Patent Application
20130074878
1. Field of the Invention
This invention generally relates to a wafer scrubber and more particularly to a wafer scrubber system using a high speed spinning action to remove water from a surface of a wafer.
2. Description of the Related Art
Production of semiconductor devices having microscopic structures require high-precision technology. During processing, minute particles of dust on the circuits which constitute a semiconductor device may degrade the reliability of a finished semiconductor device. Even if dust contaminants produced during processing, which end up on a semiconductor wafer, do not adversely affect the circuit functions of the semiconductor device, they still may lead to fabrication difficulties. Therefore, a semiconductor device must be fabricated in a dirt-free environment, and the surface of the semiconductor wafer must be washed to remove minute particles of dust generated during processing.
Referring to
The invention provides a wafer scrubber, comprising a chamber, and holder connecting to a spindle disposed in the chamber, wherein the holder supports a wafer, and the wafer spins to release water on the wafer, and a mashed inner cup comprising a plurality of through holes disposed between the holder and a wall of the chamber, wherein the mashed inner cup receives water from a surface of the wafer and rotates around the spindle to release the water through the through holes.
A wafer cleaning procedure, comprising providing a wafer scrubber comprising a chamber, and holder connecting to a spindle disposed in the chamber, wherein the holder supports a wafer and a mashed inner cup comprising a plurality of through holes disposed between the holder and a wall of the chamber, and spinning the wafer to remove water thereon, wherein the mashed inner cup receives water from a surface of the wafer and rotates around the spindle to release the water through the through holes for preventing the water from scattering back to the edge of the wafer.
The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein,
It is understood that specific embodiments are provided as examples to teach the broader inventive concept, and one of ordinary skill in the art can easily apply the teaching of the present disclosure to other methods or apparatus. The following discussion is only used to illustrate the invention, not limit the invention.
Reference throughout this specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. It should be appreciated that the following figures are not drawn to scale; rather, these figures are merely intended for illustration.
Accordingly, a new scrubber and method are required to address the water scattering back issues.
In an important aspect of the embodiment, a meshed inner cup 312 comprising a plurality of through holes 309 is provided between the wafer holder 302 and the chamber wall 308 in the chamber 301 of the wafer scrubber. In the invention, the through holes in the mashed inner cup 312 are column-shaped. In an embodiment of the invention, the meshed inner cup 312 is formed of hydrophobic material, so that the meshed inner cup 312 can catches more water 306 released from the wafer 310 surface. Alternatively, the meshed inner cup 312 is formed of hydrophilic material, so that the meshed inner cup 312 can release water 306 sooner. The meshed inner cup 312 can spin around the spindle. Rotation speed of the meshed inner cup 312 can be less than, the same as or greater than the rotation speed of the wafer 310 depending upon process conditions, such as water quantity. Further, rotation speed of the meshed inner cup 312 can vary when the quantity of the water 306 from the wafer 310 changes. The spinning mashed inner cup 312 can catch water 306 and release the water 306 via the through holes 309 in the mashed inner cup 312 to the chamber wall 308. Therefore, the mashed inner cup 312 can catch and release water 306, and the water 306 scattering back issue can be addressed.
In an important aspect of the embodiment, a meshed inner cup 412 comprising a plurality of through holes 409 is provided between the wafer holder 402 and the chamber wall 408 in the chamber 401 of the scrubber. In the invention, the through holes 409 in the meshed inner cup 412 are cone-shaped. In more detail, an inner opening of each through hole 409 of the mashed inner cup 412 is larger than the outer opening. In an embodiment of the invention, the meshed inner cup 412 is formed of hydrophobic material, so that the meshed inner cup 412 can catches more water 406 released from the wafer 410 surface. Alternatively, the meshed inner cup 412 is formed of hydrophilic material, so that the meshed inner cup 412 can release water 406 sooner. The meshed inner cup 412 can spin around the spindle 404. Rotation speed of the meshed inner cup 412 can be less than, the same as or greater than the rotation speed of the wafer 410 depending upon process conditions, such as water 406 quantity. Further, rotation speed of the meshed inner cup 412 can vary when the quantity or speed of the water 406 from the wafer 410 changes. The spinning mashed inner cup 412 can catch water 406 and release the water 406 via the through holes 409 in the mashed inner cup 412 to the chamber wall 408. Therefore, the mashed inner cup 412 can catch and release water 406, and the water 406 scattering back issue can be addressed.
While the invention has been described by way of example and in terms of the preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. It is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
