is a continuation of co-pending U.S. patent application Ser. No. 13/143,377 filed on Sep. 21, 2011, which is a national stage entry under 35 U.S.C. §371 of International Patent Application No. PCT/US2010/020090 filed Jan. 5, 2010, which claims priority to U.S. Provisional Patent Application No. 61/142,769 filed on Jan. 6, 2009, the entire contents of all of which are incorporated herein by reference.
Number | Name | Date | Kind |
---|---|---|---|
4764848 | Simpson | Aug 1988 | A |
4800648 | Nakayama et al. | Jan 1989 | A |
4869670 | Ueda et al. | Sep 1989 | A |
5357408 | Lecznar et al. | Oct 1994 | A |
5484186 | Van Order et al. | Jan 1996 | A |
5825096 | Morimoto et al. | Oct 1998 | A |
5887939 | Yamaguchi et al. | Mar 1999 | A |
6120091 | Reich et al. | Sep 2000 | A |
6126228 | Davis et al. | Oct 2000 | A |
6273499 | Guyon | Aug 2001 | B1 |
6317548 | Rockwell et al. | Nov 2001 | B1 |
6513959 | Serizawa et al. | Feb 2003 | B2 |
6557925 | Odashima et al. | May 2003 | B2 |
6582013 | Inoue et al. | Jun 2003 | B1 |
6612640 | Hock et al. | Sep 2003 | B2 |
6652021 | Dykman et al. | Nov 2003 | B1 |
6824185 | Tiesler et al. | Nov 2004 | B2 |
6884084 | Shields | Apr 2005 | B2 |
6886956 | Parker et al. | May 2005 | B2 |
6957839 | Tiesler et al. | Oct 2005 | B1 |
7014259 | Heholt | Mar 2006 | B2 |
7052068 | Sturt et al. | May 2006 | B2 |
7186136 | Tiesler et al. | Mar 2007 | B2 |
8733828 | VanHouten et al. | May 2014 | B2 |
20040222673 | Brown | Nov 2004 | A1 |
20060021861 | Schmidt et al. | Feb 2006 | A1 |
20060061145 | Strebe et al. | Mar 2006 | A1 |
20080083720 | Gentile et al. | Apr 2008 | A1 |
20080093890 | Mehling | Apr 2008 | A1 |
20120001457 | VanHouten et al. | Jan 2012 | A1 |
Number | Date | Country |
---|---|---|
1413077 | Apr 2003 | CN |
0999950 | May 2004 | EP |
01-307180 | Dec 1989 | JP |
2002-002378 | Jan 2002 | JP |
2002056738 | Feb 2002 | JP |
2002-225645 | Aug 2002 | JP |
2004-184741 | Jul 2004 | JP |
2005-039083 | Feb 2005 | JP |
2007-173342 | Jul 2007 | JP |
2007-292678 | Nov 2007 | JP |
2008-531361 | Aug 2008 | JP |
2009-527419 | Jul 2009 | JP |
9220489 | Nov 1992 | WO |
2006-091031 | Aug 2006 | WO |
2007-098325 | Aug 2007 | WO |
2010-080750 | Jul 2010 | WO |
Entry |
---|
International Search Report and Written Opinion dated Feb. 17, 2010, 14 pages. |
International Preliminary Report on Patentability dated Jul. 21, 2011, 10 pages. |
CN Office Action Mailed Sep. 25, 2015. |
Number | Date | Country | |
---|---|---|---|
20140226289 A1 | Aug 2014 | US |
Number | Date | Country | |
---|---|---|---|
61142769 | Jan 2009 | US |
Number | Date | Country | |
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Parent | 13143377 | US | |
Child | 14256202 | US |