Patent Application
20220326090
The present invention relates to integrated circuits. More specifically, embodiments of the present invention provide methods and systems for temperature calibration and determination of an integrated circuit using a one-point calibration technique, where temperature is calibrated by a single temperature measurement and temperature determination is performed using known electrical characteristics of the integrated circuit.
Integrated circuits have proliferated through the years. As feature sizes become smaller, certain types of devices have become larger, leading to temperature related problems. That is, a large networking or processing device consumes a large amount of power, which is often dissipated as thermal energy such as heat. Heat is problematic and is desirably to be controlled and monitored. Unfortunately, conventional devices often lack suitable thermal sensing devices. That is, conventional temperature sensing devices are non-existent in many integrated circuit devices. At best, conventional sensing devices often use a diode device to monitor current information to extract temperature information from other non-integrated integrated circuit devices. The diode device is configured with an analog to digital convert to transmit the temperature information. The converter is often expensive, large, and difficulty to scale and manufacture in an efficient manner. Other limitations include difficulty in calibration, monitoring, and often require multi-point calibration, which leads to additional costs during the manufacture of the integrated circuit.
From the above, it is seen that techniques for improving temperature sensing and monitoring integrated circuits are highly desirable.
The present invention relates to integrated circuits. More specifically, embodiments of the present invention provide methods and systems for determining temperatures of an integrated circuit using a one-point calibration technique, where temperature is determined by a single temperature measurement and calculation using known electrical characteristics of the integrated circuit.
Benefits are achieved over conventional techniques. Among other things, temperature calibration and determination can be performed by using measurements of corresponding electrical characteristics, such as voltage, current, delay, and/or others. Measuring electrical characteristics is usually faster and easier than measuring temperature. In addition, by using a single-point calibration method, the amount of time (which translates to manufacturing costs) of calibrating the temperature sensor is greatly reduced. It is to be appreciated that embodiments of the present invention are compatible with existing circuits and devices.
The present invention achieves these benefits and others in the context of known memory technology. However, a further understanding of the nature and advantages of the present invention may be realized by reference to the latter portions of the specification and attached drawings.
The following diagrams are merely examples, which should not unduly limit the scope of the claims herein. One of ordinary skill in the art would recognize many other variations, modifications, and alternatives. It is also understood that the examples and embodiments described herein are for illustrative purposes only and that various modifications or changes in light thereof will be suggested to persons skilled in the art and are to be included within the spirit and purview of this process and scope of the appended claims.
The present invention relates to integrated circuits. More specifically, embodiments of the present invention provide methods and systems for determining temperatures of an integrated circuit using a one-point calibration technique, where temperature is determined by a single temperature measurement and calculation using known electrical characteristics of the integrated circuit.
An integrated circuits such as SerDes typically have multiple locations that may heat up to a temperature greater than the optimal operating temperature. In various embodiments, the present invention provides sensing techniques for measuring these locations.
It is to be appreciated that the VT core 101 can be integrated to the integrated circuit. In addition to the SerDes device as shown, the VT core 101 can be integrated with other types of devices, such as SerDes device, a DDR register device, a DSP device, a controller device, a microcontroller device, an ASIC device, or others. For example, an integrated communication device (e.g., SerDes device) is configured on a silicon bearing substrate. The device has a transmitter module and a receiver module, both of which are also configured on the silicon bearing substrate. Additionally, the device comprises a phase lock loop module that is also configured on the silicon bearing substrate. A digital logic core is configured on the same silicon bearing substrate as components of communication device. A voltage and temperature sensing module (e.g., the VT core that connects to the sensors) is configured on the substrate as well. An example of the voltage and temperature sensing module is illustrated in
In various embodiments, the VT core 200 and the sensors shown in
The VT core 200 comprises, among other components, a clock device, which is not shown in
The VT core 200 also includes a common load feedback (CMFB) circuit 211. The CMFB circuit 211 provides the common feedback voltage Vcmfb, which is coupled to the first delay core 203 and the second delay core 204. The CMFB circuit 211 is coupled to a voltage extractor 212. The voltage extractor 212 is also coupled to the outputs of the first delay core 203 and the second delay core 204. For example, the voltage extractor 212 comprises resistors configured in series. Depending on the implementation, the voltage extractor 212 can have different load configurations as well.
A common mode generator circuit 208 is coupled to the common load feedback circuit 211. The common mode generator circuit is configured to operate in a voltage measurement mode or a temperature measurement mode. A load equalizer device 205 is coupled to the second delay core 204 output and the common load voltage extractor 212 as shown.
A comparator device 202 is coupled to the first delay core 203 output and the common load voltage extractor 212. The comparator device 202 is configured to convert a first waveform 210 from the common mode voltage extractor to a second waveform. As shown at the bottom portion of
At step 303, the current information is received by the reference generator. The reference generator is configured to generate a signal proportional to the current information using the reference generator, at step 304. For example, the signal is a function of a reference voltage, current information from the sensing site, and known resistance (or impedance) value of one or more electrical components of the VT core. At step 305, the generated signal is transferred to a common mode feedback circuit, which is coupled to a first delay core and a second delay core. For example, the connections between the common feedback circuit and the delay cores are illustrated in
The PWM signal can be processed and used to provide digital information that represents temperature and/or voltage information embedded in the current information. In a specific embodiment, the pulse width modulated signal is received, and the pulse width modulated signal is used in a counter device to output digital information representative of the current information. As described above, the current information is associated with a temperature or a voltage of the remote sensing site. In an implementation, the pulse width modulated signal is received and processed by a low pass filter device.
In various embodiments, a calibration process is used to provide temperature calibration and measurement. During the calibration mode (which may be necessary as a one-time setup), the current reading from the sensor is calibrated to temperature reading. Running the constant current source at known current level and obtain a current reading from the sensor at a known temperature, the relationship between current reading and the temperature reading is determined. For example, a ratio (e.g., or referred to as “gain”) between the current (or other voltage, delay) reading and the temperature level is determined and stored for later measurements. When measuring the temperature reading, the ratio is multiplied with a temperature difference from a reference temperature. For example, the following formula is used:
Temp=Tc+Gain*{Delay2−Delay1}
Voltage calibration and measurement processes are performed similarly as the temperature calibration. A ratio (or “gain”) between current reading and the voltage level is determined and stored for later measurements. When measuring the voltage reading, the ratio is multiplied with a voltage difference from a reference voltage. For example, the following formula is used:
Voltage=1V+Gain*{Delay2−Delay1}
It is to be appreciated that the arrangement and implementation of temperature sensors illustrated in
As explained above, temperature sensors are important in ensuring proper operation conditions for controls. For example, the integrated circuit device shown in
For temperature sensor readings to be useful and reliable, temperature sensors are calibrated before use. According to conventional techniques, calibrating temperature sensors requires temperature measurements at two or more temperatures. Unfortunately, calibration at two or more temperatures is a time consuming process. To measure an integrated circuit device or a chip at two temperatures, it is necessary to change the temperature of the subject (i.e., the integrated circuit) of temperature measurement in order to measure it at a second temperature. It often takes a lot of time to change the temperature (e.g., controlled heating up or cooling down) of a subject device, thereby increasing the manufacturing time, which translates to lower manufacturing throughput and higher cost, as manufacturing time is a considerable portion of the integrated circuit chip production cost.
According to embodiments of the present invention, temperature sensors can be calibrated with one temperature measurement, thereby reducing manufacturing costs. During the temperature determination process, values based on electrical characteristics are used to calibrate temperature sensor. More specifically, embodiments of the present invention use a value, current proportional to absolute temperature (IPTAT), to calibrate temperature at a single point. Among other things, the IPTAT value can be changed using one or more control switches. For example, IPTAT is sometimes referred to as Inversely Proportional to Absolute Temperature. In a specific embodiment, a control module is use to cause changes in IPTAT value. It is to be appreciated that the IPTAT value can be referred to in other terms as well. In a specific embodiment, IPTAT is a physical quantity whose value is equal to k*T*ln(M)/R, where “k” is Boltzmann's constant, “T” is absolute temperature in Kelvin, “ln” is natural logarithm, “M” is a design constant, and “R” is the resistance value of a resistor. For example, the design constant M is derived based on the electrical and physical characteristics of the underlying integrated circuit and/or the temperature sensor.
It is to be appreciated that IPTAT here is used as a reference value, which is used for calibration purpose. For temperature calibration, other reference values, or code reflecting the values, can be used as well. In certain applications, it might be impractical to measure the IPTAT value. And in these applications, code values related to the temperature sensor calibration can be used. Depending on the application, code values can be more robust than the IPTAT, which is related to current measurement. For example, to calibrate the temperature sensor, one way is to change the IPTAT value by using the control switch to change one or more parameters of the sensor and/or the underlying device, at temperature T0.
For example, a new IPTAT value, IPTAT1, corresponds to a new temperature (or a new temperature equivalent). Similarly, a new code value, Code1, can also be used to correspond to a new temperature (or new temperature equivalent), where a code value is used to reflect one or more characteristics of the temperature sensor and/or underlying device.
The temperature sensor 401, as the name suggests, is configured to take temperature readings as needed. The processor 403 is configure to process the temperature sensor readings, perform temperature calibration, and generate and use a line equation for temperature determination. As described below, temperature reading can be determined by using the line equation and value(s) associated with electrical characteristics (e.g., voltage, current, delay, and/or others). The control module 402 is configured to switch one or more operating parameters associated with the temperature sensor. In a specific embodiment, the control module 402 is capable of causing changes in IPTAT value. For example, the control module 402 is connected to a IPTAT current generator. It to be appreciated that temperature sensor 401, a processor 403, and the control module 402 can be integrated as a single unit (e.g., a part of an integrated temperature sensor) and/or implemented using various types of hardware module. Additional modules may be used as well. For example, the temperature sensor system in
For the purpose of temperature sensor calibration, an initial IPTAT value, IPTAT0 is to be determined. For IPTAT0 value determination, calibration temperature T0 and value(s) associated with electrical characteristics are needed.
At step 501, a value Q0 is measure at the calibration temperature T0. For example, the calibration temperature can be near room temperature, thereby allowing the integrated circuit to quickly reach T0 for quick measurement. For example, to determine IPTAT0, voltage, current, and/or delay values corresponding to the calibration temperature T0 are measured as well. For example, measured value of electrical characteristics (e.g., voltage, current, and/or delay) is denoted as Q0.
At step 502, the IPTAT0 is determined at the calibration temperature T0. As explained above, the IPTAT0 value can be calculated from known “M” and “R” value, and one or more Q0 value(s). It is to be appreciated that the IPTAT value determination may involve using other formulae and/or variables as well.
For calibration to work, a second IPTAT value, IPTAT1, is to be determined. As explained below, multiple (e.g., 2) IPTAT values are needed to generate a linear equation that can be used for later temperature determination. To cause the IPTAT value to change from IPTAT0 to IPTAT1, control switches can be used to change one or more electrical characteristics (e.g., voltage, current, delay, and/or others). At step 503, the IPTAT value is changed from IPTAT0 to IPTAT1, and corresponding current is changed accordingly. As mentioned above, a control module may be used to cause changes in the IPTAT value. The change from IPTAT0 to IPTAT0 can be made quickly and within a time period the temperature is still at (or very close to) temperature T0. For the purpose of calibration, an equivalent temperature T1 corresponding to the IPTAT1 is determined.
At step 504, a new temperature T1 is determined. As explained above, the actual temperature corresponding to IPTAT1 and current is substantially the same as T0. However, for the purpose of temperature calibration, current value and IPTAT1 correspond to the new temperature T1. Even though the actual or operating temperature has not changed, temperature sensor is operating at a new “equivalent” temperature because of the change of IPTAT. Similarly, if code value is used instead of IPTAT, the equivalent temperature calculation is performed using the code value.
The new“equivalent” temperature is calculated as below:
T
1
=T
0*(IPTAT1/IPTAT0) (Equation 1)
And in case code value is used:
T
1
=T
0*(Code1/Code0) (Equation 1A)
Corresponding to the change of IPTAT from IPTAT0 to IPTAT1, the value associated with the one or more electrical characteristics Q1 is measure. For example, Q1 can be voltage, current, delay, or other value that corresponds to T1.
At step 506, a gain value “G” of the temperature sensor is determined. More specifically, the gain (“G) of the temperature sensor is calculated using the equation below:
G=(Q1−Q0)/(T1−T0) (Equation 2)
At step 507, a line equation is provided. Among other things, the line equation can used to provide temperature reading by reading one or more values corresponding to electrical characteristics. In a specific embodiment, the line equation of the temperature sensor is calculated as:
Q
(T)
=G*(T−T0)+Q0 (Equation 3)
For example, to obtain a temperature measurement Tm, Equation 3 and the electrical characteristics can be used. A reading of an electrical characteristics (e.g., voltage, current, delay, and/or others), or Qm, that corresponds to actual temperature is determined. The following equation is used to obtain the temperature measurement Tm:
T
m
={Q(Tm)+G*T0−Q0}/G. (Equation 4)
It is to be appreciated that temperature can quickly be re-calibrated and determined using Equation 4, as electrical characteristics are typically easier to determine than temperature reading. For example, the method illustrated in
To provide an example, temperature calibration is performed using, among other things, the delay characteristic at calibration temperature Tc:
At a second IPTAT value, or IPTAT(Tc+ΔT2) is:
Or changing the calibration code “m” times so that:
The temperature change (equivalent) based on “delay2” can by determined by:
Similarly, a third IPTAT value, IPTAT(Tc+ΔT3) is:
Or changing the calibration code “n” times so that:
The temperature change (equivalent) based on “delay3” can by determined by:
And therefore, the temperature change relative to the delay value is:
It is to be appreciated that the use of gain factor and linear equation to obtain temperature reading is an interpolation process, who error is characterized by Equation 5 below:
Error=Delay(T)−{Gainlpt×(T−Tc)+Delay(T)|T=Tc} (Equation 5)
As explained above, one-point temperature calibration process can more efficient and cost-effective compared to conventional two-point calibration processes. Tables below are provided to compare the temperature determined by one-point calibration process according to an implementation of the present invention to temperature determined using conventional two-point calibration technique.
Table 1 below shows junction temperature calculation from chamber temperature and power consumption
Junction Temperature Calculation from Chamber Temperature and Power Consumption
As shown in Table 1, the ambient chamber temperature is adjusted, and power is measure. Then the junction temperature is calculated. For example, the equivalent temperature is calculated using the techniques according to embodiments of the present invention.
In comparison, conventional two-point temperature calibration requires a change in junction temperature, as illustrated in Table 2 below:
In a conventional two-point calibration process, junction temperature is changed and the corresponding delay is measured. By using the relationship between the delay value and the junction temperature, gain and offset values for the system can be determined for the two-point calibration method. The gain and offset values, once determined, provide a basis for the line equation associated with the temperature sensor system. The line equation can then be used to determine junction temperature value.
Table 3 illustrates a process of using code value to perform one-point temperature calibration:
As illustrated in Table 3, calibration code value is changed. Based on the change in calibration code value, the equivalent temperature value is determined. The delay value (measure in nanosecond) is also measured. Using the calibration code value, equivalent temperature, and delay value, gain and offset value for the one point calibration equation can be determined.
Table 4 below illustrates using the one-point calibration equation determined from Table 3 to determine junction temperature:
For example, the gain value and offset value determined from Table 3 is used to provide a line equation, which is then used to provide junction temperature information based on other known values. It is to be appreciated that while the junction temperature determined using the linear equation determined using an one-point calibration method is slightly different from the actual temperature, the amount of error is relatively small and acceptable for most of the application where a temperature reading is needed.
It is also to be noted that the amount of error from an exemplary one-point calibration method is comparable to the amount of error from a conventional two-point calibration method, as illustrated in Table 5 below:
While the above is a full description of the specific embodiments, various modifications, alternative constructions and equivalents may be used. Therefore, the above description and illustrations should not be taken as limiting the scope of the present invention which is defined by the appended claims.
The present application is a continuation of U.S. patent application Ser. No. 16/576,639, filed Sep. 19, 2019, which is a continuation of U.S. patent application Ser. No. 15/409,828, filed Jan. 19, 2017, now issued as U.S. Pat. No. 10,458,856 on Oct. 29, 2019, which is a continuation of U.S. patent application Ser. No. 14/021,955, filed Sep. 9, 2013, now issued as U.S. Pat. No. 9,587,992 on Mar. 7, 2017, which is a continuation-in-part patent application to the U.S. patent application Ser. No. 13/802,219, filed Mar. 13, 2013, now issued as U.S. Pat. No. 9,212,952 on Dec. 15, 2015, which is incorporated by reference herein for all purposes.
| Number | Date | Country | |
|---|---|---|---|
| Parent | 16576639 | Sep 2019 | US |
| Child | 17740620 | US | |
| Parent | 15409828 | Jan 2017 | US |
| Child | 16576639 | US | |
| Parent | 14021955 | Sep 2013 | US |
| Child | 15409828 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 13802219 | Mar 2013 | US |
| Child | 14021955 | US |
