Claims
- 1. A wafer processing system configured for handling standard 300-mm FOUP cassettes, the system comprising:
an input/output station; a cassette transfer region adjacent to the input/output station; a wafer handling chamber adjacent to the cassette transfer region, the wafer handling chamber separated from the cassette transfer region by an interface configured for interacting with a 300-mm FOUP cassette; a cassette transfer mechanism configured for transferring cassettes from the input/output station through the cassette transfer region to the interface; a wafer handling robot within the wafer handling chamber, the wafer handling robot configured to access wafers within cassettes through the interface; and a tool set adapted for receiving and transferring 200-mm open cassettes within the wafer processing system.
- 2. The wafer processing system of claim 1, wherein the interface comprises a partition between the cassette transfer region and the wafer handling chamber, the partition having a closable opening therein mating with a 300-mm FOUP cassette.
- 3. The wafer processing system of claim 1, wherein the cassette transfer mechanism comprises a cassette handler robot configured to transfer cassettes between the input/output station and the cassette transfer region.
- 4. The wafer processing system of claim 3, wherein the tool set comprises a Transhipment FOUP cassette having external surfaces conforming to a 300-mm FOUP cassette standard, the Transhipment FOUP cassette comprising an internal platform configured to receive a 200-mm open cassette.
- 5. The wafer processing system of claim 4, further comprising a storage position within the cassette transfer region to store the Transhipment FOUP cassette when not in use.
- 6. The wafer processing system of claim 3, wherein the cassette transfer mechanism further comprises a cassette transfer platform configured to receive cassettes from the cassette handler robot and place cassettes into an active position accessible by the wafer transfer robot through the interface.
- 7. The wafer processing system of claim 6, wherein the cassette transfer platform comprises a turntable.
- 8. The wafer processing system of claim 3, wherein the cassette handler robot has a bearing surface designed to receive a standard 300-mm FOUP cassette, the wafer processing system further comprising a cassette handler adapter configured to fit on the bearing surface, the cassette handler adapter further configured to accommodate a 200-mm open cassette thereon.
- 9. The wafer processing system of claim 8, further comprising a storage position to store the cassette handler adapter when not in use.
- 10. The wafer processing system of claim 9, wherein the storage position is on the cassette handler robot.
- 11. The wafer processing system of claim 9, further comprising a cassette store accessible to the cassette handler robot, the storage position for storing the cassette handler adapter comprising a designated position within the cassette store.
- 12. The wafer processing system of claim 3, further comprising a cassette store within the cassette transfer region, the cassette store accessible to the cassette handler robot, the cassette store comprising a storage platform having a plurality of 300-mm FOUP store positions.
- 13. The wafer processing system of claim 12, wherein the tool set comprises a store accommodation plate, configured to fit on one of the 300-mm FOUP store positions, the store accommodation plate configured to accommodate at least one 200-mm open cassette.
- 14. The wafer processing system of claim 13, wherein the store accommodation plate is configured to accommodate two 200-mm open cassettes.
- 15. The wafer processing system of claim 12, wherein the store comprises a plurality of stacked rotary storage platforms, each platform divided into a plurality of storage compartments and defining the 300-mm FOUP store positions.
- 16. The wafer processing system of claim 1, wherein the tool set comprises a load port adapter plate configured to fit on a position of the input/output station designed to receive a standard 300-mm FOUP cassette, the load port adapter plate configured to accommodate a 200-mm open cassette thereon.
- 17. The wafer processing system of claim 4, further comprising a sensor arrangement to determine presence of a 200-mm cassette at discrete positions within the wafer processing system, the sensor arrangement capable of distinguishing presence of a 300-mm FOUP cassette from presence of a 200-mm open cassette at the discrete locations.
- 18. The wafer processing system of claim 17, wherein the sensor arrangement is capable of distinguishing presence of a standard 300-mm FOUP cassette from presence of the Transhipment FOUP cassette at a discrete location.
- 19. The wafer processing system of claim 17, wherein the sensor arrangement includes a plurality of light sensors, light emitters, reflectors and a central processing unit.
- 20. The wafer processing system of claim 19, wherein the cassette handler robot includes an end effector with a bearing surface configured to receive a standard 300-mm FOUP cassette, the wafer processing system further comprising a cassette handler adapter configured to fit on the bearing surface of the cassette handler robot, the cassette handler adapter further configured to accommodate a 200-mm open cassette thereon, wherein the sensor arrangement comprises at least one light sensor and one light emitter arranged to detect the cassette handler adapter when mounted upon the bearing surface of the cassette handler robot.
- 21. The wafer processing system of claim 20, wherein the sensors communicate with the central processing unit and the central processing unit is provided with a program instructing the cassette handler robot to automatically pick up the cassette handler adapter when needed for transferring a 200-mm open cassette, the program further instructing the cassette hander robot to store the cassette hander adapter when not needed for transferring a 200-mm open cassette.
- 22. The wafer processing system of claim 20, wherein the sensors communicate with the central processing unit and the central processing unit is provided with a program instructing the cassette handler robot to automatically place a 200-mm open cassette inside the Transhipment FOUP when wafers need to be transferred from the 200-mm open cassette to the wafer transfer robot or vice versa, the program further instructing the cassette handler robot to remove the 200-mm open cassette when transfer of wafers between the 200-mm open cassette and the wafer handler robot is complete.
- 23. The wafer processing system of claim 20, wherein
the bearing surface of the cassette handler robot has at least one sensor hole, the cassette handler adapter includes a depending vane aligned with the sensor hole when the cassette handler adapter is mounted upon the bearing surface of the cassette handler robot, and the sensor arrangement includes a sensor for detecting the vane extending downwardly through the sensor hole when the cassette handler adapter is mounted upon the bearing surface of the cassette handler robot.
REFERENCE TO RELATED APPLICATION
[0001] This application is a divisional of application Ser. No. 09/769,088, filed Jan. 24, 2001, which claims the benefit under 35 U.S.C. §119(e) of provisional Application No. 60/236,046, filed Sep. 27, 2000.
Provisional Applications (1)
|
Number |
Date |
Country |
|
60236046 |
Sep 2000 |
US |
Divisions (1)
|
Number |
Date |
Country |
Parent |
09769088 |
Jan 2001 |
US |
Child |
10641807 |
Aug 2003 |
US |