Arrangements for conducting electric current to or from the solid state body in operation

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/48Arrangements for conducting electric current to or from the solid state body in operation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 12,322,730
- Issue date Jun 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having composite seed-barrier layer and metho...
- Patent number 12,322,682
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 12,322,683
- Issue date Jun 3, 2025
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated design for III-Nitride devices
- Patent number 12,324,180
- Issue date Jun 3, 2025
- Transphorm Technology, Inc.
- Yifeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local interconnect for cross coupling
- Patent number 12,322,652
- Issue date Jun 3, 2025
- International Business Machines Corporation
- Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having backside interconnect structure on thro...
- Patent number 12,322,680
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 12,322,681
- Issue date Jun 3, 2025
- SK hynix Inc.
- Seung Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including through substrate via barrier structure...
- Patent number 12,322,679
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 12,322,706
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 12,324,268
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit package having a padding la...
- Patent number 12,322,726
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hsien Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing die stack structure
- Patent number 12,322,728
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, method for forming same, and wafer on wafe...
- Patent number 12,322,654
- Issue date Jun 3, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yuanhao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of resistance and capacitance reduction to circuit output n...
- Patent number 12,324,228
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Chia Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hybrid bonding technology for stacking integrated circuits
- Patent number 12,315,843
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,315,784
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package comprising a package-on-package (POP) arch...
- Patent number 12,315,777
- Issue date May 27, 2025
- Intel Corporation
- Elizabeth Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage layers for wafer bonding
- Patent number 12,315,837
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Yang Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,315,842
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having heat dissipation structure
- Patent number 12,315,774
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side signal routing in a circuit with a relay cell
- Patent number 12,315,804
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Wei Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices including a metal resistor and methods o...
- Patent number 12,317,582
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die with memory macro including through-silicon...
- Patent number 12,308,303
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hidehiro Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved interposer structure
- Patent number 12,308,313
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging architecture for disaggregated integrated voltage regulators
- Patent number 12,308,362
- Issue date May 20, 2025
- Intel Corporation
- Kaladhar Radhakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,308,363
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Manho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for semiconductor device having gate spacer pr...
- Patent number 12,308,238
- Issue date May 20, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chih Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly with hybrid bonding
- Patent number 12,300,655
- Issue date May 13, 2025
- QUALCOMM Incorporated
- Jonghae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact for thermal displacement in a multi-wafer stacked...
- Patent number 12,300,669
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Tzu Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
- Publication number 20250183180
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20250183213
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND SYSTEMS INCLUDING STACKED LOGIC DIES
- Publication number 20250183226
- Publication date Jun 5, 2025
- ADVANCED MICRO DEVICES, INC.
- Russell Schreiber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE ARCHITECTURE FOR REDUCED CYCLES ACROSS SOC
- Publication number 20250183228
- Publication date Jun 5, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE NOISE ISOLATION STRUCTURES FOR ELECTRONIC DEVICES
- Publication number 20250185311
- Publication date Jun 5, 2025
- Xilinx, Inc.
- Jing JING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183241
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250183126
- Publication date Jun 5, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Hidekazu NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER STAGE PACKAGE WITH HALF BRIDGE-CONNECTED TRANSISTOR CHIPS AND...
- Publication number 20250183232
- Publication date Jun 5, 2025
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250183243
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183246
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sang Cheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SYSTEMS WITH VERTICAL INTEGRATION
- Publication number 20250182796
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh Lee
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20250183121
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- JUBIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-VIA DEVICE, LAYOUT, AND METHOD
- Publication number 20250183157
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jia-Hong GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250183206
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Enbin JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183194
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Jingyu BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME
- Publication number 20250183203
- Publication date Jun 5, 2025
- Medtronic, Inc.
- Mark E. Henschel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE
- Publication number 20250183210
- Publication date Jun 5, 2025
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED JUMPER CONNECTION
- Publication number 20250185291
- Publication date Jun 5, 2025
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250183122
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Seung Ha Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Connection System and Method
- Publication number 20250174591
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20250174599
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jihoon JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250174522
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Dongkyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...
- Publication number 20250174495
- Publication date May 29, 2025
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION
- Publication number 20250174523
- Publication date May 29, 2025
- Intel Corporation
- Ravindranath MAHAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE (CSP) SEMICONDUCTOR DEVICE HAVING THIN SUBSTRATE
- Publication number 20250174524
- Publication date May 29, 2025
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Lin Lv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250174517
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chao Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250174540
- Publication date May 29, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Chih YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Semiconductor Device Assembly in Computer System
- Publication number 20250165420
- Publication date May 22, 2025
- Rambus Inc.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME
- Publication number 20250167126
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements for conducting electric current to or from the solid state body in operation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device and method for UBM/RDL routing

Wafer reconstitution and die-stitching

Semiconductor package having composite seed-barrier layer and metho...

Power module semiconductor device and inverter equipment, and fabri...

Integrated design for III-Nitride devices

Local interconnect for cross coupling

Semiconductor device having backside interconnect structure on thro...

Semiconductor chip including through electrode, and semiconductor p...

Semiconductor die including through substrate via barrier structure...

Chip package and method of forming the same

Image sensor device

Method of forming an integrated circuit package having a padding la...

Method of manufacturing die stack structure

Semiconductor structure, method for forming same, and wafer on wafe...

Methods of resistance and capacitance reduction to circuit output n...

Hybrid bonding technology for stacking integrated circuits

Semiconductor package and manufacturing method thereof

Microelectronics package comprising a package-on-package (POP) arch...

Storage layers for wafer bonding

Package structure

Semiconductor structure having heat dissipation structure

Back side signal routing in a circuit with a relay cell

Integrated circuit devices including a metal resistor and methods o...

Integrated circuit die with memory macro including through-silicon...

Semiconductor package with improved interposer structure

Packaging architecture for disaggregated integrated voltage regulators

Semiconductor package

Method and structure for semiconductor device having gate spacer pr...

Integrated circuit assembly with hybrid bonding

Backside contact for thermal displacement in a multi-wafer stacked...

Patents Applicationslast 30 patents

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

SEMICONDUCTOR DEVICES AND SYSTEMS INCLUDING STACKED LOGIC DIES

SCALABLE ARCHITECTURE FOR REDUCED CYCLES ACROSS SOC

SUBSTRATE NOISE ISOLATION STRUCTURES FOR ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

POWER STAGE PACKAGE WITH HALF BRIDGE-CONNECTED TRANSISTOR CHIPS AND...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

MEMORY SYSTEMS WITH VERTICAL INTEGRATION

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

DUAL-VIA DEVICE, LAYOUT, AND METHOD

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND IMPLANTABLE MEDICAL DEVICE INCLUDING SAME

SEMICONDUCTOR DEVICE AND PACKAGE INCLUDING THE SEMICONDUCTOR DEVICE

EMBEDDED JUMPER CONNECTION

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor Die Connection System and Method

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR STRUCTURE WITH BURIED POWER RAILS AND METHOD OF FABRI...

NESTED ARCHITECTURES FOR ENHANCED HETEROGENEOUS INTEGRATION

CHIP SCALE PACKAGE (CSP) SEMICONDUCTOR DEVICE HAVING THIN SUBSTRATE

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Stacked Semiconductor Device Assembly in Computer System

SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME