ASM JAPAN K.K.

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method for positioning wafers in multiple wafer transport
- Patent number 9,793,148
- Issue date Oct 17, 2017
- ASM Japan K.K.
- Takayuki Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-throughput semiconductor-processing apparatus equipped with mu...
- Patent number 9,312,155
- Issue date Apr 12, 2016
- ASM Japan K.K.
- Yukihiro Mori
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method of forming metal oxide hardmask
- Patent number 9,171,716
- Issue date Oct 27, 2015
- ASM Japan K.K.
- Hideaki Fukuda
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of forming metal oxide hardmask
- Patent number 8,901,016
- Issue date Dec 2, 2014
- ASM Japan K.K.
- Jeongseok Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shower plate having different aperture dimensions and/or distributions
- Patent number 8,845,806
- Issue date Sep 30, 2014
- ASM Japan K.K.
- Koei Aida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming low-carbon CVD film for filling trenches
- Patent number 8,765,233
- Issue date Jul 1, 2014
- ASM Japan K.K.
- Atsuki Fukazawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cluster type semiconductor processing apparatus
- Patent number 8,758,514
- Issue date Jun 24, 2014
- ASM Japan K.K.
- Masahiro Takizawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of tailoring conformality of Si-containing film
- Patent number 8,669,185
- Issue date Mar 11, 2014
- ASM Japan K.K.
- Shigeyuki Onizawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor-processing apparatus equipped with robot diagnostic m...
- Patent number 8,666,551
- Issue date Mar 4, 2014
- ASM Japan K.K.
- Masahiro Takizawa
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method of forming insulation film using plasma treatment cycles
- Patent number 8,647,722
- Issue date Feb 11, 2014
- ASM Japan K.K.
- Akiko Kobayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition for controlling vertical film growth
- Patent number 8,592,005
- Issue date Nov 26, 2013
- ASM Japan K.K.
- Shintaro Ueda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming single-phase multi-element film by PEALD
- Patent number 8,569,184
- Issue date Oct 29, 2013
- ASM Japan K.K.
- Takahiro Oka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing dielectric film by ALD using precursor contain...
- Patent number 8,563,443
- Issue date Oct 22, 2013
- ASM Japan K.K.
- Atsuki Fukazawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reducing dielectric constant of film using direct plasma...
- Patent number 8,551,892
- Issue date Oct 8, 2013
- ASM Japan K.K.
- Akinori Nakano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing film with tailored comformality
- Patent number 8,470,187
- Issue date Jun 25, 2013
- ASM Japan K.K.
- Jeongseok Ha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing film by atomic layer deposition with pulse-tim...
- Patent number 8,465,811
- Issue date Jun 18, 2013
- ASM Japan K.K.
- Shintaro Ueda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Calibration method of UV sensor for UV curing
- Patent number 8,466,411
- Issue date Jun 18, 2013
- ASM Japan K.K.
- Hirofumi Arai
- G01 - MEASURING TESTING
Information Patent Grant
Method of depositing dielectric film by modified PEALD method
- Patent number 8,415,259
- Issue date Apr 9, 2013
- ASM Japan K.K.
- Woo Jin Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming conformal film having si-N bonds on high-aspect r...
- Patent number 8,394,466
- Issue date Mar 12, 2013
- ASM Japan K.K.
- Kuo-wei Hong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming stress-tuned dielectric film having Si-N bonds by...
- Patent number 8,334,219
- Issue date Dec 18, 2012
- ASM Japan K.K.
- Woo-Jin Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing dielectric film by ALD using precursor contain...
- Patent number 8,329,599
- Issue date Dec 11, 2012
- ASM Japan K.K.
- Atsuki Fukazawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Footing reduction using etch-selective layer
- Patent number 8,298,951
- Issue date Oct 30, 2012
- ASM Japan K.K.
- Ryu Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnect structure having airgap
- Patent number 8,241,991
- Issue date Aug 14, 2012
- ASM Japan K.K.
- Julian J. Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing silicon oxide film by plasma enhanced atomic l...
- Patent number 8,197,915
- Issue date Jun 12, 2012
- ASM Japan K.K.
- Takahiro Oka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing dielectric film having Si-N bonds by modified...
- Patent number 8,173,554
- Issue date May 8, 2012
- ASM Japan K.K.
- Woo Jin Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for controlling flow and concentration of liquid precursor
- Patent number 8,151,814
- Issue date Apr 10, 2012
- ASM Japan K.K.
- Akira Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming conformal dielectric film having Si-N bonds by PECVD
- Patent number 8,142,862
- Issue date Mar 27, 2012
- ASM Japan K.K.
- Woo Jin Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming metal film by ALD using beta-diketone metal complex
- Patent number 8,133,555
- Issue date Mar 13, 2012
- ASM Japan K.K.
- Hiroshi Shinriki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing dielectric film having Si-N bonds by modified...
- Patent number 8,129,291
- Issue date Mar 6, 2012
- ASM Japan K.K.
- Woo Jin Lee
Information Patent Grant
Clamping mechanism for semiconductor device
- Patent number 8,118,940
- Issue date Feb 21, 2012
- ASM Japan K.K.
- Akira Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Method of Forming Metal Oxide Hardmask
- Publication number 20150056540
- Publication date Feb 26, 2015
- ASM JAPAN K.K.
- Hideaki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Single-Phase Multi-Element Film by PEALD
- Publication number 20130084714
- Publication date Apr 4, 2013
- ASM JAPAN K.K.
- Takahiro Oka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
UV Irradiation Apparatus Having UV Lamp-Shared Multiple Process Sta...
- Publication number 20130068970
- Publication date Mar 21, 2013
- ASM JAPAN K.K.
- Kiyohiro Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING DIELECTRIC CONSTANT OF FILM USING DIRECT PLASMA...
- Publication number 20130029498
- Publication date Jan 31, 2013
- ASM JAPAN K.K.
- Akinori Nakano
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wafer-Supporting Device and Method for Producing Same
- Publication number 20130014896
- Publication date Jan 17, 2013
- ASM JAPAN K.K.
- Fumitaka Shoji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Container Having Multiple Compartments Containing Liquid Material f...
- Publication number 20130014697
- Publication date Jan 17, 2013
- ASM JAPAN K.K.
- Hiroki Kanayama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Positioning Wafers in Multiple Wafer Transport
- Publication number 20120325148
- Publication date Dec 27, 2012
- ASM JAPAN K.K.
- Takayuki Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Section Module Having Shared and Unshared Mass Flow Controllers
- Publication number 20120328780
- Publication date Dec 27, 2012
- ASM JAPAN K.K.
- Takayuki Yamagishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
High-Throughput Semiconductor-Processing Apparatus Equipped with Mu...
- Publication number 20120305196
- Publication date Dec 6, 2012
- ASM JAPAN K.K.
- Yukihiro Mori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Depositing Dielectric Film by ALD Using Precursor Contain...
- Publication number 20120295449
- Publication date Nov 22, 2012
- ASM JAPAN K.K.
- Atsuki Fukazawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Atomic Layer Deposition For Controlling Vertical Film Growth
- Publication number 20120276306
- Publication date Nov 1, 2012
- ASM JAPAN K.K.
- Shintaro Ueda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Footing Reduction Using Etch-Selective Layer
- Publication number 20120264305
- Publication date Oct 18, 2012
- ASM JAPAN K.K.
- Ryu Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Calibration Method of UV Sensor for UV Curing
- Publication number 20120223220
- Publication date Sep 6, 2012
- ASM JAPAN K.K.
- Hirofumi Arai
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF DEPOSITING DIELECTRIC FILM BY MODIFIED PEALD METHOD
- Publication number 20120220139
- Publication date Aug 30, 2012
- ASM JAPAN K.K.
- Woo-Jin Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Depositing Dielectric Film by ALD Using Precursor Contain...
- Publication number 20120214318
- Publication date Aug 23, 2012
- ASM JAPAN K.K.
- Atsuki Fukazawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DEPOSITING FILM BY ATOMIC LAYER DEPOSITION WITH PULSE-TIM...
- Publication number 20120196048
- Publication date Aug 2, 2012
- ASM JAPAN K.K.
- Shintaro Ueda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Forming Metal Oxide Hardmask
- Publication number 20120164846
- Publication date Jun 28, 2012
- ASM JAPAN K.K.
- Jeongseok Ha
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF DEPOSITING FILM WITH TAILORED COMFORMALITY
- Publication number 20120111831
- Publication date May 10, 2012
- ASM JAPAN K.K.
- Jeongseok Ha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Shower Plate Having Different Aperture Dimensions and/or Distributions
- Publication number 20120100307
- Publication date Apr 26, 2012
- ASM JAPAN K.K.
- Koei Aida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Forming Conformal Film Having Si-N Bonds on High-Aspect R...
- Publication number 20120058282
- Publication date Mar 8, 2012
- ASM JAPAN K.K.
- Kuo-wei Hong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF TAILORING CONFORMALITY OF Si-CONTAINING FILM
- Publication number 20120028469
- Publication date Feb 2, 2012
- ASM JAPAN K.K.
- Shigeyuki Onizawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING INTERCONNECT STRUCTURE HAVING AIRGAP
- Publication number 20110217838
- Publication date Sep 8, 2011
- ASM JAPAN K.K.
- Julian J. Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Sealing Pores at Surface of Dielectric Layer by UV Light...
- Publication number 20110159202
- Publication date Jun 30, 2011
- ASM JAPAN K.K.
- Kiyohiro Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING DIELECTRIC FILM HAVING Si-N BONDS BY MODIFIED...
- Publication number 20110086516
- Publication date Apr 14, 2011
- ASM JAPAN K.K.
- Woo Jin Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Forming Stress-Tuned Dielectric Film Having Si-N Bonds by...
- Publication number 20110014795
- Publication date Jan 20, 2011
- ASM JAPAN K.K.
- Woo Jin Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING HIGHLY CONFORMAL AMORPHOUS CARBON LAYER
- Publication number 20100291713
- Publication date Nov 18, 2010
- ASM JAPAN K.K.
- Woo-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Depositing Silicon Oxide Film by Plasma Enhanced Atomic L...
- Publication number 20100255218
- Publication date Oct 7, 2010
- ASM JAPAN K.K.
- Takahiro Oka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING CONFORMAL DIELECTRIC FILM HAVING Si-N BONDS BY PECVD
- Publication number 20100221925
- Publication date Sep 2, 2010
- ASM JAPAN K.K.
- Woo Jin Lee
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING HARDMASK BY PLASMA CVD
- Publication number 20100189923
- Publication date Jul 29, 2010
- ASM JAPAN K.K.
- Kamal Kishore Goundar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of Forming Conformal Dielectric Film Having Si-N Bonds by PECVD
- Publication number 20100184302
- Publication date Jul 22, 2010
- ASM JAPAN K.K.
- Woo Jin LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

ASM JAPAN K.K.

Organization

Patents Grantslast 30 patents

Method for positioning wafers in multiple wafer transport

High-throughput semiconductor-processing apparatus equipped with mu...

Method of forming metal oxide hardmask

Method of forming metal oxide hardmask

Shower plate having different aperture dimensions and/or distributions

Method for forming low-carbon CVD film for filling trenches

Cluster type semiconductor processing apparatus

Method of tailoring conformality of Si-containing film

Semiconductor-processing apparatus equipped with robot diagnostic m...

Method of forming insulation film using plasma treatment cycles

Atomic layer deposition for controlling vertical film growth

Method for forming single-phase multi-element film by PEALD

Method of depositing dielectric film by ALD using precursor contain...

Method for reducing dielectric constant of film using direct plasma...

Method of depositing film with tailored comformality

Method of depositing film by atomic layer deposition with pulse-tim...

Calibration method of UV sensor for UV curing

Method of depositing dielectric film by modified PEALD method

Method of forming conformal film having si-N bonds on high-aspect r...

Method of forming stress-tuned dielectric film having Si-N bonds by...

Method of depositing dielectric film by ALD using precursor contain...

Footing reduction using etch-selective layer

Method for forming interconnect structure having airgap

Method of depositing silicon oxide film by plasma enhanced atomic l...

Method of depositing dielectric film having Si-N bonds by modified...

Method for controlling flow and concentration of liquid precursor

Method of forming conformal dielectric film having Si-N bonds by PECVD

Method for forming metal film by ALD using beta-diketone metal complex

Method of depositing dielectric film having Si-N bonds by modified...

Clamping mechanism for semiconductor device

Patents Applicationslast 30 patents

Method of Forming Metal Oxide Hardmask

Method for Forming Single-Phase Multi-Element Film by PEALD

UV Irradiation Apparatus Having UV Lamp-Shared Multiple Process Sta...

METHOD FOR REDUCING DIELECTRIC CONSTANT OF FILM USING DIRECT PLASMA...

Wafer-Supporting Device and Method for Producing Same

Container Having Multiple Compartments Containing Liquid Material f...

Method for Positioning Wafers in Multiple Wafer Transport

Dual Section Module Having Shared and Unshared Mass Flow Controllers

High-Throughput Semiconductor-Processing Apparatus Equipped with Mu...

Method of Depositing Dielectric Film by ALD Using Precursor Contain...

Atomic Layer Deposition For Controlling Vertical Film Growth

Footing Reduction Using Etch-Selective Layer

Calibration Method of UV Sensor for UV Curing

METHOD OF DEPOSITING DIELECTRIC FILM BY MODIFIED PEALD METHOD

Method of Depositing Dielectric Film by ALD Using Precursor Contain...

METHOD OF DEPOSITING FILM BY ATOMIC LAYER DEPOSITION WITH PULSE-TIM...

Method of Forming Metal Oxide Hardmask

METHOD OF DEPOSITING FILM WITH TAILORED COMFORMALITY

Shower Plate Having Different Aperture Dimensions and/or Distributions

Method of Forming Conformal Film Having Si-N Bonds on High-Aspect R...

METHOD OF TAILORING CONFORMALITY OF Si-CONTAINING FILM

METHOD FOR FORMING INTERCONNECT STRUCTURE HAVING AIRGAP

Method for Sealing Pores at Surface of Dielectric Layer by UV Light...

METHOD OF DEPOSITING DIELECTRIC FILM HAVING Si-N BONDS BY MODIFIED...

Method of Forming Stress-Tuned Dielectric Film Having Si-N Bonds by...

METHOD OF FORMING HIGHLY CONFORMAL AMORPHOUS CARBON LAYER

Method of Depositing Silicon Oxide Film by Plasma Enhanced Atomic L...

METHOD OF FORMING CONFORMAL DIELECTRIC FILM HAVING Si-N BONDS BY PECVD

METHOD OF FORMING HARDMASK BY PLASMA CVD

Method of Forming Conformal Dielectric Film Having Si-N Bonds by PECVD

Trademarklast 30 trademarks