Claims
- 1. An X-ray exposure process comprising the steps of:
- arranging an X-ray mask adjacent to and spaced from a wafer having an X-ray sensitive membrane thereon, the mask including a support frame and a support membrane held thereon which is X-ray transmissive and has an electrical resistivity of 10 .OMEGA.. cm. or less, and an X-ray absorber provided in a pattern form on the surface of the support membrane;
- irradiating the wafer having the X-ray sensitive member thereon with X-rays through the X-ray mask; and
- cancelling the potential difference between the X-ray mask and the wafer.
- 2. The X-ray exposure process according to claim 1, wherein the support membrane includes at least one of conductive ceramics and a conductive organic compound.
- 3. The X-ray exposure process according to claim 1, wherein the support membrane includes an organic material having a thickness of from 1 .mu.m to 15 .mu.m.
- 4. The X-ray exposure process according to claim 1, wherein the support membrane includes an inorganic material having a thickness of from 0.5 .mu.m to 5 .mu.m.
- 5. The X-ray exposure process according to claim 1, further comprising setting the X-ray mask with a gap of from 5 .mu.m to 100 .mu.m relative to the wafer having the X-ray sensitive member thereon.
- 6. The X-ray exposure process according to claim 1, further comprising stretching the support membrane made of an organic material over the support frame.
- 7. The X-ray exposure process according to claim 1, further comprising arranging the surface of the X-ray mask parallel to the surface of the wafer having the X-ray sensitive member thereon.
- 8. The X-ray exposure process according to claim 1, wherein said cancelling step comprises electrically connecting the support membrane to the wafer having the X-ray sensitive member thereon.
- 9. The X-ray exposure process according to claim 1, wherein said cancelling step comprises grounding each of the support membrane and the wafer having the X-ray sensitive member thereon.
- 10. The X-ray exposure process according to claim 1, wherein said cancelling step comprises applying a voltage to each of the support membrane and the wafer having the X-ray sensitive member thereon to eliminate a potential difference therebetween.
- 11. An X-ray exposure process according to claim 1, wherein said cancelling step is effected at least during said X-ray irradiation step.
- 12. An X-ray mask exposure process comprising the steps of:
- arranging an X-ray mask adjacent to and spaced from a wafer having an X-ray sensitive member thereon, the mask including a support frame and a support membrane held thereon which is X-ray transmissive and has an electrical resistivity of 10 .OMEGA. or less, and an X-ray absorber provided in a pattern form on the surface of the support membrane;
- registering the X-ray mask and the wafer with an alignment light;
- irradiating the wafer having the X-ray sensitive member thereon with X-rays through the X-ray mask; and
- cancelling the potential difference between the X-ray mask and the wafer.
- 13. The X-ray exposure process according to claim 12, wherein the support membrane includes at least one of conductive ceramics and a conductive organic compound.
- 14. The X-ray exposure process according to claim 12, wherein the support membrane includes an organic material having a thickness of from 1 .mu.m to 15 .mu.m.
- 15. The X-ray exposure process according to claim 12, wherein the support membrane includes an inorganic material having a thickness of from 0.5 .mu.m to 5 .mu.m.
- 16. The X-ray exposure process according to claim 12, further comprising setting the X-ray mask with a gap of from 5 .mu.m to 100 .mu.m relative to the wafer having the X-ray sensitive member thereon.
- 17. The X-ray exposure process according to claim 12, further comprising stretching the support membrane made of an organic material over the support frame.
- 18. The X-ray exposure process according to claim 12, further comprising arranging the surface of the X-ray mask parallel to the surface of the wafer having the X-ray sensitive member thereon.
- 19. The X-ray exposure process according to claim 12, wherein said cancelling step comprises electrically connecting the support membrane to the wafer having the X-ray sensitive member thereon.
- 20. The X-ray exposure process according to claim 12, wherein said cancelling step comprises grounding each of the support membrane and the wafer having X-ray sensitive member thereon.
- 21. The x-ray exposure process according to claim 12, wherein said cancelling step comprises applying a voltage to each of the support membrane and the wafer having the X-ray sensitive member thereon to eliminate a potential difference therebetween.
- 22. The X-ray exposure process according to claim 12, wherein said registering step comprises registering the X-ray mask and the wafer with one of visible and infrared light as alignment light.
- 23. An X-ray exposure process according to claim 12, wherein said cancelling step is effected at least during said X-ray irradiation step.
Priority Claims (1)
Number |
Date |
Country |
Kind |
62-335225 |
Dec 1987 |
JPX |
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Parent Case Info
This application is a continuation of application Ser. No. 290,641 filed Dec. 27, 1988, now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3974382 |
Bernacki |
Aug 1976 |
|
4852133 |
Ikeda et al. |
Jul 1989 |
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Continuations (1)
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Number |
Date |
Country |
Parent |
290641 |
Dec 1989 |
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