Arrangements for conducting electric current to or from the solid state body in operation

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/48Arrangements for conducting electric current to or from the solid state body in operation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure, manufacturing method of semiconductor stru...
- Patent number 12,230,553
- Issue date Feb 18, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing RC delay in semiconductor devices
- Patent number 12,230,574
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method of forming the same
- Patent number 12,232,326
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die on interposer packages
- Patent number 12,230,582
- Issue date Feb 18, 2025
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bumps and method forming same
- Patent number 12,230,595
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield structure for backside through substrate vias (TSVs)
- Patent number 12,230,554
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro interconnect struc...
- Patent number 12,230,559
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,230,560
- Issue date Feb 18, 2025
- Mediatek Inc.
- Che-Hung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with crack-preventing structure
- Patent number 12,230,587
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Minjung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor
- Patent number 12,230,626
- Issue date Feb 18, 2025
- Japan Display Inc.
- Toshinari Sasaki
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Recess structure for padless stack via
- Patent number 12,230,552
- Issue date Feb 18, 2025
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated circuit having through-substrate...
- Patent number 12,223,250
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,221,339
- Issue date Feb 11, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Ki Yeul Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor chip and semiconductor package including the same
- Patent number 12,224,258
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Wonkyun Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip interconnecting method, interconnect device and method for for...
- Patent number 12,224,267
- Issue date Feb 11, 2025
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacking structure and manufacturing method thereof
- Patent number 12,224,265
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure, semiconductor structure and manufacturing met...
- Patent number 12,224,206
- Issue date Feb 11, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with power connect...
- Patent number 12,224,227
- Issue date Feb 11, 2025
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tape for semiconductor package manufacturing process, and...
- Patent number 12,221,569
- Issue date Feb 11, 2025
- MODU TECH CO., LTD.
- Byeong Yeon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV check circuit with replica path
- Patent number 12,224,275
- Issue date Feb 11, 2025
- Micron Technology, Inc.
- Harutaka Makabe
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,218,049
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding to alignment marks with dummy alignment marks
- Patent number 12,218,097
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contact to improve thermal dissipation away from semicondu...
- Patent number 12,218,106
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, method for forming same and stacked structure
- Patent number 12,218,033
- Issue date Feb 4, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die connection system and method
- Patent number 12,218,093
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric devices including a single crystalline ferroelectric...
- Patent number 12,219,776
- Issue date Feb 4, 2025
- SanDisk Technologies LLC
- Adarsh Rajashekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 12,218,098
- Issue date Feb 4, 2025
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor bidirectional switching device and meth...
- Patent number 12,218,128
- Issue date Feb 4, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Qiyue Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked interposer structures
- Patent number 12,218,119
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED FET WITH BOTTOM EPI SIZE CONTROL AND WRAPAROUND BACKSIDE CO...
- Publication number 20250062190
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...
- Publication number 20250062216
- Publication date Feb 20, 2025
- SILICON BOX PTE. LTD.
- Sehat SUTARDJA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE FOR A MULTI-CHIP SEMICONDUCTOR PACKAGE
- Publication number 20250062280
- Publication date Feb 20, 2025
- GENERAL ELECTRIC COMPANY
- Ljubisa D. Stevanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250062304
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- SEOKGEUN AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT RESISTANCE REDUCTION
- Publication number 20250062161
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...
- Publication number 20250062193
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Jeonil LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED INTERCONNECT STRUCTURE
- Publication number 20250062195
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250062249
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...
- Publication number 20250063876
- Publication date Feb 20, 2025
- ROHM CO., LTD.
- Masahiko KOBAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062194
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Lung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250062257
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Young-Deuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING EIC TO PIC TO BUILD AN OPTICAL ENGINE
- Publication number 20250062258
- Publication date Feb 20, 2025
- Avago Technologies International Sales Pte. Limited
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Implantation
- Publication number 20250062136
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures for Dual-Thickness Active Area SOI FETS
- Publication number 20250063822
- Publication date Feb 20, 2025
- pSemi Corporation
- Jagar Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME
- Publication number 20250062212
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Ki Won BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250062279
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Sunggu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250062286
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-BONDED MEMORY STACKS WITH COPPER-BONDED INTERCONNECTION MEMO...
- Publication number 20250062306
- Publication date Feb 20, 2025
- Avago Technologies International Sales Pte. Limited
- Thomas Edward Dungan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HARD IP BLOCKS WITH PHYSICALLY BIDIRECTIONAL PASSAGEWAYS
- Publication number 20250062191
- Publication date Feb 20, 2025
- Adeia Semiconductor Inc.
- Javier A. DeLaCruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING DISCHARGING PATH AND METHODS O...
- Publication number 20250062192
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- JAEHONG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING DUMMY STRUCTURE AT CORNER REGION T...
- Publication number 20250062210
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Seongyo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250062277
- Publication date Feb 20, 2025
- Macronix International Co., Ltd.
- Shih-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062302
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250062303
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20250054870
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- WOONCHUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-REDUCTION STRUCTURES FOR A COMPOUND SEMICONDUCTOR LAYER STACK
- Publication number 20250054908
- Publication date Feb 13, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Brett Cucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINATION-TYPE SEMICONDUCTOR PACKAGE FOR IMPROVING PACKAGE RELIAB...
- Publication number 20250054852
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Chulho Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MA...
- Publication number 20250054916
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jimin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE THAT INCLUDES A MULTI-BRIDGE CHANNEL FIELD EFF...
- Publication number 20250056843
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Jong Min SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREFOR
- Publication number 20250054838
- Publication date Feb 13, 2025
- Institute of Microelectronics, Chinese Academy of Sciences
- Guanhua YANG
- H01 - BASIC ELECTRIC ELEMENTS

Arrangements for conducting electric current to or from the solid state body in operation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure, manufacturing method of semiconductor stru...

Reducing RC delay in semiconductor devices

Memory device and method of forming the same

Embedded die on interposer packages

Metal bumps and method forming same

Shield structure for backside through substrate vias (TSVs)

Semiconductor device and method of forming micro interconnect struc...

Semiconductor package structure

Semiconductor device with crack-preventing structure

Transistor

Recess structure for padless stack via

Method of manufacturing integrated circuit having through-substrate...

Semiconductor device and method of manufacturing semiconductor device

Semiconductor chip and semiconductor package including the same

Stacked semiconductor device assembly in computer system

Chip interconnecting method, interconnect device and method for for...

Three-dimensional stacking structure and manufacturing method thereof

Conductive structure, semiconductor structure and manufacturing met...

Method for manufacturing semiconductor structure with power connect...

Adhesive tape for semiconductor package manufacturing process, and...

TSV check circuit with replica path

Semiconductor structure and method for forming the same

Bonding to alignment marks with dummy alignment marks

Backside contact to improve thermal dissipation away from semicondu...

Semiconductor structure, method for forming same and stacked structure

Semiconductor die connection system and method

Ferroelectric devices including a single crystalline ferroelectric...

Chip assembling on adhesion layer or dielectric layer, extending be...

Nitride-based semiconductor bidirectional switching device and meth...

Stacked interposer structures

Patents Applicationslast 30 patents

STACKED FET WITH BOTTOM EPI SIZE CONTROL AND WRAPAROUND BACKSIDE CO...

METHOD OF MANUFACTURING FAN-OUT PACKAGING DEVICE AND FAN-OUT PACKAG...

POWER OVERLAY STRUCTURE FOR A MULTI-CHIP SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

BACKSIDE CONTACT RESISTANCE REDUCTION

SEMICONDUCTOR DEVICE INCLUDING THROUGH-SILICON VIA AND METHOD OF FO...

SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED INTERCONNECT STRUCTURE

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHOD FOR ASSEMBLING EIC TO PIC TO BUILD AN OPTICAL ENGINE

Packages with Implantation

Contact Structures for Dual-Thickness Active Area SOI FETS

SEMICONDUCTOR PACKAGES AND ELECTRONIC DEVICES INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

COPPER-BONDED MEMORY STACKS WITH COPPER-BONDED INTERCONNECTION MEMO...

HARD IP BLOCKS WITH PHYSICALLY BIDIRECTIONAL PASSAGEWAYS

INTEGRATED CIRCUIT DEVICES INCLUDING DISCHARGING PATH AND METHODS O...

SEMICONDUCTOR PACKAGE COMPRISING DUMMY STRUCTURE AT CORNER REGION T...

MEMORY DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

STRESS-REDUCTION STRUCTURES FOR A COMPOUND SEMICONDUCTOR LAYER STACK

COMBINATION-TYPE SEMICONDUCTOR PACKAGE FOR IMPROVING PACKAGE RELIAB...

THERMAL PAD, SEMICONDUCTOR CHIP INCLUDING THE SAME AND METHOD OF MA...

SEMICONDUCTOR DEVICE THAT INCLUDES A MULTI-BRIDGE CHANNEL FIELD EFF...

THREE-DIMENSIONAL INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREFOR