Aspects of the present invention relate to a wire saw work piece support device for supporting a work piece being sawed by a wire saw during sawing. More particularly, the work piece may be a hard material such as a block of silicon or quartz, e.g., for a silicon wafer. The wire saw may be a squarer, a cropper or the like. Further aspects of the present invention relate to a wire saw work piece support spacer adapted for a wire saw work piece support device, and to a method of sawing a work piece using a wire saw.
Wire saw devices exist for cutting blocks or bricks, thin slices, e.g., semiconductor wafers, from a piece of hard material such as silicon. In such devices a stretched wire is fed from a spool and is both guided and tensioned by wire guide cylinders. For sawing, a wire web is created by the wire being guided by the guide cylinders. The wire web includes sawing wire sections, which are the portions of the wire web in which the actual sawing is performed, i.e., at which a cut is created in the work piece.
The wire that is used for sawing is generally provided with an abrasive material. As one option, the abrasive material can be provided as a slurry. This may be done shortly before the wire touches the material to be cut. Thereby, the abrasive is carried to the cutting position by the wire for cutting the material. As another option, the abrasive can be provided on the wire with a coating. For example, diamond particles can be provided on a metal wire with a coating, wherein the diamond particles are imbedded in the coating of the wire. Thereby, the abrasive is firmly connected with the wire.
Generally, the productivity of a wire saw is limited by several factors including the cutting speed (which in turn depends on parameters such as the speed at which the wire is transported, the abrasive used, etc.), the number of work pieces that can be sawed in parallel, the failure rate resulting in maintenance downtime, and other downtime. For wire saws that cut silicon ingots or blocks used for solar panels, the productivity can be given in MW of solar panels sawed per hour.
After the sawing of a work piece (e.g., a semiconductor ingot or semiconductor block, for example for solar panels) has been completed, the sawing wire sections of the wire web have been moved into or through the ingot thereby creating a cut therein. Due to their finite tension, the sawing wire sections do not form a perfectly straight line during sawing, but they rather form a bow, with the parts closer to a border of the work piece having cut more through the work piece than the parts that are deeper in the interior of the work piece. The bow can have a different shape for each of the wire saw sections, depending on their relative tension. Due to these bows, it is difficult to define a proper end of the sawing process. Typically, the sawing process ends before the cut in the work piece has been fully completed. For example, patent application US 2007/0283944 A1 shows a method in which end portions of blocks are not cut. These end portions act as stabilizing support abutments for the wafers during sawing and subsequent removal and washing procedures.
After sawing, the wire is cut so that the work piece can be removed. Thereby, the wire web is destroyed and needs to be rebuilt before the next work piece can be sawed. This means that wire is wasted and that the productivity of the wire saw is reduced.
In view of the above, a wire saw work piece support device according to claim 1, a wire saw work piece support spacer according to claim 8, the uses thereof according to claims 16 and 17, a method according to claim 18, and a wire saw device according to claim 25 are provided. Further advantages, features, aspects and details are apparent from the dependent claims, the description and drawings.
According to one embodiment, a wire saw work piece support device is provided. The saw work piece support device has a support surface adapted for supporting a work piece being sawed by a wire saw during sawing, the support surface defining a support plane, which may be the plane at which the work piece is supported during sawing. The wire saw work piece support device includes: a solid support body; and at least one wire receiving volume for receiving therein a wire of the wire saw during sawing, the at least one wire receiving volume having a work piece side delimited by the support plane, and a base side delimited by a surface portion of the solid support body. The at least one wire receiving volume has a thickness between the work piece side and the base side of at least 60 mm, and in embodiments of more than 70 mm or even more than 80 mm, in a direction orthogonal to the support plane. A further embodiment is directed to the use of the above-described wire saw work piece support device for supporting a work piece in a wire saw device.
According to a further embodiment, a wire saw work piece support spacer is provided. The wire saw work piece support spacer is adapted for a wire saw work piece support device, e.g., one according to any one of the embodiments described herein. The wire saw work piece support spacer has a support surface adapted for supporting a work piece being sawed by a wire saw during sawing, the support surface defining a support plane, at which the work piece may be supported during sawing, and a base surface adapted for being supported by a solid support body of the wire saw work piece support device, and at least one wire receiving portion defining a respective wire receiving volume for receiving therein a wire of the wire saw having sawn through the work piece. The at least one wire receiving portion is arranged between the support surface and a portion of the base surface. The at least one wire receiving portion includes, and in embodiments is made of, a solid material sawable by the wire saw wire. The at least one wire receiving portion further has a thickness between the support surface and the base surface portion of at least 60 mm, and in embodiments of more than 70 mm or even more than 80 mm, in a direction orthogonal to the support plane. A further embodiment is directed to the use of the above-described wire saw work piece support spacer for supporting a work piece in a wire saw device.
According to a further embodiment, a method of sawing a work piece using a wire saw is provided. The wire saw has a work piece support device and a support spacer, e.g. according to any embodiment described herein. The method includes:
Providing a solid support body of the work piece support device, the solid support body having a spacer support surface;
Providing the support spacer, the support spacer having a work piece support surface, a base surface and at least one wire receiving portion defining a respective wire receiving volume for receiving therein a wire of the wire saw, the at least one wire receiving portion being arranged between the support surface and a portion of the base surface, wherein the at least one wire receiving portion includes a solid material sawable by the wire saw wire;
Placing the support spacer with its base surface onto the spacer support surface, so that the support spacer is supported by the solid support body;
Placing the work piece onto the work piece support surface of the support spacer, possibly before the placing of the support spacer onto the spacer support surface, so that as a result of the placing steps, irrespective of their order, the support spacer is sandwiched between the support body and the work piece; and
Sawing through at least a portion of the work piece by a sawing wire section of a wire of the wire saw, thereby creating a cut in the work piece, so that at least a part of the sawing wire section leaves the work piece from the cut and is received in the at least one wire receiving portion or volume;
sawing, by the part of the wire section received in the at least one wire receiving portion, into the solid material included in the at least one wire receiving portion, thereby creating a cut in the solid material; and
retracing the at least one sawing wire section through the cut in the solid material and optionally also through the cut in the work piece.
According to a further embodiment, a wire saw device, includes a wire saw work piece support device, a wire saw work piece support spacer, and a controller having a controller memory, the controller memory having stored thereon program code for performing a method of sawing a work piece using a wire saw. The method includes:
Providing a solid support body of the work piece support device, the solid support body having a spacer support surface;
Providing the support spacer, the support spacer having a work piece support surface, a base surface and at least one wire receiving portion defining a respective wire receiving volume for receiving therein a wire of the wire saw, the at least one wire receiving portion being arranged between the support surface and a portion of the base surface, wherein the at least one wire receiving portion includes a solid material sawable by the wire saw wire;
Placing the support spacer with its base surface onto the spacer support surface, so that the support spacer is supported by the solid support body;
Placing the work piece onto the work piece support surface of the support spacer, possibly before the placing of the support spacer onto the spacer support surface, so that as a result of the placing steps, irrespective of their order, the support spacer is sandwiched between the support body and the work piece; and
Sawing through at least a portion of the work piece by a sawing wire section of a wire of the wire saw, thereby creating a cut in the work piece, so that at least a part of the sawing wire section leaves the work piece from the cut and is received in the at least one wire receiving portion or volume;
sawing, by the part of the wire section received in the at least one wire receiving portion, into the solid material included in the at least one wire receiving portion, thereby creating a cut in the solid material; and
retracing the at least one sawing wire section through the cut in the solid material and optionally also through the cut in the work piece.
Embodiments are also directed at apparatuses for carrying out the disclosed methods and including apparatus parts for performing each described method step. These method steps may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to aspects of the invention are also directed at methods by which the described apparatus operates. It includes method steps for carrying out every function of the apparatus.
So that the manner in which the above recited features of aspects of the present invention can be understood in detail, a more particular description of aspects of the invention, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the invention and are described in the following:
a to 1c illustrate sawing steps during the production of a silicon wafer;
a shows a perspective view of a support device according to an embodiment of the invention; and
a to 9d illustrate steps of a method of sawing a work piece; and
Reference will now be made in detail to the various embodiments of the invention, one or more examples of which are illustrated in the figures. Within the following description of the drawings, the same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation of aspects of the invention and is not meant as a limitation of the invention. Further, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.
Furthermore, in the following description, a wire management unit will be understood as a device handling the supply of wire to a working area of a wire saw device, such as a cropper, a squarer, or a wafer cutting wire saw. Typically, the wire saw includes a wire guide for transporting and guiding the wire in a wire moving direction while the wire management unit provides control of the wire tension. Furthermore, the wire provided by the wire management unit forms a wire web as described above. In the following, a wire web will be considered as the web formed by a single wire management unit. It should be understood that a wire web may contain more than one working area which is defined as an area in which a sawing process is performed.
The basic sawing steps performed during the production of thin semiconductor wafers (such as multi-crystalline silicone wafers).
The wire saw device (squarer) 1 of
The first wire handling section 22 and the second wire handling section 24 of the wire management unit 20 each have a wire spool and a plurality of pulleys for redirecting the wire 10 towards the wire web 12 in the working area 40. Further, in the working area 40, a plurality of pulleys 44 and wire guides 42 are arranged for guiding the wire such that the wire web 12 is created. In
Further, the wire management unit has a coolant system 30. The coolant system 30 includes a coolant tank 36 for storing coolant (generally slurry or water-based coolant), a coolant supply line 32 for supplying coolant from the coolant tank to the working area 40, and a coolant return line 34 for returning the coolant from the working area 40 to the coolant tank 36. The coolant supply line 32 has a plurality of nozzles for spraying the coolant onto the wire 10 within the wire web 12. The nozzles may be arranged along a square-shaped boundary of the wire web 12. While only one supply line 32 is shown, there may be more than one supply line, e.g., a supply line for each side of the square-shaped boundary of the wire web (i.e., a total of four supply lines), each supply line supplying coolant to a plurality of spray nozzles (e.g., six spray nozzles for each of the six wire sections per side of the wire web 12). In the case of diamond wire, slurry is not needed, but it is still advantageous to cool the diamond wire during cutting. In this case the slurry can be replaced by some other coolant, such as a water-based cooling liquid.
During a cutting process by means of the wire saw device 1, the wire 10 is provided from a spool of the first wire handling unit 22. During sawing, the wire 10 is unwound from the spool. Within the first wire handling unit 22, the wire 10 is guided from the spool to some pulleys. The wire 10 is then guided to a cutting area, in which the wire web 12 is formed by the plurality of pulleys 44 and wire guides 42. After sawing, the wire 10 is then guided from the cutting area 40 or wire web 12 to the second wire handling unit 24. Here, the wire is guided, by further pulleys, to a spool of the second wire handling unit 24, and is wound onto the spool.
In the cutting area 40, sawing wire sections of the wire 10 are provided. The sawing wire sections are understood as part of the wire web 12 at a location of the wire web (or of the wire saw) at which a cut in the work piece 100 is to be performed, e.g., cut 101a or 101b. Generally, the wire 10 is transported through the sawing wire section so that, at different moments, different actual wire material is present in the sawing wire section. The sawing wire section is defined by the location in the wire saw, and not by the specific material of the wire being transported therethrough. The work piece 100 is now sawed by moving the sawing wire sections of the wire 10 in a sawing direction relative to the work piece (100), i.e., either the work piece is moved towards and into the sawing wire sections, or the sawing wire sections are moved towards and into the work piece. This movement is generally in a direction perpendicular to the drawing plane of
Due to the finite wire tension of the wire 10 in the wire web 12, the sawing wire sections do not form a perfectly straight line during sawing, but they rather form a bow, with the parts closer to a border of the work piece having cut more deeply through the work piece than the parts that are more in the interior of the work piece.
Further, it has been found useful to displace first sawing wire sections (i.e., the parallel wire sections performing the cuts 101a in
Aspects of the invention allow the wire 10 to fully cut through the work piece. Cutting fully through the work piece allows using also an end of the work piece which previously could not be used in the subsequent processing steps, hence increasing productivity. To this purpose, referring to
The wire saw work piece support device 200 includes a solid support body 210. The support body 210 is made of a material that is so hard that it is not adapted for being sawed by the wire saw during normal sawing. Thus, the support body 210 is made of, e.g., metal. The upper surface of the support body 210 is a support surface 214 on which the work piece 100 can be supported during sawing, as shown in
Further, the solid support body 210 has four first grooves 220 and four second grooves 230 formed therein. The first grooves 220 extend in a first direction parallel to the support plane, and the second grooves 230 extend in a second direction along the support plane orthogonal to the first direction. The first and second grooves extend, each, from one respective end of the support surface to the respective opposite end of the support surface. The first grooves 220 are parallel to each other; and also the second grooves 230 are parallel to each other.
The grooves 220, 230 define respective wire receiving volumes (also designated with reference signs 220, 230), in which the wire 10 of the wire saw 1 can be received during sawing. Thus, the at least one wire receiving volume 220, 230 includes the interior of the respective first or second grooves. Due to the presence of the wire receiving volumes, even if the wire is not straight but forms a bow due to its finite tension, the wire is enabled to cut completely through the work piece 100, because the parts of the sawing wire section having completed the cut can be received in the wire receiving volumes of the grooves 220, 230. To this purpose, the grooves 230, 240 are aligned with the respective sawing wire sections performing the cuts, e.g., the cuts 101a, 101b (also shown in
The wire receiving volumes of the grooves 220, 230 are the volumes between the support plane (defining work piece sides of the respective wire receiving volumes) and the bottom of the grooves 224 (defining base sides of the respective wire receiving volumes). The grooves 220, 230 have a depth (i.e., a thickness of the wire receiving volume between the work piece side and the base side) of at least 60 mm in a direction orthogonal to the support plane (vertical direction in
Referring to
As a further aspect, gripper openings 219 are provided on opposing side faces of the support body 210. The gripper openings 219 allow a gripper to grip the support structure, thus enabling easier transport of the work piece supported by the gripper. Hence, as a further aspect, the support device 200 is removable from the wire saw device. As a further aspect, openings in a bottom side 216 (the side of the support body 210 opposite to the support plane, not shown) allow an easy and reliable alignment of the support device 200 in the wire saw device.
As a further aspect, the first grooves are spaced from one another at a fixed distance (center-to-center). The distance here is between 100 mm and 200 mm, more specifically between and 140 mm and 170 mm, and specifically about 156 mm (with a tolerance of about 1 to 5 mm). Similarly, as a further aspect, the second grooves are spaced from one another at a fixed distance (center-to-center). The distance here is also between 100 mm and 200 mm, more specifically between and 140 mm and 170 mm, and specifically about 156 mm (with a tolerance of about 1 to 5 mm). The total extension of the support body 210 along the support plane may be 900 mm in a first direction (along the first grooves 220), and also 900 mm in a second direction (along the second grooves 230). The outermost grooves 220 and/or 230 may be arranged at a distance from the border of the support body. This distance may be between 20 mm and 60 mm, especially between 40 mm and 50 mm, especially about 43 mm (with a tolerance of about 1 to 5 mm).
With reference to
Further, the depth of the grooves, or wire receiving volumes 220, 230 (between the work piece side 222 delimited by the support plane, and the base side 224 delimited by a surface portion of the solid support body 210, i.e., the bottom of the groove) is 80 mm. Thus, the distance between the base side 224 and the bottom side 216 of the support body is 20 mm. As a general aspect, the distance between the base side 224 and the bottom side 216 of the support body is smaller than the thickness between the work piece side and the base side of the wire receiving volume. The length of grooves is generally, as is also shown in
In the following, some possible variations of the support body 210 of
Further, generally the first and/or second grooves may have a depth of at least 60 mm, of at least 70 mm, or even of at least 80 mm in a direction orthogonal to the support plane.
Referring to
Further, the base surface 316 of the spacer body 310 has first protrusions 320 extending longitudinally and in parallel to each other in a first direction along the base surface 316, and second protrusions 330 extending longitudinally and in parallel to each other in a second direction along the base surface, the second direction being orthogonal to the first direction. The second protrusions 330 intersect the first protrusions 320 such as to form a web of protrusions. The protrusions 320 and 330 match the corresponding grooves 220 and 230 of the support body 210.
The protrusions 320, 330 include, or are even made of, a solid material sawable by the wire saw wire 10. Thus, as can be seen in
According to an embodiment, the height of the protrusions from the surface 316 to surface portion 324 is 60 mm (and hence the depth of the grooves 220 from the surface 214 to surface portion 224 is also 60 mm), and the total height of the support spacer body 310, from the surface 314 to surface portion 324 is 60 mm. Accordingly, the protrusions 320, 330 have a thickness between the support surface 314 and the base surface portion 324 of 70 mm in a direction orthogonal to the support plane. According to other embodiments, the thickness between the support surface 314 and the base surface portion 324 may be at least 60 mm (e.g., 50 mm for the protrusions plus 10 mm), at least 70 mm, or even at least 80 mm. The length of protrusions is generally, as is also shown in
The sawable material of the protrusions 320, 330 can be, e.g., a resin such as polyurethane (possibly further including additives and/or filler material or filler space). As a general aspect, the support spacer including the protrusions 320, 330 is made as a single-piece unit, i.e., made integrally of one single piece.
Further, a protection cover 400 is wrapped around side faces of the work piece 100. The protection cover 400 enhances further the stability of the work piece 100 even after sawing and reduces the risk of damage of the work piece. Further, the risk of the wire 10 leaving the material to be sawed is reduced even if the work piece should be irregularly shaped or slightly misaligned. Further, the protection cover 400 may cooperate with the fixation elements 218 (see
As can be seen in
As a further advantage, the sawable material of the protrusions may damp vibrations of the wire 10, which would otherwise occur if the wire was in free space. Due to the damped vibrations, the sawing operation is performed more smoothly. Especially the cut at the end of the work piece supported by the support surface 314 is improved by the damping of the vibrations.
A further advantage is that, due to the support spacer, a method of sawing is enabled which includes retracing a sawing wire section of the wire 10, as is described in more detail with reference to
A possible variation of the embodiment of
As further variation, there may be provided any number of wire receiving portions, e.g., only one wire receiving portion. Generally, according to an embodiment, there is provided a plurality of wire receiving portions, e.g., two times six wire receiving portions as shown in
a to 9d illustrate steps of a method of sawing a work piece according to a further embodiment. This method is enabled by the work piece support device and by the support spacer described above. As shown in
The protrusions 320, 330 include a solid material sawable by the wire saw wire 10, such as polyurethane. As described above with reference to
As shown in
Then, as shown in
As described above, the sawing wire sections are not straight lines due to the finite tension of the wire 10, but rather form a bow. This bow is illustrated in
In
In
c shows the situation in which the wire 10 has been moved so far downward that it has cut completely through the work piece 100, so that the entire sawing wire section of the wire 10 has left the work piece 100 from the cut 101a in the sawing direction after having performed a cut through the work piece. Consequently, the entire sawing wire section of the wire 10 has been received in the support spacer 300, in the groove 220. The entire sawing section of the wire 10 thereby cuts into the wire receiving portion of the support spacer 300, in the sawing direction. Because the wire receiving portion or volume of the support spacer 300 is directly adjacent to the work piece 100, the portion of the sawing wire section of the wire 10 cuts into the wire receiving portion of the support spacer 300 directly after having left the work piece 100. Thus, the cut 101a is fully completed.
Then, as shown in
This method allows removing the work piece 100 from the wire saw after having performed a cut, without destroying the wire web, and especially after fully cutting through the work piece 100. Previously, removal of the work piece 100 generally required the destruction of the wire web. Retracing of the wire as described herein was difficult because when the wire has left a cut in the work piece, it is difficult to retrace the cut. According to the method described herein, the retracing has become possible because the cut is extended into material of the support spacer. Due to the retracing, a destruction of the wire web can be avoided.
In
In addition to the first sawing wire sections, second sawing wire sections are provided (not shown in
In the above description, the support device 200 and the support spacer are according to the embodiment of
As a further variation of the method, the wire could be retraced only through the solid material of the support spacer 300, and not necessarily through the cut 101a in the work piece 100. For example, the work piece 100 may be removed from the wire saw before retracing the wire.
In the following, some general aspects of the embodiments described herein will be summarized. Each of these general aspects can be combined with any other general aspect, within any embodiment described herein, to generate yet another embodiment.
According to an aspect, a wire saw device and/or portions thereof such as the wire handling portions or the working area can be adapted for diamond wire, and methods of operating can be performed with diamond wire. This can, for example, be done by adapting the groove structure of pulleys and guiding elements with an appropriate pitch of grooves, a different depth of grooves and/or a different shape of grooves than for conventional such elements. Thereby, typically the cutting speed can be increased, e.g., by a factor of 2, the energy consumption of the wire saw device can be reduced and, further, as yet another example, the costs of squaring silicon ingots or wafering silicon can be significantly reduced.
According to an aspect, a wire saw work piece support device has a support surface adapted for supporting a work piece being sawed by a wire saw during sawing, the support surface defining a support plane at which the work piece is supported during sawing. The wire saw work piece support device includes: a solid support body; and at least one wire receiving volume for receiving therein a wire of the wire saw during sawing, the at least one wire receiving volume having a work piece side delimited by the support plane, and a base side delimited by a surface portion of the solid support body, wherein the at least one wire receiving volume has a thickness between the work piece side and the base side of at least 60 mm, and according to further aspects of at least 70 mm or of at least 80 mm, in a direction orthogonal to the support plane. According to a further aspect, the support body is adapted for not being sawed by the wire saw during normal sawing. Thus, the support body may have a resistance against sawing that is larger than the resistance supported by a normal wire saw. For example, metal generally has such a large resistance. Hence, according to a further aspect, the support body includes metal or is even made of metal. According to a further aspect, the at least one wire receiving volume extends in parallel to the support plane from a first end of the support body or support surface to an opposite second end of the support body or support surface.
According to a further aspect, the solid support body has at least one first groove formed therein, the at least one first groove extending in a first direction parallel to the support plane, such that the respective base side of the at least one wire receiving volume is located at the bottom of a respective one of the at least one first groove. Thus, the at least one wire receiving volume includes the interior of the first grooves. According to a further aspect, the at least one wire receiving volume further includes at least one second groove formed in the solid support body, wherein the at least one second groove extends in a second direction along the support plane orthogonal to the first direction. Thus, the at least one wire receiving volume includes the interior of the second groove(s). The first groove(s) and/or the second groove(s) may have a depth of at least 60 mm, of at least 70 mm, or of at least 80 mm in a direction orthogonal to the support plane. The first groove(s) and/or the second groove(s) may extend from a respective end of the support surface to a respective opposite end of the support surface.
According to a further aspect, the at least one wire receiving volume is a plurality of wire receiving volumes, and according to a further aspect includes a plurality of first and/or second grooves, e.g., six first grooves and/or six second grooves. The first grooves may be parallel to each other; and also the second grooves may be parallel to each other. The second grooves may be perpendicular to the first groove(s).
According to a further aspect, the wire saw work piece support device further includes a wire saw work piece support spacer including, or made of, a solid material sawable by the wire saw wire, the wire saw work piece support spacer having at least one wire receiving portion filling the at least one wire receiving volume at least partially. Thus, the at least one wire receiving portion may define the at least one wire receiving volume, and according to a further aspect fills the at least one wire receiving volume completely.
According to a further aspect, the solid material is more easily sawable than the work piece support body, and according to a further aspect is more easily sawable than the work piece. Here, more easily sawable means that the material has less resistance against the sawing, so that under the same conditions a faster cut can be provided in the material. Generally, this means that the material is softer.
According to a further aspect, the support spacer includes or is even made of a resin. The resin may include or be polyurethane, possibly also including additives and other filler material and/or open spaces. The additives may be hardening additives reducing the elasticity of the polyurethane.
According to a further aspect, the wire saw work piece support spacer has a first spacer surface being the support surface; and a second spacer surface opposite the first spacer surface, the second spacer surface being form-fit to a surface profile of the solid support body and optionally even contacting the surface portion. According to this aspect, during sawing of the work piece, the work piece support spacer is sandwiched between the work piece support body and the work piece.
According to a further aspect, the first spacer surface may be flat and contiguous, i.e., a connected surface, or even a simply connected surface, i.e., without holes. According to a further aspect, the support surface is formed as a surface of the support body, and the at least one wire receiving volume is formed as a recess in the support body.
According to a further aspect, the work piece is a semiconductor work piece. For example, in a particularly useful aspect, the wire saw device is a squarer, and the wire saw work piece is an ingot to be sawed by the squarer. According to a further aspect, the wire saw device is a diamond wire saw device and the wire is diamond wire, i.e. wire coated with diamond particles.
According to a further aspect, a wire saw work piece support spacer adapted for a wire saw work piece support device is provided. The wire saw work piece support spacer may be in accordance to any one of the respective claims, or any other description herein. The wire saw work piece support spacer has a support surface adapted for supporting a work piece being sawed by a wire saw during sawing, the support surface defining a support plane at which the work piece is supported during sawing; and a base surface adapted for being supported by a solid support body of the wire saw work piece support device, and at least one wire receiving portion defining a respective wire receiving volume for receiving therein a wire of the wire saw having sawn through the work piece, the at least one wire receiving portion being arranged between the support surface and a portion of the base surface. The at least one wire receiving portion includes, and according to a further aspect is made of, a solid material sawable by the wire saw wire. The at least one wire receiving portion has a thickness between the support surface and the base surface portion of at least 60 mm, of at least 70 mm, or of at least 80 mm in a direction orthogonal to the support plane. Thus, during sawing of the work piece, the work piece support spacer is sandwiched between the work piece support body and the work piece.
According to a further aspect, the base surface is profiled. According to a further aspect, the profile is form-fit to the surface of a solid support body according to any embodiment described herein, especially form-fit to the surface of a solid support body having at least one groove.
According to a further aspect, the at least one wire receiving portion is a plurality of wire receiving portions. According to a further aspect, the wire receiving portions include first protrusions extending longitudinally and in parallel to each other in a first direction along the base surface. According to a further aspect, the length of the protrusion(s) is from a first end of the support surface or of the support body to a second end of the support surface or of the support body opposite the first end. According to a further aspect, the width of the protrusion(s) is between 15 mm and 25 mm, e.g. 21 mm. According to a further aspect, the height of the protrusion(s) is at least 50 mm, at least 60 or 70 or 80 mm, and/or not more than 100 mm. According to a further aspect, the wire receiving portions further include second protrusions extending longitudinally and in parallel to each other in a second direction along the base surface and intersecting the first protrusions such as to form a web of protrusions, the second direction being orthogonal to the first direction.
According to a further aspect, the support spacer further includes a joining portion joining the wire receiving portions to each other. According to a further aspect, the support spacer or the joining portion has a planar contiguous surface that defines the work piece support plane. According to a further aspect, the wire saw work piece support spacer is a single-piece unit. According to a further aspect, wherein the lower surface is form-fit to the shape of a corresponding surface of the support body of a wire saw work piece support device according to any embodiment described or claimed herein.
A further aspect is related to the use of a wire saw work piece support device according to any embodiment described or claimed herein for supporting a work piece in a wire saw device. A further aspect is related to the use of a wire saw work piece support spacer according to any embodiment described or claimed herein for supporting a work piece in a wire saw device. According to a further aspect, the wire saw device is a diamond wire saw device and the wire is diamond wire.
According to a further aspect, a method of sawing a work piece using a wire saw having a work piece support device and a support spacer is provided. The work piece support device and/or the support spacer may be in accordance to any embodiment described or claimed herein. The method includes: providing a solid support body of the work piece support device, the solid support body having a spacer support surface; providing the support spacer, the support spacer having a work piece support surface, a base surface and at least one wire receiving portion defining a respective wire receiving volume for receiving therein a wire of the wire saw, the at least one wire receiving portion being arranged between the support surface and a portion of the base surface, wherein the at least one wire receiving portion includes a solid material sawable by the wire saw wire; placing the support spacer with its base surface onto the spacer support surface, so that the support spacer is supported by the solid support body; placing the work piece onto the work piece support surface of the support spacer [possibly before the placing of the support spacer onto the spacer support surface], so that [as a result of the placing steps, irrespective of their order] the support spacer is sandwiched between the support body and the work piece; and sawing through at least a portion of the work piece by a sawing wire section of a wire of the wire saw, thereby creating a cut in the work piece, so that at least a part of the sawing wire section leaves the work piece from the cut and is received in the at least one wire receiving portion; sawing, by the part of the wire section received in the at least one wire receiving portion, into the solid material included in the at least one wire receiving portion, thereby creating a cut in the solid material; and retracing the at least one sawing wire section through the cut in the solid material, and optionally also through the cut in the work piece.
According to a further aspect, the at least one wire receiving volume has a thickness of at least 60 mm or at least 70 mm or at least 80 mm. According to a further aspect, the method further includes removing the sawing wire section from the work piece through the cut therein, especially from the side at which the sawing wire section was cutting when the cut in the work piece was started. According to a further aspect, during the sawing the at least one sawing wire section of the wire is moved in a sawing direction relative to the work piece, so that the cut extends in the sawing direction. Then, during retracing, the wire is moved in a wire releasing direction opposite to the sawing direction. According to a further aspect, the sawing in the at least one wire receiving portion (320, 330) is in the sawing direction, and according to a further aspect the portion of the sawing wire section cuts into the at least one wire receiving portion directly after having left the work piece. According to a further aspect, the sawing further includes cutting, by a sawing wire section of the wire, through the work piece so that the sawing wire section leaves the work piece entirely in the sawing direction after having performed a cut through the work piece, and cutting, by the entire sawing wire section, into at least one wire receiving portion of the support spacer, wherein in embodiments the cutting is in the sawing direction, and wherein in embodiments the portion of the sawing wire section cuts into the at least one wire receiving portion directly after having left the work piece. According to a further aspect, the wire receiving portion includes a resin, and according to a further aspect the solid material includes a resin or is a resin.
According to a further aspect, the at least one sawing wire section is a plurality of sawing wire sections forming a wire web, and wherein the sawing wire sections include first sawing wire sections extending in a first direction parallel to each other, the first direction being essentially perpendicular to the sawing direction. According to a further aspect, the sawing wire sections further include second sawing wire sections extending in a second direction parallel to each other, the second direction being essentially perpendicular to the first direction and to the sawing direction. According to a further aspect, the support device and/or the support spacer have any other features described or claimed herein. Especially, the work piece support device may be in accordance with any one of claims 1 to 7; and/or the work piece support spacer may be in accordance with any one of claims 8 to 15. According to a further aspect, the method is carries out in a diamond wire saw device, with diamond wire.
According to a further aspect, a wire saw device is provided, the wire saw device including a wire saw work piece support device, e.g., any such support device described or claimed herein; a wire saw work piece support spacer, e.g., any such support spacer described or claimed herein; and a controller having a controller memory, the controller memory having stored thereon program code for performing any method described or claimed herein, e.g., the method according to any one of claims 18 to 24. According to a further aspect, the wire saw device is a diamond wire saw device and the wire is diamond wire.
While the foregoing is directed to embodiments of the invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/EP2009/062150 | 9/18/2009 | WO | 00 | 7/2/2012 |