The present invention relates to a wire sawing device comprising at least one layer of wires stretched between at least two wire guide cylinders and held in position by grooves provided on the surface of said cylinders, which wire guides define the interval between the wires of the layer of wires, and hence the thickness of the sawed slices separated from each other by sawing gaps, the wires being adapted to move with alternating or continuous movement whilst bearing against at least one piece to be sawed fixed on a support table.
Wire sawing devices of the mentioned type with movement of the wires of the layer of wires or the piece to be sawed are already known, particularly in the industry of electronic components of ferrites, quartz and silica, to obtain thin slices of material such as poly- or monocrystalline silicon or new materials such as GaAs, InP, GGG or else quartz, synthetic sapphire, ceramic materials. The high price of the materials renders wire sawing more attractive compared to other techniques such as diamond disc sawing.
In the known devices, the sawing region is constituted by an assembly of at least two cylinders in parallel. These cylinders, called wire guides, are engraved with grooves defining the interval between the wires of the layer, namely the thickness of the slices. The piece to be sawed is fixed on a support table which moves perpendicularly to the layer of wires. The speed of movement defines the cutting speed. Renewal of the wire, as well as control of its tension, takes place in a so-called management region for the wire located beyond the sawing region properly so called. The agent which effects the cutting is either an abrasive fixed on the wire, or a free abrasive provided in the form of a slip. The wire acts only as a carrier. During cutting of the piece to be sawed into thin slices, the tensioned wire is both guided and tensioned by the wire guide cylinders.
For numerous applications, the sawed slices or wafers are of a very small thickness relative to the diameter of the piece to be sawed. The sawed slices thus have a substantial flexibility and can flex and curve to come into contact with adjacent slices. This flexing is undesirable for precision and flatness of cutting and can give rise. to undulations, striations and undesirable irregularities on the surface of the sawed slices. These irregularities, even of several micrometers, are enough to render the slices unusable for certain applications, such as silicon for the solar industry and for semiconductors. The deformations of the slices can even lead to micro ruptures and ruptures, especially near the securement of the slices to their support.
Moreover, the variations in the position of the slices and in the width of the sawing gaps are adapted to influence the quantity and distribution of free abrasive in the sawing gaps, which leads in its turn to variations in the thickness of the slices, of the speed of sawing and of the wear on the wire, hence a supplemental increase of the irregularities of the surface of the obtained slices, as well as increased risk of wire breakage.
In the case of wire breakage, it is very difficult or even impossible to repair the wire and to cause it to enter again between the slices which touch each other or whose sawing gap has become very small. It is thus necessary to throw away the piece to be sawed in the case of wire breakage and to begin again sawing with a new piece, which gives rise to considerable loss of material which is often very troublesome and of sawing time.
The present invention has for its object to overcome these important drawings, and the invention is characterized to this end by the fact that the sawing device comprises a holding device arranged so as to hold, in the course of sawing, the partially or completely sawed slices substantially parallel to each other and such that the width of the sawing gaps is maintained substantially constant during sawing of the slices.
Thanks to these characteristics, it is possible to obtain slices with high planarity, without undulations, striations and undesirable irregularities. Micro ruptures and ruptures are completely avoided.
Because the sawing gaps are held at constant width, there is obtained a regular content and distribution of free abrasive, hence regular sawing without undulations and at constant speed, from one sawing slot to the next.
The wire is moreover subject to regular wear, is hence less subject to breakage. In the case rupture arises, the device according to the invention can also contribute to easy repair of the wire and to replacement of the wire into the saw gaps, hence avoiding throwing away the piece to be sawed when a wire breaks.
Preferably, the holding device comprises holding members adapted to coact with at least one portion of the slices in the course of being sawed.
There is thus obtained an effective holding of the slices during sawing.
According to a preferred embodiment, the holding device comprises guide elements arranged on the support table, the holding members being mounted movably on the guide elements to be moved from an inactive position toward an active position, in which they coact with the slices in the course of sawing, and vice versa.
These characteristics permit a reliable and precise construction.
Preferably, the holding members are urged by resilient members in the direction of stationary abutments.
There is obtained by these characteristics, an automatic operation of the holding device with a reduced number of components.
Advantageously, the holding members are on the one hand in the inactive position, bearing against the stationary abutments, and, on the other hand, in the active position, spaced from the stationary abutments to coact with the piece or pieces to be sawed.
According to an advantageous embodiment, the holding members comprise at least one bar extending along the piece to be sawed in a direction substantially parallel to the wire guide cylinders, this bar being provided with at least one elastomeric coating adapted to be applied against the slices of the piece to be sawed.
Preferably, said bar is mounted pivotably about a pivotal axis parallel to the wire guide cylinders on crosspieces mounted slidably on the guide elements.
Thanks to the mentioned characteristics, the holding device permits a particularly effective and reliable operation and a simple and less cumbersome construction.
According to another embodiment, the holding members comprise a thick liquid or a gel of a density higher than the machining liquid used, the thick liquid or gel being contained in a vat held in the active position such that said portion of the slices is at least partially immersed in the thick liquid or gel so that the slices will be immobilized.
These characteristics of the holding device permit obtaining an original and less costly solution to overcome the drawbacks of the mentioned surface undulations and irregularities.
As a modification, the holding device can also comprise as holding members, separation elements adapted to be introduced at least partially into the saw gaps between the slices to hold these latter, these separation elements being mounted on at least one support.
Thanks to these characteristics, the spacing between the slices can be maintained very precisely constant, even in the case of external forces acting on the slices undergoing sawing.
Advantageously, the separation elements are constituted by wires, strips, blades or walls of a thickness suitable to be introduced into the saw gaps.
The holding and separation of the sawed slices are thus carried out in a simple and effective manner.
According to a preferred embodiment, said at least one support is arranged in at least one vat mounted on said frame.
These characteristics permit easy integration of the sawed slices into a production chain.
Another embodiment is characterized by the fact that the holding device is constituted by a U shaped frame whose longitudinal branches are adapted to be applied laterally against the sawed slices by means of resilient members.
Such a frame can be mounted and removed by lateral displacement during sawing of the piece; this embodiment is hence particularly useful in the case of breakage of the sawing wire. During repair, the distance between the slices can be maintained constant thanks to this device and the wire can be easily replaced and reintroduced between the slices after repair. Moreover, the frame can also be used for transporting the piece after sawing before and during cutting off of the heel by which the slices are held on a temporary cutting support. The slices, separated from each other by regular spacing, do not adhere to the adjacent slices and can be cleaned and detached very easily.
Other advantages will appear from the characteristics set forth in the dependent claims and from the description setting forth hereafter the invention in greater detail with the help of drawings which show schematically and by way of example several embodiments and modifications.
With reference to
The wire 14 is rolled from a supply bobbin, not shown, and then wound about the wire guide cylinders according to any possible winding manner to form at least one layer 15 of parallel wires in a sawing region. The wire is then returned to a suitable device (not shown), such as a receiving bobbin or a collection vat.
One, two or more pieces 17 to be sawed, such as ingots of a hard material, are mounted on a support table 18 by means of a temporary support 19. This support table 18 can be moved vertically in the Z direction thanks to a column 21 and a motor 20 to press the pieces 17 to be sawed against the layer 15 of wires.
The periphery of the wire guide cylinders 11, 12 is engraved with grooves which define the interval between adjacent wires of the layer 15 of wires, hence the thickness of the sawed slices. These latter are separated from each other by slots or sawing gaps.
The wire 14 is stretched and both guided and tensioned by the wire guide cylinders to move with alternate back and forth movement or continuously. This wire is preferably constituted by spring steel with a diameter comprised between 0.1 and 0.2 mm so as to saw blocks of hard material or of more particular composition, such as silicon, ceramic, compounds of the elements of groups III–V and II–VI, GGG (gadolinium gallium garnet), sapphire, etc., in slices of about 0.1 to 5 mm thickness. The abrasive agent is a commercial product and can be diamond, silicon carbide, alumina, etc., in a form fixed to the filament or in a free form in suspension in a liquid which serves as a transport for the abrasive particles.
The sawing device is, according to the invention, provided with a holding device 22 arranged so as to hold, in the course of sawing, the partially or entirely sawed slices 23 substantially parallel to each other and such that the width of the sawing gaps 24 is maintained substantially constant during sawing of the slices.
The holding device 22 comprises for this purpose holding members 25 adapted to coact with at least one portion 26 of the slices in the course of sawing. This portion 26 is in this case opposite the portion 27 of the piece 17 to be sawed by which this latter is fixed to the support table 18.
These holding members 25 comprise, in the embodiment of
Each bar 30 is pivotally mounted about a pivotal axis 32 parallel to the wire guide cylinders 11, 12 on crosspieces 33. Thus, the coatings 31 can adapt themselves in an optimum manner to the pieces 17 to be sawed. The crosspieces 33 slide on rods 34 serving as guide elements secured to the support table 18. Resilient means in the form of coil springs 35 urge the crosspieces 33 and the longitudinal bars 30 in the direction on the one hand of the pieces 17 to be sawed and on the other hand of stationary abutments 40 secured to the frame 10.
When the pieces to be sawed are in an upper position spaced from the layer 15 of wires, the crosspieces 33 bear on the stationary abutments 40, and the holding members 25 are in this inactive position spaced from the pieces 17 to be sawed.
The pieces 17 to be sawed are, for sawing, lowered to enter into contact with the layer 15 of wires. After sawing a minimum distance, one centimeter for example, the elastomeric coatings 31 enter into contact with the pieces to be sawed and hold in this active position the sawed slices firmly in place thanks to the action of the springs 35, the stationary abutments 40 being then separated from the crosspieces 33. Adjustment screws 41 provided on the stationary abutments 40 permit determining exactly the position in which the holding members 25 enter in action.
The sawing can then continue until the opposite end of the piece to be sawed is reached, whilst the sawed slices 23 are maintained in position, permitting avoiding undulations, striations and other irregularities due to transverse movements of the slices. The slots or sawing gaps 24 have a constant width, permitting regular supply of abrasive particles and a constant sawing speed.
The embodiment shown in
The crosspieces 33 are subject to the action of coil springs 35 and blocked in active position by stop rings 47 such that the lower portion 26 of the slices is at least partially immersed in the thick liquid or gel which penetrates partially into the sawing gaps 24 and thus immobilizes the sawed slices in parallel position.
A third embodiment shown in
The modification shown in
The other components of this sawing device and its operation remain similar to the first embodiment.
The fourth embodiment shown in
During breakage of the wire, the frame 60 can be easily emplaced thanks to the handle 66 and then blocked by application of gripping.
After repair of the wire, this latter can be disposed in the sawing gaps 24, because the width of these latter remains constant. After removal of the frame 60, sawing can proceed. Without the holding device 22, it would be impossible to again thread the wire into the sawing gaps and the piece would thus have to be discarded.
A fifth embodiment is shown in
The separation elements 72 are in this embodiment constituted by a series of wires 73 stretched on a mounting 74. The illustrated embodiment has two superposed frames mountings 74, but any other number of mountings from one to five could be mounted in the vat 70.
Thus, sawing can be carried out up to the temporary support 19 (
The slices could for example be removed from the sawing device directly into the vat 70.
According to a preferred embodiment shown in
Each of these drawers constitutes a holding device 22 for the slices of one or the other of the sawed ingots 17.
The bottom and sidewalls of these drawers 81, 82 could be perforated for the flow of sawing liquid. This latter could be retained in the vat 80 and evacuated through flow means 84 with a valve 85.
The holding device 22 also comprises separation elements 72 adapted to be introduced into the sawing gaps. These separation elements can be constituted by horizontal, oblique and/or diagonal wires stretched on one, two or several mountings 86. The wires could thus constitute two layers of crossed wires.
The separation elements could also be constituted by vertical walls fixed on sidewalls of the drawers. After sawing, the drawers 81, 82 with the sawed slices of each of the ingots could be removed from the sawing device.
Of course the embodiments described above are in no way limiting and can be the subject of any desired modification within the scope of the invention. In particular, one, two or several support tables 18 could support one or more than two pieces 17 to be sawed.
The relative movement between the support table or tables 18 and the layer 15 of wires could also be performed by movement of the layer of wires and by any suitable mechanical, pneumatic or hydraulic means. The sawing movement could also be effected in any other spatial direction than vertical.
The first embodiment of
The holding device 22 could be adapted to the shape of the piece to be sawed. In the case of a circular section of this piece, the holding could be effected by a bar 30 matching the cylindrical surface.
The control of the force of application could be carried out by any mechanical, pneumatic and hydraulic means with or without stationary abutments.
The frame 51 of
Several holding members 25, as well as frames 51 or 60, could be superposed to ensure perfect holding under very difficult sawing conditions.
The separation elements 72 provided in the vat 70 or in the drawers 80 could be in any way horizontal, oblique, diagonal wires, complete or partial walls, strips, crosspieces, etc.
Number | Date | Country | Kind |
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43/03 | Jan 2003 | CH | national |
1263/03 | Jul 2003 | CH | national |
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5715806 | Tonegawa et al. | Feb 1998 | A |
5839425 | Toyama et al. | Nov 1998 | A |
6119673 | Nakaura | Sep 2000 | A |
6832606 | Yamada et al. | Dec 2004 | B1 |
Number | Date | Country |
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03281309 | Dec 1991 | JP |
09272122 | Oct 1997 | JP |
2002205255 | Jul 2002 | JP |
Number | Date | Country | |
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20040159316 A1 | Aug 2004 | US |