Arrangements for conducting electric current to or from the solid state body in operation

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/48Arrangements for conducting electric current to or from the solid state body in operation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit die with memory macro including through-silicon...
- Patent number 12,308,303
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hidehiro Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved interposer structure
- Patent number 12,308,313
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging architecture for disaggregated integrated voltage regulators
- Patent number 12,308,362
- Issue date May 20, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,363
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for semiconductor device having gate spacer pr...
- Patent number 12,308,238
- Issue date May 20, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly with hybrid bonding
- Patent number 12,300,655
- Issue date May 13, 2025
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,300,608
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a dummy section
- Patent number 12,300,543
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Osamu Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,665
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Jang-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,300,560
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Ming-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inorganic-based embedded-die layers for modular semiconductive devices
- Patent number 12,300,620
- Issue date May 13, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets 3D SoIC system integration and fabrication methods
- Patent number 12,300,646
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,300,580
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsu-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold through silicon mask plating
- Patent number 12,293,943
- Issue date May 6, 2025
- Lam Research Corporation
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor integrated circuit comprising master chip with first...
- Patent number 12,293,990
- Issue date May 6, 2025
- SK hynix Inc.
- Yun Gi Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including hard macro
- Patent number 12,293,958
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Jong Doo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor package including memory array
- Patent number 12,293,999
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Feng Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip packages and a chip package
- Patent number 12,293,986
- Issue date May 6, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,293,989
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Minjung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,293,991
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench capacitor array with reduced warpage
- Patent number 12,294,033
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-circuit Vias in interconnect structures
- Patent number 12,293,959
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including heat dissipation structure
- Patent number 12,293,996
- Issue date May 6, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Moon Hee Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffered top thin film resistor, MIM capacitor, and method of formi...
- Patent number 12,289,919
- Issue date Apr 29, 2025
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Venkata Mangathayaru Bollam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with source/drain contact
- Patent number 12,288,822
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal based hydrogen barrier
- Patent number 12,288,717
- Issue date Apr 29, 2025
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,288,745
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Donguk Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,288,780
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Ju-Youn Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shared well structure manufacturing method
- Patent number 12,288,786
- Issue date Apr 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang Zhou
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20250165420
- Publication date May 22, 2025
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20250167126
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR CHIP INCLUDING SEMICONDUCTOR...
- Publication number 20250167144
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Junho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES FORMED USING RDL-LAST PROCESS
- Publication number 20250167173
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A BACKSIDE PACKAGE ARCHITECTURE
- Publication number 20250167193
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS WITH SELECTED GRAIN DISTRIBUTION
- Publication number 20250167046
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR ON-CHIP HEAT ROUTING ARCHITECTURES
- Publication number 20250167064
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Radwanul Hasan SIDDIQUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...
- Publication number 20250167078
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167178
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Youngkun JEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UTILIZING MEMORY CHIP THROUGH-SILICON VIAS FOR CONNECTING LOGIC CHI...
- Publication number 20250167191
- Publication date May 22, 2025
- International Business Machines Corporation
- Robert K. Montoye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK
- Publication number 20250167180
- Publication date May 22, 2025
- Intel Corporation
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE
- Publication number 20250167075
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE PLACEHOLDERS AND SELF ALIGNED BACKSIDE CONTACTS
- Publication number 20250167076
- Publication date May 22, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE USING DIFFERENT TYPES OF THROUGH-SILICON-VIAS
- Publication number 20250169067
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jaesan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES WITH THROUGH VIA
- Publication number 20250167077
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ke-Gang Wen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250167147
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jaesic Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250169048
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jeewoong Kim
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF IMPLEMENTING REDISTRIBUTION LAY...
- Publication number 20250167174
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Yunseok YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250153999
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Ki Yeul YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE
- Publication number 20250157948
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- MINJUNG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DUMMY PADS AND MANUFACTURING METHOD...
- Publication number 20250157962
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- HANSUNG RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157980
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jinkyeong SEOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250157890
- Publication date May 15, 2025
- Japan Display Inc.
- Takamitsu FUJIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
- Publication number 20250157930
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20250159895
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING TSV AND MANUFACTURING METHOD THEREOF
- Publication number 20250157887
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250157888
- Publication date May 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157908
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157983
- Publication date May 15, 2025
- SAMSUNG ELECTRONICS CO., LTD.
- HYUNGJUN JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20250157991
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements for conducting electric current to or from the solid state body in operation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit die with memory macro including through-silicon...

Semiconductor package with improved interposer structure

Packaging architecture for disaggregated integrated voltage regulators

Semiconductor package

Method and structure for semiconductor device having gate spacer pr...

Integrated circuit assembly with hybrid bonding

Backside contact for thermal displacement in a multi-wafer stacked...

Method of manufacturing semiconductor device

Method for manufacturing a semiconductor device having a dummy section

Semiconductor package

Semiconductor device package and method of manufacturing the same

Inorganic-based embedded-die layers for modular semiconductive devices

Chiplets 3D SoIC system integration and fabrication methods

Semiconductor device and method

Gold through silicon mask plating

Semiconductor integrated circuit comprising master chip with first...

Semiconductor device including hard macro

3D semiconductor package including memory array

Method for forming chip packages and a chip package

Semiconductor package

Semiconductor packages and methods of forming same

Deep trench capacitor array with reduced warpage

Through-circuit Vias in interconnect structures

Semiconductor package including heat dissipation structure

Buffered top thin film resistor, MIM capacitor, and method of formi...

Semiconductor device with source/drain contact

Metal based hydrogen barrier

Semiconductor package

Semiconductor package

Shared well structure manufacturing method

Patents Applicationslast 30 patents

Stacked Semiconductor Device Assembly in Computer System

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR CHIP INCLUDING SEMICONDUCTOR...

PACKAGES FORMED USING RDL-LAST PROCESS

SYSTEM AND METHODS FOR A BACKSIDE PACKAGE ARCHITECTURE

VIAS WITH SELECTED GRAIN DISTRIBUTION

SYSTEM AND METHODS FOR ON-CHIP HEAT ROUTING ARCHITECTURES

SEMICONDUCTOR DIE INCLUDING FUSE STRUCTURE AND METHODS FOR FORMING...

SEMICONDUCTOR PACKAGE

UTILIZING MEMORY CHIP THROUGH-SILICON VIAS FOR CONNECTING LOGIC CHI...

INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURE

BACKSIDE PLACEHOLDERS AND SELF ALIGNED BACKSIDE CONTACTS

SEMICONDUCTOR DEVICE USING DIFFERENT TYPES OF THROUGH-SILICON-VIAS

SEMICONDUCTOR STRUCTURES WITH THROUGH VIA

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF IMPLEMENTING REDISTRIBUTION LAY...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH CRACK-PREVENTING STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING DUMMY PADS AND MANUFACTURING METHOD...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE

DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING TSV AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

WAFER RECONSTITUTION AND DIE-STITCHING