Claims
- 1. A wafer polishing head for planarizing a wafer, comprising:a carrier configured to load the wafer; a wafer adhering layer disposed beneath the carrier; a retaining ring surrounding the carrier and the wafer adhering layer; a first pressure chamber having a first inner pressure disposed above the retaining ring; a second pressure chamber having a second inner pressure disposed on the carrier, wherein a relative height between the retaining ring and the carrier can be adjusted by changing the first and the second inner pressure; and an automatic control system respectively coupled to the first pressure chamber and the second pressure chamber and for adjusting a relative height between the carrier and the retaining ring, wherein the automatic control system receives a first feedback pressure signal and transmitted from the first pressure chamber and a second feedback pressure signal and transmitted from the second pressure chamber while a chemical-mechanical polishing process is performed, and the automatic control system respectively transmits a first pressure value and a second pressure value to the first pressure chamber and the second pressure chamber, the automatic control system comprising: a controller; a counter coupled to the controller; a first converter coupled to the first pressure chamber and the controller, wherein the first converter receives the first feedback pressure signal while the chemical-mechanical polishing process is performed and transforms the first feedback pressure into a first feedback digital signal, and the first feedback digital signal is transmitted into the controller; a second converter coupled to the second pressure chamber and the controller, wherein the second converter receives the second feedback pressure signal while the chemical-mechanical polishing process is performed and transforms the second feedback pressure into a second feedback digital signal, and the second feedback digital signal is transmitted into the controller; a first regulator coupled to the controller and the first pressure chamber, wherein the first regulator receives a first digital signal transmitted from the controller and transforms the first digital signal into the first pressure value; and a second regulator coupled to the controller and the second pressure chamber, wherein the second regulator receives a second digital signal transmitted from the controller and transforms the second digital signal into the second pressure value.
- 2. The wafer polishing head of claim 1, wherein the first and the second converters are analog/digital (A/D) converters.
- 3. The wafer polishing head of claim 1, wherein the second pressure chamber is partly filled by a liquid with a relatively low volatility and a relatively low chemical reactivity.
- 4. The wafer polishing head of claim 1, wherein the first feedback pressure signal denotes the first inner pressure.
- 5. The wafer polishing head of claim 1, wherein the second feedback pressure signal denotes the second inner pressure.
- 6. A wafer polishing head for planarizing a wafer, comprising:a carrier configured to load the wafer; a retaining ring surrounding the carrier; a first pressure chamber having a first inner pressure disposed above the retaining ring; a second pressure chamber having a second inner pressure disposed on the carrier; and an automatic control system respectively coupled to the first pressure chamber and the second pressure chamber, the automatic control system comprising: a controller; a first converter coupled to the first pressure chamber and the controller; a second converter coupled to the second pressure chamber and the controller; a first regulator coupled to the controller and the first pressure chamber; and a second regulator coupled to the controller and the second pressure chamber.
- 7. The wafer polishing head of claim 6, wherein the first and the second converters are analog/digital (A/D) converters.
- 8. The wafer polishing head of claim 6, wherein the automatic control system further comprises a counter coupled to the controller.
- 9. The wafer polishing head of claim 6, wherein the second pressure chamber is partly filled by a liquid possesses a relatively low volatility and a relatively low chemical reactivity.
Parent Case Info
This application is a continuation-in-part of U.S. application Ser. No. 09/185,098, filed on Nov. 3, 1998, now abandoned.
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Kind |
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|
5762539 |
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Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09/185098 |
Nov 1998 |
US |
Child |
09/482936 |
|
US |