Membership
Tour
Register
Log in
Apertured conductors
Follow
Industry
CPC
H05K2201/0969
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H05
Electric techniques
H05K
PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
H05K2201/00
Indexing scheme relating to printed circuits covered by H05K1/00
Current Industry
H05K2201/0969
Apertured conductors
Industries
Overview
Organizations
People
Information
Impact
Please log in for detailed analytics
Patents Grants
last 30 patents
Information
Patent Grant
Electronic substrate
Patent number
11,844,174
Issue date
Dec 12, 2023
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Shinkuro Fujino
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Light sensing module and display apparatus
Patent number
11,815,391
Issue date
Nov 14, 2023
Chengdu BOE Optoelectronics Technology Co., Ltd.
Jiahua Wang
G01 - MEASURING TESTING
Information
Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
Patent number
11,792,941
Issue date
Oct 17, 2023
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ceramic electronic component
Patent number
11,647,581
Issue date
May 9, 2023
Murata Manufacturing Co., Ltd.
Yuki Takemori
B32 - LAYERED PRODUCTS
Information
Patent Grant
Ceramic electronic component
Patent number
11,641,712
Issue date
May 2, 2023
Murata Manufacturing Co., Ltd.
Yuki Takemori
B32 - LAYERED PRODUCTS
Information
Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
Patent number
11,612,057
Issue date
Mar 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hsien Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed wiring line, electronic device, touch panel, gravure plate,...
Patent number
11,582,868
Issue date
Feb 14, 2023
Japan Aviation Electronics Industry, Limited
Yutaro Kogawa
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Reduced capacitance land pad
Patent number
11,516,915
Issue date
Nov 29, 2022
Intel Corporation
Zhichao Zhang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
Patent number
11,470,720
Issue date
Oct 11, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hsien Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board and method of manufacturing the same
Patent number
11,430,725
Issue date
Aug 30, 2022
Shinko Electric Industries Co., Ltd.
Noriyoshi Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical components attached to fabric
Patent number
11,388,817
Issue date
Jul 12, 2022
Apple Inc.
Daniel D. Sunshine
D03 - WEAVING
Information
Patent Grant
Detection device and display device with detection function
Patent number
11,347,338
Issue date
May 31, 2022
Japan Display Inc.
Hayato Kurasawa
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Printed wiring line, electronic device, touch panel, gravure plate,...
Patent number
11,310,909
Issue date
Apr 19, 2022
Japan Aviation Electronics Industry, Limited
Yutaro Kogawa
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Current redistribution in a printed circuit board
Patent number
11,277,918
Issue date
Mar 15, 2022
Cisco Technology, Inc.
Goutham Sabavat
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Resin multilayer substrate, electronic component, and mounting stru...
Patent number
11,259,401
Issue date
Feb 22, 2022
Murata Manufacturing Co., Ltd.
Hiromasa Koyama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Resin multilayer substrate, electronic component, and mounting stru...
Patent number
11,224,119
Issue date
Jan 11, 2022
Murata Manufacturing Co., Ltd.
Hiromasa Koyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having buffer structure for external terminals
Patent number
11,191,157
Issue date
Nov 30, 2021
Fuji Electric Co., Ltd.
Toshiyuki Miyasaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
Patent number
11,134,572
Issue date
Sep 28, 2021
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board and method of manufacturing the same
Patent number
10,978,383
Issue date
Apr 13, 2021
Shinko Electric Industries Co., Ltd.
Noriyoshi Shimizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical components attached to fabric
Patent number
10,959,331
Issue date
Mar 23, 2021
Apple Inc.
Daniel D. Sunshine
D03 - WEAVING
Information
Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
Patent number
10,939,551
Issue date
Mar 2, 2021
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hsien Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Printed wiring line, electronic device, touch panel, gravure plate,...
Patent number
10,834,815
Issue date
Nov 10, 2020
Japan Aviation Electronics Industry, Limited
Yutaro Kogawa
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Detection device and display device with detection function
Patent number
10,775,951
Issue date
Sep 15, 2020
Japan Display Inc.
Hayato Kurasawa
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Substrate, electronic device, and design support method of substrate
Patent number
10,777,497
Issue date
Sep 15, 2020
Fujitsu Limited
Takahito Takemoto
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Electrode embedded member
Patent number
10,750,611
Issue date
Aug 18, 2020
NGK Spark Plug Co., Ltd.
Atsushi Tsuchida
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Resin multilayer substrate and method of manufacturing the same
Patent number
10,743,414
Issue date
Aug 11, 2020
Murata Manufacturing Co., Ltd.
Toshiro Adachi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board having a molded part and method for the produ...
Patent number
10,736,214
Issue date
Aug 4, 2020
JUMATECH GMBH
Markus Wölfel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical components attached to fabric
Patent number
10,701,802
Issue date
Jun 30, 2020
Apple Inc.
Daniel D. Sunshine
A41 - WEARING APPAREL
Information
Patent Grant
Backlight bar, backlight module and display device
Patent number
10,674,600
Issue date
Jun 2, 2020
BOE Technology Group Co., Ltd.
Dong Liu
G02 - OPTICS
Information
Patent Grant
Conductive stiffener, method of making a conductive stiffener, and...
Patent number
10,653,332
Issue date
May 19, 2020
MC10, Inc.
Bryan McGrane
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
CONNECTOR, CONNECTOR ASSEMBLY, CONNECTING STRUCTURE, AND CONNECTING...
Publication number
20240388027
Publication date
Nov 21, 2024
Japan Aviation Electronics Industry, Limited
Kenta Ashibu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF
Publication number
20240357730
Publication date
Oct 24, 2024
Harman Becker Automotive Systems GmbH
Paul-Alexandru BILIGA-NISIPEANU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SPLIT PAD WITH TEST LINE
Publication number
20240304503
Publication date
Sep 12, 2024
QUALCOMM Incorporated
Aniket PATIL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING BASE AND ELECTRONIC DEVICE
Publication number
20240074035
Publication date
Feb 29, 2024
KYOCERA CORPORATION
Yoshiki KAWAZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAVEGUIDE INTERFACE ARRANGEMENT
Publication number
20230268632
Publication date
Aug 24, 2023
Telefonaktiebolaget LM Ericsson (publ)
Göran SNYGG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD INTEGRATED ANTENNA FOR TRANSMITTING / RECEIVI...
Publication number
20230178884
Publication date
Jun 8, 2023
Samsung Electronics Co., Ltd.
Anton Sergeevich LUKYANOV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electrical Components Attached to Fabric
Publication number
20220346228
Publication date
Oct 27, 2022
Apple Inc.
Daniel D. Sunshine
D03 - WEAVING
Information
Patent Application
ELECTRONIC SUBSTRATE
Publication number
20220322521
Publication date
Oct 6, 2022
Panasonic Intellectual Property Management Co., Ltd.
Shinkuro FUJINO
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Light Sensing Module and Display Apparatus
Publication number
20220291038
Publication date
Sep 15, 2022
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
Jiahua WANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING BUFFER STRUCTURE FOR EXTERNAL TERMINALS
Publication number
20210235579
Publication date
Jul 29, 2021
Fuji Electric Co., Ltd.
Toshiyuki MIYASAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electrical Components Attached to Fabric
Publication number
20210185808
Publication date
Jun 17, 2021
Apple Inc.
Daniel D. Sunshine
A41 - WEARING APPAREL
Information
Patent Application
PRINTED WIRING LINE, ELECTRONIC DEVICE, TOUCH PANEL, GRAVURE PLATE,...
Publication number
20210022242
Publication date
Jan 21, 2021
Japan Aviation Electronics Industry, Limited
Yutaro KOGAWA
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
PRINTED WIRING LINE, ELECTRONIC DEVICE, TOUCH PANEL, GRAVURE PLATE,...
Publication number
20200352027
Publication date
Nov 5, 2020
Japan Aviation Electronics Industry, Limited
Yutaro KOGAWA
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Electrical Components Attached to Fabric
Publication number
20200329559
Publication date
Oct 15, 2020
Apple Inc.
Daniel D. Sunshine
A41 - WEARING APPAREL
Information
Patent Application
RESIN MULTILAYER SUBSTRATE, ELECTRONIC COMPONENT, AND MOUNTING STRU...
Publication number
20200267831
Publication date
Aug 20, 2020
Murata Manufacturing Co., Ltd.
Hiromasa KOYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIN MULTILAYER SUBSTRATE, ELECTRONIC COMPONENT, AND MOUNTING STRU...
Publication number
20200267832
Publication date
Aug 20, 2020
Murata Manufacturing Co., Ltd.
Hiromasa KOYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CURRENT REDISTRIBUTION IN A PRINTED CIRCUIT BOARD
Publication number
20200107452
Publication date
Apr 2, 2020
Cisco Technology, Inc.
Goutham Sabavat
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electrical Components Attached to Fabric
Publication number
20200084886
Publication date
Mar 12, 2020
Apple Inc.
Daniel D. Sunshine
A41 - WEARING APPAREL
Information
Patent Application
SUBSTRATE, ELECTRONIC DEVICE, AND DESIGN SUPPORT METHOD OF SUBSTRATE
Publication number
20190229049
Publication date
Jul 25, 2019
Fujitsu Limited
Takahito TAKEMOTO
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SUBSTRATE AND ELECTRONIC DEVICE
Publication number
20190230792
Publication date
Jul 25, 2019
Fujitsu Limited
Shinichi NAKAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Opening in the Pad for Bonding Integrated Passive Device in InFO Pa...
Publication number
20190098756
Publication date
Mar 28, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hsien Hsieh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CONNECTION STRUCTURE BETWEEN OPTICAL DEVICE AND CIRCUIT SUBSTRATE,...
Publication number
20180288874
Publication date
Oct 4, 2018
Sumitomo Osaka Cement Co., Ltd.
Toshio KATAOKA
G02 - OPTICS
Information
Patent Application
SIGNAL TRANSMISSION SYSTEM, CONNECTOR APPARATUS, ELECTRONIC DEVICE,...
Publication number
20180048045
Publication date
Feb 15, 2018
Sony Semiconductor Solutions Corporation
Hidekazu KIKUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Contact Area Design for Solder Bonding
Publication number
20170345785
Publication date
Nov 30, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Pei-Chun Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20170309544
Publication date
Oct 26, 2017
MITSUBISHI ELECTRIC CORPORATION
Hiroshi KOBAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-chip package and manufacturing method
Publication number
20170271288
Publication date
Sep 21, 2017
GE EMBEDDED ELECTRONICS OY
Antti Iihola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING A SUBSTRATE CORE STRUCTURE USING MICROVIA LASER D...
Publication number
20170231092
Publication date
Aug 10, 2017
Intel Corporation
Yonggang Li
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD, POWER STORAGE DEVICE, BATTERY PACK, AND ELECTRONIC D...
Publication number
20170150605
Publication date
May 25, 2017
SONY CORPORATION
Takashi NAGAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSPARENT CONDUCTIVE COATINGS FOR OPTOELECTRONIC AND ELECTRONIC D...
Publication number
20150357511
Publication date
Dec 10, 2015
YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW UNIVERSITY OF JERUSALEM
Shlomo MAGDASSI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ATTENUATION REDUCTION CONTROL STRUCTURE FOR HIGH-FREQUENCY SIGNAL T...
Publication number
20140375394
Publication date
Dec 25, 2014
ADVANCED FLEXIBLE CIRCUITS CO., LTD.
GWUN-JIN LIN
H01 - BASIC ELECTRIC ELEMENTS