TECHNICAL FIELD
Embodiments of the present disclosure relate to electronic packaging systems, and more particularly to optical waveguide architectures to provide chip-to-chip communications.
BACKGROUND
With data rate increases over time, electrical interconnects cannot keep up with the energy efficiency requirements for sustained bandwidth. Optical interconnect architectures demonstrate unparalleled long distance signaling capability. As such the transition from electrical to optical interconnects has already begun, especially for long distance communications.
Integrated waveguides in the package substrate are a promising approach for low cost methods to enable fast and long range transmission of signals within the package. However, methods for efficiently routing signals within the in-package waveguide are lacking. In particular, significant optical losses are observed due to alignment offset created as a result of multiple patterning operations required to route the waveguide signal within the package.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1A is a cross-sectional illustration of an electronic system with an optical waveguide embedded in the package substrate, in accordance with an embodiment.
FIG. 1B is a cross-sectional illustration of an electronic system with an optical waveguide over the package substrate, in accordance with an embodiment.
FIG. 2A is a cross-sectional illustration of an electronic package with an embedded waveguide with a first sloped end and a second sloped end, in accordance with an embodiment.
FIG. 2B is a cross-sectional illustration of an electronic package with an embedded waveguide with a first sloped end and a second end at the edge of the package substrate, in accordance with an embodiment.
FIGS. 3A-3F are cross-sectional illustrations depicting a process for forming an embedded waveguide, in accordance with an embodiment.
FIG. 4A is a cross-sectional illustration of an electronic package with a waveguide over the package substrate, in accordance with an embodiment.
FIG. 4B is a cross-sectional illustration of an electronic package with a waveguide over the package substrate and an end at the edge of the package substrate, in accordance with an embodiment.
FIGS. 5A-5D are cross-sectional illustrations depicting a process for forming a waveguide over a package substrate, in accordance with an embodiment.
FIG. 6A is a cross-sectional illustration of an embedded waveguide with a reflective cladding, in accordance with an embodiment.
FIG. 6B is a cross-sectional illustration of an embedded waveguide with a reflective cladding that has an end at the edge of the package substrate, in accordance with an embodiment.
FIGS. 7A-7C are cross-sectional illustrations depicting a process for forming a waveguide in a package substrate, in accordance with an embodiment.
FIG. 8A is a cross-sectional illustration of an embedded waveguide with reflective structures at opposite ends of the waveguide, in accordance with an embodiment.
FIG. 8B is a cross-sectional illustration of an embedded waveguide with a reflective structure at a first end and a second end at an edge of the package substrate, in accordance with an embodiment.
FIGS. 9A-9I are cross-sectional illustrations depicting a process for forming an embedded waveguide with first and second reflective structures, in accordance with an embodiment.
FIG. 10A is a cross-sectional illustration of an embedded waveguide with reflective structures on opposite ends and a reflective cladding, in accordance with an embodiment.
FIG. 10B is a cross-sectional illustration of an embedded waveguide with a reflective structure at one end and a second end at an edge of the package substrate, in accordance with an embodiment.
FIGS. 11A-11F are cross-sectional illustrations depicting a process for forming an embedded waveguide with reflective structures and a reflective cladding, in accordance with an embodiment.
FIG. 12A is a cross-sectional illustration of an embedded waveguide with a first reflective structure and a second reflective structure, in accordance with an embodiment.
FIG. 12B is a cross-sectional illustration of an embedded waveguide with a reflective structure at a first end and a second end at an edge of the package substrate, in accordance with an embodiment.
FIGS. 13A-13H are cross-sectional illustrations depicting a process for forming an embedded waveguide with a first reflective structure and a second reflective structure, in accordance with an embodiment.
FIG. 14A is a cross-sectional illustration of an embedded waveguide with a reflective cladding, in accordance with an embodiment.
FIG. 14B is a cross-sectional illustration of an embedded waveguide with a reflective cladding that ends at an edge of the package substrate, in accordance with an embodiment.
FIGS. 15A-15F are cross-sectional illustrations depicting a process for forming an embedded waveguide, in accordance with an embodiment.
FIG. 16A is a plan view illustration of an array of optical waveguides in a package substrate, in accordance with an embodiment.
FIG. 16B is a plan view illustration of a waveguide plane in a package substrate, in accordance with an embodiment.
FIG. 17 is a schematic of a computing device built in accordance with an embodiment.
EMBODIMENTS OF THE PRESENT DISCLOSURE
Described herein are optical waveguide architectures to provide chip-to-chip communications, in accordance with various embodiments. In the following description, various aspects of the illustrative implementations will be described using terms commonly employed by those skilled in the art to convey the substance of their work to others skilled in the art. However, it will be apparent to those skilled in the art that the present invention may be practiced with only some of the described aspects. For purposes of explanation, specific numbers, materials and configurations are set forth in order to provide a thorough understanding of the illustrative implementations. However, it will be apparent to one skilled in the art that the present invention may be practiced without the specific details. In other instances, well-known features are omitted or simplified in order not to obscure the illustrative implementations.
Various operations will be described as multiple discrete operations, in turn, in a manner that is most helpful in understanding the present invention, however, the order of description should not be construed to imply that these operations are necessarily order dependent. In particular, these operations need not be performed in the order of presentation.
As noted above, embedded optical waveguides within a package substrate currently have significant optical losses due to alignment offsets created as a result of multiple patterning operations. Accordingly, embodiments disclosed herein include self-aligned reflective surfaces on opposite ends of the optical waveguide. In an embodiment, the optical waveguide provides a lateral path for routing signals, and the reflective surfaces allow for coupling with dies positioned above the package substrate. Due to the self-aligned nature of the reflective surfaces, optical losses are minimized.
In some embodiments, the optical waveguide is over the package substrate. That is, the optical waveguide may be between the dies and the package substrate. In other embodiments, the optical waveguide is at least partially embedded in the package substrate. At least partially embedded may refer to a waveguide that has a bottom surface and sidewall surfaces covered by the package substrate, while a top surface of the waveguide is exposed to the atmosphere. In yet another embodiment, the optical waveguide is fully embedded in the package substrate, so that all surfaces along a length of the waveguide are covered by the package substrate.
In an embodiment, the waveguides may comprise a high index of refraction material. For example, the index of refraction may be greater than 1.0. In other embodiments, the waveguides may comprise air. For example, a reflective cladding may surround a void in the package substrate, and the optical signal propagates through the void without any solid material along the optical path.
In an embodiment, the reflective surfaces may be part of the optical waveguide. For example, differences in index of refraction may allow for a complete reflection of the signal at the ends of the waveguide. In other embodiments, reflective structures are provided at the ends of the waveguide. The reflective structures may have unique structures due to the self-aligned process. For example, the reflective structures may comprise trapezoidal shaped cross-sections with a triangular notch along a bottom surface. In other embodiments, the reflective structures may comprise parallelogram shaped cross-sections.
Referring now to FIG. 1A, a cross-sectional illustration of an electronic system 100 is shown, in accordance with an embodiment. In an embodiment, the electronic system 100 may comprise a board 101 (such as a printed circuit board (PCB).
A package substrate 102 is coupled to the board by interconnects 103. While shown as solder balls, it is to be appreciated that the interconnects 103 may comprise any interconnect architecture, such as sockets or the like. In an embodiment, a pair of dies 110A and 110E are provided over the package substrate 102. First level interconnects (FLIs) 104 may couple the package substrate 102 to the dies 110A and 110B.
In an embodiment, an optical waveguide 120 (sometimes referred to as simply “waveguide 120”) is at least partially embedded in the package substrate 102. The waveguide 120 comprises a first end 121 and a second end 122. The first end 121 is provided below the first die 110A and the second end 122 is provided below the second die 110B. In an embodiment, photonics regions 112 on the first die 110A and the second die 110E are directly over the first end 121 and the second end 122 of the waveguide 120. As such, an optical signal (represented by the dashed line) can be sent between the first die 110A and the second die 110B.
In an embodiment, the first end 121 and the second end 122 have sloped surfaces. As such, the direction of the optical signal can be changed from vertical to horizontal. In an embodiment, the sloped surfaces are approximately 45°, though it is to be appreciated that other angles may also be used. The reflection of the first end 121 and the second end 122 may be the result of mismatches in the index of refraction between the waveguide 120 and the package substrate 102. For example, a material with an index of refraction greater than that of the package substrate may be used in order to provide total internal reflection at the first end 121 and the second end 122. In other embodiments (as will be described in greater detail below) the reflection at the first end 121 and the second end 122 may be made by reflective structures that are self-aligned to the waveguide 120.
Referring now to FIG. 1B, a cross-sectional illustration of an electronic system 100 is shown, in accordance with an additional embodiment. The electronic system 100 may be substantially similar to the electronic system 100 described in FIG. 1A, with the exception of the placement of the waveguide 120. Instead of being embedded in the package substrate 102, the waveguide 120 is provided between the dies 110A and 110E and the package substrate 102. In such an embodiment, the waveguide 120 comprises an index of refraction material that is higher than air in order to provide the total internal reflection needed to rout optical signals from the first die 110A to the second die 110B.
Referring now to FIG. 2A, a cross-sectional illustration of an optical waveguide 220 partially embedded in a package substrate 202 is shown, in accordance with an embodiment. The waveguide 220 may have a bottom surface and sidewall surfaces that are contacted by the package substrate 202. A top surface of the waveguide 220 may be exposed to the atmosphere. In an embodiment, the optical waveguide 220 comprises a high index of refraction material, such as high index polymers or dielectrics. Particularly, the index of refraction of the waveguide 220 is higher than the index of refraction of the surrounding package substrate 202 and atmosphere.
Due to the differences in the index of refraction, total internal reflection is provided when an optical signal 225 reaches the first end 221 and the second end 222 of the waveguide 220. The waveguide 220 may be patterned with an angled patterning process. As such, the first end 221 and the second end 222 may be sloped in order to redirect the optical signal 225 vertically to allow communication between overlying dies (not shown). Since the first end 221 and the second end 222 are patterned during the patterning to form the waveguide 220, the first end 221 and the second end 222 may be referred to as being self-aligned. A more detailed description of the angled patterning process is provided below.
Referring now to FIG. 2B, a cross-sectional illustration of an optical waveguide 220 in a package substrate 202 is shown, in accordance with an additional embodiment. The optical waveguide 220 may comprise a first end 221 that is sloped and a second end 222 that is vertical. The second end 222 may be substantially coplanar with an edge 207 of the package substrate 202. In such an embodiment, the optical signal 225 may be routed off the package substrate 202 to another device. In an embodiment, the materials for the optical waveguide 220 and package substrate 202 in FIG. 2B may be substantially similar to those described above with respect to FIG. 2A.
Referring now to FIGS. 3A-3F, a series of cross-sectional illustrations depicting a process for forming an embedded waveguide similar to the one shown in FIG. 2A is shown, in accordance with an embodiment.
Referring now to FIG. 3A, a cross-sectional illustration of a package substrate 302 is shown, in accordance with an embodiment. The package substrate 302 may comprise a plurality of laminated dielectric layers with conductive routing 308. The package substrate 302 may be cored or coreless. While a single layer of conductive routing 308 is shown, it is to be appreciated that a plurality of conductive routing, vias, pads, etc. may be provided in the package substrate 302.
Referring now to FIG. 3B, a cross-sectional illustration of the package substrate 302 after a photo-imageable dielectric (PID) 331 is disposed over the package substrate 302 is shown, in accordance with an embodiment. The PID 331 may be disposed with any suitable process, such as lamination.
Referring now to FIG. 3C, a cross-sectional illustration of the package substrate 302 after a first exposure is shown, in accordance with an embodiment. In an embodiment, a mask 340 may be used to cover a portion of the PID 331. A first exposure 341 is used to expose portions of the PID 331 to form exposed PID 332. The first exposure 341 may be an angled exposure. As such, the unexposed portion of the PID 331 may have a parallelogram shape.
Referring now to FIG. 3D, a cross-sectional illustration of the package substrate 302 after a second exposure is shown, in accordance with an embodiment. In an embodiment, the second exposure 342 may be done at an angle that mirrors the angle of the first exposure 341. As a result, the unexposed portions of the PID 331 may have a trapezoidal shape. It is to be appreciated that while two different exposures are made of the PID 331, the mask 340 may not move between the different exposures.
Referring now to FIG. 3E, a cross-sectional illustration of the package substrate 302 after the unexposed portions of the PID 331 are removed is shown, in accordance with an embodiment. In an embodiment, the unexposed portions may be removed with a developing process to form a trench 333. Removal of the unexposed portions of the PID 331 results in the exposure of a first sloped surface 334 and a second sloped surface 335 at opposite ends of the trench 333.
Referring now to FIG. 3F, a cross-sectional illustration of the package substrate 302 after an optical waveguide 320 is disposed into the trench 333 is shown, in accordance with an embodiment. In an embodiment, the optical waveguide 320 comprises a high index of refraction material. Particularly, the index of refraction of the optical waveguide 320 is higher than the index of refraction of the PID 332 and the package substrate 302. The optical waveguide 320 comprises a first end 321 over the surface 334 and a second end 322 over the surface 335.
Referring now to FIG. 4A, a cross-sectional illustration of an optical waveguide 420 that is disposed over a package substrate is shown, in accordance with an embodiment. In an embodiment, a layer 451 with a low index of refraction material is provided under the waveguide 420. The layer 451 may be disposed over the package substrate (not shown). For example, the layer 451 may comprise SiO2 or SiN in some embodiments.
In an embodiment, the waveguide 420 comprises a high index of refraction material. As such, an optical signal 425 can be retained within the waveguide 420 using total internal reflection. In a particular embodiment, the waveguide 420 is a developed PID material. That is, the waveguide 420 may be the result of a patterning process. The optical signal 425 may reflect off of a first end 421 and a second end 422 in order to rout the optical signal 425 vertically to overlying dies (not shown).
Referring now to FIG. 4B, a cross-sectional illustration of an optical waveguide 420 is shown, in accordance with an additional embodiment. In an embodiment, the optical waveguide 420 includes a first end 421 that is sloped and a second end 422 that is vertical. The second end 422 may be substantially coplanar with an edge 407 of the layer 451 (and the package substrate (not shown)). Similar to the embodiment in FIG. 4A, the optical waveguide 420 is provided above the package substrate instead of being embedded in the package substrate. The materials of the optical waveguide 420 and the layer 451 in FIG. 4B may be substantially similar to the materials described above with respect to FIG. 4A.
Referring now to FIGS. 5A-5D, a series of cross-sectional illustrations depicting a process for forming an optical waveguide on a package substrate 502 is shown, in accordance with an embodiment.
Referring now to FIG. 5A, a cross-sectional illustration of a package substrate 502 is shown, in accordance with an embodiment. In an embodiment, the package substrate 502 may be substantially similar to the package substrate 302 described above. For example, the package substrate 502 may comprise dielectric layers with conductive routing 508. In an embodiment, a layer 551 with a low refractive index is provided over the package substrate 502. For example, the layer 551 may comprise SiO2 or SiN. The layer 551 may be deposited with a sputtering process, or any other suitable material deposition process. In an embodiment, a PID 531 is provided over the layer 551. The PID 531 may be a positive resist material. That is, exposed regions of the PID 531 will be developed away.
Referring now to FIG. 5B, a cross-sectional illustration of the package substrate 502 after a first exposure is shown, in accordance with an embodiment. In an embodiment, a mask 540 may be used to cover a portion of the PID 531. A first exposure 541 is used to expose portions of the PID 531 to form exposed PID 532. The first exposure 541 may be an angled exposure. As such, the unexposed portion of the PID 531 may have a parallelogram shape.
Referring now to FIG. 5C, a cross-sectional illustration of the package substrate 502 after a second exposure is shown, in accordance with an embodiment. In an embodiment, the second exposure 542 may be done at an angle that mirrors the angle of the first exposure 541. As a result, the unexposed portions of the PID 531 may have a trapezoidal shape. It is to be appreciated that while two different exposures are made of the PID 531, the mask 540 may not move between the different exposures.
Referring now to FIG. 5D, a cross-sectional illustration of the package substrate 502 after the exposed portions of the PID 532 are developed and removed is shown, in accordance with an embodiment. As shown, the residual portions of the unexposed PID 531 have a trapezoidal shape that can be used as an optical waveguide 520. The waveguide 520 comprises a first end 521 with a sloped surface and a second end 522 with a sloped surface.
Referring now to FIG. 6A, a cross-sectional illustration of an optical waveguide 620 in a package substrate 602 is shown, in accordance with an additional embodiment. In an embodiment, the waveguide 620 may include a reflective cladding 623. The reflective cladding 623 may be provided between a low loss material of the waveguide 620 and the package substrate 602. The use of a reflective cladding 623 allows for lower index of refraction materials to be used for the waveguide 620. Instead of providing an index of refraction that is higher than that of the package substrate 602, all that is required is that the index of refraction be higher than that of the atmosphere (e.g., greater than approximately 1.0). As such, the material for the waveguide may be selected based on loss characteristics. For example, the material of the waveguide 620 may be a dielectric without any fillers.
In an embodiment, the reflective cladding 623 may be provided over a bottom surface of the waveguide 620 and over the first end 621 and the second end 622. As such, an incoming optical signal 625 may be propagated through the waveguide 620 by reflecting off of the reflective cladding 623 on the first end 621 and the second end 622. In an embodiment, the reflective cladding 623 may comprise a thin, smooth layer, such as a material deposited with an electroless plating process or a liquid metal ink (LMI) process. For example, the reflective cladding 623 may comprise copper, gold, silver, palladium, or the like.
Referring now to FIG. 6B, a cross-sectional illustration of an optical waveguide 620 on a package substrate 602 is shown, in accordance with an additional embodiment. In an embodiment, the optical waveguide 620 comprises a reflective cladding 623 between the optical waveguide 620 and the package substrate 602. In an embodiment, a first end 621 has a sloped surface and a second end 622 has a vertical surface. The second end 622 may be substantially coplanar with an edge 607 of the package substrate 602. In an embodiment, the materials of the optical waveguide 620 and the reflective cladding 623 may be substantially similar to those described above with respect to FIG. 6A.
Referring now to FIGS. 7A-7C, a series of cross-sectional illustrations depicting a process for forming an optical waveguide in a package substrate is shown, in accordance with an embodiment.
Referring now to FIG. 7A, a cross-sectional illustration of a package substrate 702 is shown, in accordance with an embodiment. In an embodiment, the processing to get to the structure shown in FIG. 7A may be substantially similar to the processing operations described above in FIGS. 3A-3E, and will not be repeated here. Particularly, an angled patterning process is used to form a PID 732 with a trench 733. The trench 733 may comprise a first sloped sidewall 734 and a second sloped sidewall 735.
Referring now to FIG. 7B, a cross-sectional illustration of the package substrate 702 after a reflective cladding 723 is deposited is shown, in accordance with an embodiment. In an embodiment, the reflective cladding 723 may be deposited with an electroless plating process or any other conformal deposition process that can provide a smooth surface. In an embodiment, the reflective cladding 723 may comprise copper, gold, silver, palladium, or the like.
Referring now to FIG. 7C, a cross-sectional illustration of the package substrate 702 after a waveguide 720 is disposed in the trench 733 is shown, in accordance with an embodiment. In an embodiment, the waveguide 720 has a first end 721 and a second end 722. The first end 721 and the second end 722 are sloped surfaces in order to allow for the optical signal to be routed vertically to overlying dies (not shown).
Referring now to FIG. 8A, a cross-sectional illustration of an optical waveguide 820 in a package substrate 802 is shown, in accordance with an embodiment. In an embodiment, the optical waveguide 820 comprises a first end 821 and a second end 822. The first end 821 and the second end 822 may be adjacent to reflective structures 861. The optical signal 825 reflects off of the reflective structures 861 to be routed to overlying dies (not shown). In an embodiment, the optical waveguide 820 may comprise a material with a high index of refraction, such as materials described above.
In an embodiment, the waveguide 820 is fully embedded in the package substrate 802. Particularly, a dielectric layer 808 is disposed over a top surface of the waveguide 820. That is, dielectric material from the package substrate 802 and the dielectric layer 808 may be provided over the bottom surface and a portion of the top surface of the waveguide 620. Accordingly, embodiments may include burying the waveguide 820 in any layer of the package substrate 802.
In an embodiment, the reflective structures 861 may have trapezoidal shaped cross-sections with a triangular notch 862 on a bottom surface. The notch 862 may be filled by dielectric material, or may remain as a void in the package. The novel shape of the reflective structures 861 are a result of patterning processes, which will be described in greater detail below. The reflective structures 861 may be copper or other reflective material.
Referring now to FIG. 8B, a cross-sectional illustration of an optical waveguide 820 on a package substrate 802 is shown, in accordance with an embodiment. In an embodiment, the waveguide 820 comprises a first end 821 and a second end 822. The first end 821 is adjacent to a reflective structure 861 and the second end 822 is substantially coplanar with an edge 807 of the package substrate 802. In an embodiment, the reflective structure 861 may be substantially similar to the reflective structures described above in FIG. 8A. The waveguide 820 may comprise a material with a high index of refraction.
Referring now to FIGS. 9A-9I a series of cross-sectional illustrations depicting a process for forming an optical waveguide in a package substrate 902 is shown, in accordance with an embodiment.
Referring now to FIG. 9A, a cross-sectional illustration of a package substrate 902 with a positive resist layer 965 is shown, in accordance with an embodiment. In an embodiment, the resist layer 965 may be deposited with any suitable deposition process.
Referring now to FIG. 9B, a cross-sectional illustration of the package substrate after a first exposure of the resist layer 965 is made. In an embodiment, the exposure may be an angled patterning using a greyscale mask (not shown). As shown arrows 969 may be a high dose and arrow 968 may be a low dose. The high dose areas 967 are shown in a first shading, and the low dose area is shown with a second shading 966.
Referring now to FIG. 9C, a cross-sectional illustration of the package substrate after a second exposure of the resist layer 965 is made. The exposure may be an angled patterning (in a direction opposite from the first patterning) using a greyscale mask. As shown, the second patterning overlays the first pattern to form a low dose region that is a trapezoidal shape. The high dose regions 967 have trapezoidal shapes with triangular notches of low dose regions 966 along a bottom surface. It is to be appreciated that the low dose region 966 may get a double exposure. However, so long as there is a sufficient delta between the high dose regions 967 and the low dose regions 966 then the subsequent developing processes will be able to be executed properly.
Referring now to FIG. 9D, a cross-sectional illustration of the package substrate 902 after a first developing process is shown, in accordance with an embodiment. In an embodiment, the first developing process is a fast develop that only removes the high dose regions 967. As shown, openings 963 are provided between the unexposed regions of the resist layer 965 and the low dose regions 966.
Referring now to FIG. 9E, a cross-sectional illustration of the package substrate 902 after a plating process is shown, in accordance with an embodiment. The plating may result in reflective structures 961 being formed in the openings 963. The reflective structures have a trapezoidal shaped cross-sections with a triangular notch in the bottom surfaces. In an embodiment, the reflective structures 961 may comprise copper or the like.
Referring now to FIG. 9F, a cross-sectional illustration of the package substrate 902 after a second developing process is shown, in accordance with an embodiment. The second development process may be a longer develop in order to remove the low dose regions 966. Removal of the low dose regions 966 may result in the formation of a trench 964 between the reflective structures 961. In an embodiment, the notches 962 in the reflective structures 961 may be voids in some embodiments.
Referring now to FIG. 9G, a cross-sectional illustration of the package substrate 902 after a high index of refraction material 919 is disposed is shown, in accordance with an embodiment. The high index of refraction material 919 may be deposited with a conformal deposition process, such as a spray coating or a sputtering process. In some embodiments, a hydrophobic treatment of the resist 965 may be made prior to deposition of the material 919 to prevent the material 919 from sticking to the resist 965. In an embodiment, the material 919 may be a high index polymer or dielectric.
Referring now to FIG. 9H, a cross-sectional illustration of the package substrate 902 after a dielectric layer 908 is laminated and a planarization process is done is shown, in accordance with an embodiment. The dielectric layer 908 may be laminated over the material 919 and the planarization process recesses the dielectric layer 908 and the material 919 to expose the top surfaces of the reflective structures 961. The recessing results in the formation of the optical waveguide 920. The waveguide 920 comprises a first end 921 and a second end 922. The first end 921 and the second end 922 are adjacent and contacting the reflective structures 961. After the planarization process, the resist 965 may be stripped, as shown in FIG. 9H.
Referring now to FIG. 9I, a cross-sectional illustration of the package substrate 902 after an additional dielectric layer 908 is laminated is shown, in accordance with an embodiment. As shown, the dielectric layer 908 covers the edge surfaces of the reflective structures 961 opposite from the waveguide 920. In an embodiment, a planarization process may be used to expose the top surfaces of the reflective structures 961 after the dielectric layer 908 is laminated. In the illustrated embodiments, the notches 962 may be filled with dielectric material or the notches 962 may define a void in the package.
Referring now to FIG. 10A, a cross-sectional illustration of an electronic package with a waveguide 1020 embedded in a package substrate 1002 is shown, in accordance with an embodiment. In an embodiment, the waveguide 1020 may comprise a reflective cladding 1023. The reflective cladding 1023 may be copper or the like. In an embodiment, the waveguide 1020 may be air within the reflective cladding 1023. A first end 1021 of the waveguide 1020 may be adjacent to a reflective structure 1061, and the second end 1022 of the waveguide 1020 may be adjacent to a reflective structure 1061. The reflective structures 1061 may have trapezoidal shaped cross-sections with a triangular notch 1062 formed in a bottom surface. In an embodiment, the reflective structures 1061 route an optical signal 1025 from within the waveguide 1020 up to overlying dies (not shown). In an embodiment, a dielectric layer 1008 may surround surfaces of the reflective structures 1061 opposite from the waveguide 1020.
Referring now to FIG. 10B, a cross-sectional illustration of a waveguide 1020 is shown, in accordance with an additional embodiment. Instead of a pair of reflective structures 1061, only a single reflective structure 1061 is provided adjacent to the first end 1021. The second end 1022 of the waveguide 1020 is substantially coplanar with an edge 1007 of the package substrate 1002. While referred to as the second end 1022, it is to be appreciated that the waveguide 1020 may be air filled between the reflective cladding 1023, and that there may not be a solid surface at the second end 1022.
Referring now to FIGS. 11A-11F, a series of cross-sectional illustrations depicting a process for forming a waveguide in a package substrate is shown, in accordance with an embodiment. In an embodiment, the structure in FIG. 11A may be formed using processing operations similar to those described above in FIGS. 9A-9E, and will not be repeated here.
Referring now to FIG. 11A, a cross-sectional illustration of a structure for forming an embedded waveguide is shown, in accordance with an embodiment. The structure comprises a package substrate 1102 with a patterned resist layer 1165. At this point in the process flow, the high dose regions of the positive resist layer 1165 have been removed and reflective structures 1161 have been formed. The low dose regions 1166 of the positive resist layer 1165 remain at this point in the process flow.
Referring now to FIG. 11B, a cross-sectional illustration of the package substrate 1102 after the low dose regions 1166 are removed to form a trench 1164 and a portion of a reflective cladding 1123 is formed is shown, in accordance with an embodiment. Removal of the low dose regions 1166 may also form notches 1162 that are air voids in a bottom surface of the reflective structures 1161. The reflective cladding 1123 may form a bottom surface of the waveguide. The reflective cladding 1123 may comprise copper. Additionally, the reflective cladding 1123 may directly couple the two reflective structures 1161 together.
Referring now to FIG. 11C, a cross-sectional illustration of the package substrate 1102 after a thermally decomposable layer 1180 is disposed over the exposed surfaces is shown, in accordance with an embodiment. In an embodiment, the thermally decomposable layer 1180 comprises a material that can be removed at elevated temperatures. In an embodiment, the thermally decomposable layer 1180 is deposited with a conformal process, such as a spray coating process.
Referring now to FIG. 11D, a cross-sectional illustration of the package substrate 1102 after a dielectric lamination and planarization process is shown, in accordance with an embodiment. In an embodiment, the dielectric layer 1108 is disposed over the thermally decomposable layer 1180. A planarization process may then be implemented to expose the top surfaces of the reflective structures 1161. After the planarization process, the resist layer 1165 may be stripped.
Referring now to FIG. 11E, a cross-sectional illustration of the package substrate 1102 after an additional dielectric layer 1108 is laminated to cover the outside surfaces of the reflective structures 1161 and the thermally decomposable layer 1180 is removed is shown, in accordance with an embodiment. An additional planarization process may be done between the dielectric layer 1108 lamination and the removal of the thermally decomposable layer 1180. The removal of the thermally decomposable layer 1180 results in the formation of a void that is used as the waveguide 1120. As shown, a portion of the dielectric layer 1108 appears floating over the waveguide 1120. However, it is to be appreciated that the floating portion is supported out of the plane of FIG. 11E.
Referring now to FIG. 11F, a cross-sectional illustration of the package substrate 1102 after a top portion of the cladding 1123 is formed is shown, in accordance with an embodiment. In an embodiment, the top portion of the cladding 1123 over the floating portion of the dielectric 1108 may be done with an electroless plating process or the like. In some embodiments, the top portion of the cladding 1123 may be omitted. Additionally, a high index of refraction liquid material may be dispensed into the waveguide 1120 in some embodiments.
Referring now to FIG. 12A, a cross-sectional illustration of an optical waveguide 1220 in a package substrate 1202 is shown, in accordance with an embodiment. In an embodiment, the optical waveguide 1220 comprises a high index of refraction material, such as a high index polymer or dielectric. In an embodiment, the waveguide 1220 comprises a first end 1221 and a second end 1222. The first end 1221 and the second end 1222 are adjacent to reflective structures 1281 and 1282, respectively. The first structure 1281 is a mirror image of the second structure 1282. The reflective structures 1281 and 1282 reflect an optical signal 1225 that passes through the waveguide 1220 to overlying dies (not shown). In an embodiment, a dielectric layer 1208 embeds the waveguide 1220. The dielectric layer 1208 may be considered as part of the package substrate 1202 in some embodiments.
Referring now to FIG. 12B, a cross-sectional illustration of a package substrate 1202 with a waveguide 1220 is shown, in accordance with an additional embodiment. The waveguide 1220 is similar to the waveguide 1220 in FIG. 12A, with the exception of the second end 1222 ending at an edge 1207 of the package substrate 1202. There is also no reflective structure 1282 at the second end 1222 of the waveguide 1220.
Referring now to FIGS. 13A-13H, a series of cross-sectional illustrations depicting a process for forming an embedded waveguide is shown, in accordance with an embodiment.
Referring now to FIG. 13A, a cross-sectional illustration of a package substrate 1302 is shown, in accordance with an embodiment. A resist layer 1365 may be disposed over a top surface of the package substrate 1302.
Referring now to FIG. 13B, a cross-sectional illustration of the package substrate 1302 after the resist layer 1365 is exposed is shown, in accordance with an embodiment. In an embodiment, the resist layer may be exposed using a two-photon-polymerization (2PP) variable exposure. This results in a low dose exposure 1368 and high dose exposures 1369. The low dose region 1366 may have a trapezoidal shape, and the high dose regions 1367 may have parallelogram shapes. The two high dose regions 1367 may be mirror images of each other. For a positive tone resist, such as diazoalkylquinone doped with a 2PP marker with a high 2P cross-section may be used to provide the 2PP variable exposure.
Referring now to FIG. 13C, a cross-sectional illustration after the high dose regions 1367 are removed with a first developing process is shown, in accordance with an embodiment. In an embodiment, the duration of the first developing process is short in order to ensure that none of the low dose region 1366 is removed. Removal of the high dose regions 1367 results in the formation of trenches 1363.
Referring now to FIG. 13D, a cross-sectional illustration of the package substrate 1302 after reflective structures 1381 and 1382 are disposed in the trenches 1363 is shown, in accordance with an embodiment. In an embodiment, the reflective structures 1381 and 1382 may comprise copper formed with any suitable plating process. The reflective structures 1381 and 1382 may be mirror images of each other, and have parallelogram shaped cross-sections.
Referring now to FIG. 13E, a cross-sectional illustration of the package substrate 1302 after the low dose region 1366 is removed is shown, in accordance with an embodiment. Removal of the low dose region 1366 results in the formation of a trench 1364 between the reflective structures 1381 and 1382.
Referring now to FIG. 13F, a cross-sectional illustration of the package substrate 1302 after a layer 1319 with a high index of refraction is disposed over the exposed surfaces is shown, in accordance with an embodiment. In an embodiment, the layer 1319 may be conformally deposited (e.g., with a spray coating or sputtering process). In some embodiments, a hydrophobic treatment is applied to the resist layer 1365 to prevent deposition on the resist layer 1365.
Referring now to FIG. 13G, a cross-sectional illustration of the package substrate 1302 after a dielectric layer 1308 is deposited and planarized is shown, in accordance with an embodiment. In an embodiment, the planarization process exposes the top surfaces of the reflective structures 1381 and 1382. The planarization process also reduces the layer 1319 to form the waveguide 1320 between the reflective structures 1381 and 1382. The waveguide 1320 comprises a first end 1321 next to the reflective structure 1381 and a second end 1322 next to the reflective structure 1382. After the planarization process, the resist layer 1365 may be removed.
Referring now to FIG. 13H, a cross-sectional illustration of the package substrate 1302 after an additional dielectric layer 1308 is laminated and planarized is shown, in accordance with an embodiment. In an embodiment, the additional dielectric layer 1308 covers the sidewall surfaces of the reflective structures 1381 and 1382 opposite from the waveguide 1320.
Referring now to FIG. 14A, a cross-sectional illustration of an embedded waveguide 1420 is shown, in accordance with an embodiment. In an embodiment, the structure comprises a package substrate 1402. A pair of reflective structures 1481 and 1482 are provided over the package substrate 1402. The reflective structures 1481 and 1482 may be mirror images of each other and be connected together by a reflective cladding 1423. In an embodiment, a dielectric layer 1408 covers sidewall surfaces of the reflective structures 1481 and 1482.
In an embodiment, a portion of the dielectric layer 1408 may be above the waveguide 1420. The waveguide 1420 may comprise cladding layers 1423 and be air filled. The waveguide 1420 has a first end 1421 and a second end 1422. Optical signals 1425 propagate along the waveguide 1420 and reflect off of the reflective structures 1481 and 1482 to overlying dies (not shown).
Referring now to FIG. 14B, a cross-sectional illustration of an embedded waveguide 1420 is shown, in accordance with an additional embodiment. The waveguide 1420 in FIG. 14B is similar to the waveguide in FIG. 14A, with the exception of the second end 1422 ending at an edge 1407 of the package substrate 1402. That is, there is no second reflective structure 1482 in the embodiment shown in FIG. 14B.
Referring now to FIGS. 15A-15F a series of cross-sectional illustrations depicting a process for forming an embedded waveguide is shown, in accordance with an embodiment. The structure shown in FIG. 15A may be fabricated using processing operations substantially similar to those described above with respect to FIGS. 13A-13E, and will not be repeated here.
Referring now to FIG. 15A, a cross-sectional illustration of a package substrate 1502 with a patterned resist layer 1565 is shown, in accordance with an embodiment. A trench 1564 may be formed in the patterned resist layer 1565. In an embodiment, a first reflective structure 1581 and a second reflective structure 1582 are formed at edges of the trench 1564. The reflective structures 1581 and 1582 may be mirror images of each other. For example, the reflective structures 1581 and 1582 may have parallelogram shaped cross-sections.
Referring now to FIG. 15B, a cross-sectional illustration of the package substrate 1502 after a bottom cladding 1523 is disposed over the package substrate 1502 is shown, in accordance with an embodiment. The bottom cladding 1523 may be copper or the like. The bottom cladding 1523 connects the first reflective structure 1581 to the second reflective structure 1582.
Referring now to FIG. 15C, a cross-sectional illustration of the package substrate after a thermally decomposable layer 1580 is disposed over exposed surfaces is shown, in accordance with an embodiment. The thermally decomposable layer 1580 may be a material that decomposes at elevated temperatures. In an embodiment, the thermally decomposable layer 1580 may be deposited with a spray coating process or the like.
Referring now to FIG. 15D, a cross-sectional illustration after a dielectric layer is laminated and a planarization process is implemented is shown, in accordance with an embodiment. In an embodiment, the dielectric layer 1508 is disposed over the thermally decomposable layer 1580. The planarization process may be used to expose the top surfaces of the reflective structures 1581 and 1582. After the planarization process, the resist layer 1565 may be stripped.
Referring now to FIG. 15E, a cross-sectional illustration of the package substrate 1502 after an additional dielectric layer 1508 is laminated to cover the outside surfaces of the reflective structures 1581 and 1582 and the thermally decomposable layer 1580 is removed is shown, in accordance with an embodiment. An additional planarization process may be done between the dielectric layer 1508 lamination and the removal of the thermally decomposable layer 1580. The removal of the thermally decomposable layer 1580 results in the formation of a void that is used as the waveguide 1520. As shown, a portion of the dielectric layer 1508 appears floating over the waveguide 1520. However, it is to be appreciated that the floating portion is supported out of the plane of FIG. 15E.
Referring now to FIG. 15F, a cross-sectional illustration of the package substrate 1502 after a top portion of the cladding 1523 is formed is shown, in accordance with an embodiment. In an embodiment, the top portion of the cladding 1523 over the floating portion of the dielectric 1508 may be done with an electroless plating process or the like. In some embodiments, the top portion of the cladding 1523 may be omitted. Additionally, a high index of refraction liquid material may be dispensed into the waveguide 1520 in some embodiments. In an embodiment, the waveguide 1520 comprises a first end 1521 adjacent to the first reflective structure 1581 and a second end 1522 adjacent to the second reflective structure 1582.
Referring now to FIG. 16A, a plan view illustration of an electronic package 1600 is shown, in accordance with an embodiment. As shown, an array of optical paths 16901-3 are provided across the surface of the package substrate 1602. While three optical paths 1690 are shown, it is to be appreciated that any number of optical paths 1690 may be used. In an embodiment, each of the optical paths 1690 comprises a pair of reflective structures 1661 and an optical waveguide 1620. The horizontal portion of the optical waveguide 1620 is below the surface of the package substrate 1602.
Referring now to FIG. 16B, a plan view illustration of an electronic package 1600 is shown, in accordance with an additional embodiment. In an embodiment, a waveguide plane 1690 is provided. The waveguide plane 1690 includes wider reflective structure 1661 and waveguide 1620. The extended width allows for multiple signals to be passed along the single waveguide plane 1690. Such an embodiment may be useful when light scattering within the waveguide 1620 is negligible.
FIG. 17 illustrates a computing device 1700 in accordance with one implementation of the invention. The computing device 1700 houses a board 1702. The board 1702 may include a number of components, including but not limited to a processor 1704 and at least one communication chip 1706. The processor 1704 is physically and electrically coupled to the board 1702. In some implementations the at least one communication chip 1706 is also physically and electrically coupled to the board 1702. In further implementations, the communication chip 1706 is part of the processor 1704.
These other components include, but are not limited to, volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), flash memory, a graphics processor, a digital signal processor, a crypto processor, a chipset, an antenna, a display, a touchscreen display, a touchscreen controller, a battery, an audio codec, a video codec, a power amplifier, a global positioning system (GPS) device, a compass, an accelerometer, a gyroscope, a speaker, a camera, and a mass storage device (such as hard disk drive, compact disk (CD), digital versatile disk (DVD), and so forth).
The communication chip 1706 enables wireless communications for the transfer of data to and from the computing device 1700. The term “wireless” and its derivatives may be used to describe circuits, devices, systems, methods, techniques, communications channels, etc., that may communicate data through the use of modulated electromagnetic radiation through a non-solid medium. The term does not imply that the associated devices do not contain any wires, although in some embodiments they might not. The communication chip 1706 may implement any of a number of wireless standards or protocols, including but not limited to Wi-Fi (IEEE 802.11 family), WiMAX (IEEE 802.16 family), IEEE 802.20, long term evolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPRS, CDMA, TDMA, DECT, Bluetooth, derivatives thereof, as well as any other wireless protocols that are designated as 3G, 4G, 5G, and beyond. The computing device 1700 may include a plurality of communication chips 1706. For instance, a first communication chip 1706 may be dedicated to shorter range wireless communications such as Wi-Fi and Bluetooth and a second communication chip 1706 may be dedicated to longer range wireless communications such as GPS, EDGE, GPRS, CDMA, WiMAX, LTE, Ev-DO, and others.
The processor 1704 of the computing device 1700 includes an integrated circuit die packaged within the processor 1704. In some implementations of the invention, the integrated circuit die of the processor may be communicatively coupled to an additional die through a self-aligned optical waveguide, in accordance with embodiments described herein. The term “processor” may refer to any device or portion of a device that processes electronic data from registers and/or memory to transform that electronic data into other electronic data that may be stored in registers and/or memory.
The communication chip 1706 also includes an integrated circuit die packaged within the communication chip 1706. In accordance with another implementation of the invention, the integrated circuit die of the communication chip may be communicatively coupled to an additional die through a self-aligned optical waveguide, in accordance with embodiments described herein.
The above description of illustrated implementations of the invention, including what is described in the Abstract, is not intended to be exhaustive or to limit the invention to the precise forms disclosed. While specific implementations of, and examples for, the invention are described herein for illustrative purposes, various equivalent modifications are possible within the scope of the invention, as those skilled in the relevant art will recognize.
These modifications may be made to the invention in light of the above detailed description. The terms used in the following claims should not be construed to limit the invention to the specific implementations disclosed in the specification and the claims. Rather, the scope of the invention is to be determined entirely by the following claims, which are to be construed in accordance with established doctrines of claim interpretation.
Example 1: an electronic package, comprising: a package substrate; a first die over the package substrate; a second die over the package substrate; and an optical waveguide on the package substrate, wherein a first end of the optical waveguide is below the first die and a second end of the optical waveguide is below the second die, and wherein the optical waveguide communicatively couples the first die to the second die.
Example 2: the electronic package of Example 1, wherein the first end of the optical waveguide and the second end of the optical waveguide comprise sloped surfaces.
Example 3: the electronic package of Example 1 or Example 2, wherein the optical waveguide comprises a material with an index of refraction greater than 1.0.
Example 4: the electronic package of Examples 1-3, wherein the optical waveguide comprises air.
Example 5: the electronic package of Example 4, wherein the optical waveguide comprises a reflective cladding around the air.
Example 6: the electronic package of Examples 1-5, wherein the optical waveguide is above the package substrate.
Example 7: the electronic package of Examples 1-6, wherein a top surface of the optical waveguide contacts air or an index matching fluid or gel.
Example 8: the electronic package of Examples 1-7, further comprising: a first reflective structure at the first end of the optical waveguide and a second reflective structure at the second end of the optical waveguide.
Example 9: the electronic package of Example 8, wherein the first reflective structure and the second reflective structure have trapezoidal cross-sections with a triangular notch in a bottom surface.
Example 10: the electronic package of Example 9, wherein the first reflective structure is connected to the second reflective structure by a reflective layer.
Example 11: the electronic package of Example 8, wherein the first reflective structure and the second reflective structure have parallelogram shaped cross-sections.
Example 12: the electronic package of Example 11, wherein the first reflective structure is a mirror image of the second reflective structure.
Example 13: an electronic package, comprising: a package substrate; and an optical waveguide embedded in the package substrate, wherein the optical waveguide comprises a first end with a sloped surface.
Example 14: the electronic package of Example 13, wherein a reflective structure is adjacent to the first end.
Example 15: the electronic package of Example 14, wherein the reflective structure comprises a trapezoidal cross-section.
Example 16: the electronic package of Example 15, wherein a triangular notch is provided on a bottom surface of the reflective structure.
Example 17: the electronic package of Example 16, wherein the triangular notch defines a void in the package substrate.
Example 18: the electronic package of Example 14, wherein the reflective structure comprises a parallelogram shaped cross-section.
Example 19: the electronic package of Examples 13-18, wherein the optical waveguide comprises a material with an index of refraction greater than 1.0.
Example 20: the electronic package of Examples 13-19, wherein the optical waveguide comprises air.
Example 21: the electronic package of Example 20, wherein the optical waveguide further comprises a reflective cladding.
Example 22: the electronic package of Examples 13-21, wherein a second end of the optical waveguide is at an edge of the package substrate.
Example 23: an electronic system, comprising: a board; a package substrate attached to the board; a first die over the package substrate; a second die over the package substrate; and an optical waveguide on the package substrate, wherein the optical waveguide comprises a first end and a second end, and wherein the first end and the second end are sloped to allow for communicative coupling between the first die and the second die.
Example 24: the electronic system of Example 23, further comprising: a first reflective structure adjacent to the first end and a second reflective structure adjacent to the second end, wherein the first reflective structure is a mirror image of the second reflective structure.
Example 25: the electronic system of Example 23 or Example 24, wherein the optical waveguide comprises a material with an index of refraction greater than 1.0.
Patent Application
20220196914
