AVARY HOLDING (SHENZHEN) CO., LIMITED

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SHENZHEN, CN

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Patents Grantslast 30 patents

Information Patent Grant
Buried thermistor and method of fabricating the same
- Patent number 12,191,056
- Issue date Jan 7, 2025
- HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.
- Jian Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module having optical image stabilization function, and prep...
- Patent number 12,184,979
- Issue date Dec 31, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Xue-Feng She
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing photoelectric composite circuit board
- Patent number 12,153,252
- Issue date Nov 26, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 12,156,348
- Issue date Nov 26, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing thereof
- Patent number 12,120,812
- Issue date Oct 15, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Hao-Yi Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and preparation method thereof
- Patent number 12,114,424
- Issue date Oct 8, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Mei Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing thereof
- Patent number 12,108,533
- Issue date Oct 1, 2024
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Zhi Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method therefor
- Patent number 12,101,891
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Chao Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board using thermocouple to dissipate generated heat and me...
- Patent number 12,101,871
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Huan-Yu He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 12,082,352
- Issue date Sep 3, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Yao-Cai Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 12,063,750
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Ying-Qiu Zheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing circuit board and circuit board assembly
- Patent number 12,063,752
- Issue date Aug 13, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wen-Zhu Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with heat dissipation function
- Patent number 12,052,827
- Issue date Jul 30, 2024
- Hong Heng Sheng Electronical Technology (HuaiAn)Co., Ltd.
- Pan Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Covering film, and circuit board and manufacturing method
- Patent number 12,048,084
- Issue date Jul 23, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board-to-board connection structure and method for manufacturing th...
- Patent number 12,028,976
- Issue date Jul 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jian-Yi Hao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing multilayer printed circuit board
- Patent number 12,016,119
- Issue date Jun 18, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,004,294
- Issue date Jun 4, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Zhi Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded circuit board and manufacturing method thereof
- Patent number 11,991,838
- Issue date May 21, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,985,764
- Issue date May 14, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Yang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with heat dissipation structure and method for manufa...
- Patent number 11,979,977
- Issue date May 7, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light and thin virtual reality gloves and method for manufacturing...
- Patent number 11,977,680
- Issue date May 7, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Shi-Jie Zhong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fixing belt of wearable device, method for manufacturing the same,...
- Patent number 11,968,788
- Issue date Apr 23, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Yong-Quan Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing transparent circuit board
- Patent number 11,950,371
- Issue date Apr 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board for transmitting high-frequency signal and method for...
- Patent number 11,950,357
- Issue date Apr 2, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module of reduced size and method for manufacturing the same
- Patent number 11,917,278
- Issue date Feb 27, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Man-Zhi Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module and method for manufacturing the same
- Patent number 11,902,644
- Issue date Feb 13, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Jun Dai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board and method of manufacturing circuit board
- Patent number 11,871,526
- Issue date Jan 9, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jun Dai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging structure with embedded electronic components and method...
- Patent number 11,864,329
- Issue date Jan 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly and manufacturing method thereof
- Patent number 11,792,914
- Issue date Oct 17, 2023
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Zhi-Hong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with embedded electronic component and method for man...
- Patent number 11,778,752
- Issue date Oct 3, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE
- Publication number 20240284608
- Publication date Aug 22, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Gang Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR PACKAGING THE CHIP
- Publication number 20240213036
- Publication date Jun 27, 2024
- Avary Holding (Shenzhen) Co., Limited.
- ZHI-YONG HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGE MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240203899
- Publication date Jun 20, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND MANUFACTURING...
- Publication number 20240196512
- Publication date Jun 13, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- YING WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT CIRCUIT BOARD
- Publication number 20240196541
- Publication date Jun 13, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- CHENG-JIA LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING STRUCTURE, PACKAGING SUBSTRATE, AND MANUFACTURING METHOD...
- Publication number 20240170301
- Publication date May 23, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- ZHI-CHENG LAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...
- Publication number 20240147629
- Publication date May 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHANG-HE ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240130050
- Publication date Apr 18, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Cheng-Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR
- Publication number 20240098908
- Publication date Mar 21, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20240040687
- Publication date Feb 1, 2024
- Avary Holding (Shenzhen) Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240006748
- Publication date Jan 4, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE SENSOR, PRESSURE-SENSITIVE CIRCUIT BOARD, AND MANUFACTURIN...
- Publication number 20230408349
- Publication date Dec 21, 2023
- Avary Holding (Shenzhen) Co., Limited.
- HSIAO-TING HSU
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD USING THERMOCOUPLE TO DISSIPATE GENERATED HEAT AND ME...
- Publication number 20230389170
- Publication date Nov 30, 2023
- Avary Holding (Shenzhen) Co., Limited.
- HUAN-YU HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20230389185
- Publication date Nov 30, 2023
- Avary Holding (Shenzhen) Co., Ltd.
- Zhi GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE HAVING OPTICAL IMAGE STABILIZATION FUNCTION, AND PREP...
- Publication number 20230379583
- Publication date Nov 23, 2023
- Avary Holding (Shenzhen) Co., Limited.
- XUE-FENG SHE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BURIED THERMISTOR AND METHOD OF FABRICATING THE SAME
- Publication number 20230377779
- Publication date Nov 23, 2023
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Jian WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PHOTOELECTRIC COMPOSITE CIRCUIT BOARD
- Publication number 20230375780
- Publication date Nov 23, 2023
- Avary Holding (Shenzhen) Co., Limited.
- WEI-LIANG WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING STRUCTURE WITH EMBEDDED ELECTRONIC COMPONENTS AND METHOD...
- Publication number 20230345643
- Publication date Oct 26, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD WITH EMBEDDED MODULE AND METHOD FOR MANUFA...
- Publication number 20230292446
- Publication date Sep 14, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- LAN-TING CHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT EQUALIZATION PLATE
- Publication number 20230240045
- Publication date Jul 27, 2023
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230199954
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD OF FABRICATING THE...
- Publication number 20230199966
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Ltd.
- Zi-Qiang GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20230171875
- Publication date Jun 1, 2023
- Avary Holding (Shenzhen) Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20230171876
- Publication date Jun 1, 2023
- Avary Holding (Shenzhen) Co., Ltd.
- Zhi-Hong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230171877
- Publication date Jun 1, 2023
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Hao-Yi WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230164919
- Publication date May 25, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- SHI-JIE ZHONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESSURE SENSING CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230160764
- Publication date May 25, 2023
- Avary Holding (Shenzhen) Co., Limited.
- FU-YUN SHEN
- G01 - MEASURING TESTING
Information Patent Application
ANTI-SHAKE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, CAMERA MODUL...
- Publication number 20230164441
- Publication date May 25, 2023
- Avary Holding (Shenzhen) Co., Limited.
- CHENG-YI YANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD OF MANUFACTURING DISPLAY MODULE WITH LIGHT EMITTING DIODE FR...
- Publication number 20230155055
- Publication date May 18, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHENG-JIA LI
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
90381514 - P2HIT
- Serial number 90381514
- Registration number 6944075
- Filing date Dec 14, 2020
- Avary Holding (Shenzhen) Co., Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
88330690 - A
- Serial number 88330690
- Registration number 6114436
- Filing date Mar 7, 2019
- Avary Holding (Shenzhen) Co., Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

AVARY HOLDING (SHENZHEN) CO., LIMITED

Organization

Patents Grantslast 30 patents

Buried thermistor and method of fabricating the same

Camera module having optical image stabilization function, and prep...

Method for manufacturing photoelectric composite circuit board

Embedded circuit board and manufacturing method thereof

Circuit board and method of manufacturing thereof

Circuit board and preparation method thereof

Circuit board and method for manufacturing thereof

Circuit board and manufacturing method therefor

Circuit board using thermocouple to dissipate generated heat and me...

Flexible circuit board

Circuit board and method for manufacturing the same

Methods of manufacturing circuit board and circuit board assembly

Circuit board with heat dissipation function

Covering film, and circuit board and manufacturing method

Board-to-board connection structure and method for manufacturing th...

Method for manufacturing multilayer printed circuit board

Circuit board

Embedded circuit board and manufacturing method thereof

Circuit board and method for manufacturing the same

Circuit board with heat dissipation structure and method for manufa...

Light and thin virtual reality gloves and method for manufacturing...

Fixing belt of wearable device, method for manufacturing the same,...

Method for manufacturing transparent circuit board

Circuit board for transmitting high-frequency signal and method for...

Camera module of reduced size and method for manufacturing the same

Camera module and method for manufacturing the same

Circuit board and method of manufacturing circuit board

Packaging structure with embedded electronic components and method...

Circuit board assembly and manufacturing method thereof

Circuit board with embedded electronic component and method for man...

Patents Applicationslast 30 patents

Circuit board

CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE

CHIP PACKAGING STRUCTURE AND METHOD FOR PACKAGING THE CHIP

SYSTEM-IN-PACKAGE MODULE AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND MANUFACTURING...

TRANSPARENT CIRCUIT BOARD

PACKAGING STRUCTURE, PACKAGING SUBSTRATE, AND MANUFACTURING METHOD...

CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...

EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR

CIRCUIT BOARD ASSEMBLY

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRESSURE SENSOR, PRESSURE-SENSITIVE CIRCUIT BOARD, AND MANUFACTURIN...

CIRCUIT BOARD USING THERMOCOUPLE TO DISSIPATE GENERATED HEAT AND ME...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF

CAMERA MODULE HAVING OPTICAL IMAGE STABILIZATION FUNCTION, AND PREP...

BURIED THERMISTOR AND METHOD OF FABRICATING THE SAME

METHOD FOR MANUFACTURING PHOTOELECTRIC COMPOSITE CIRCUIT BOARD

PACKAGING STRUCTURE WITH EMBEDDED ELECTRONIC COMPONENTS AND METHOD...

MULTILAYER CIRCUIT BOARD WITH EMBEDDED MODULE AND METHOD FOR MANUFA...

HEAT EQUALIZATION PLATE

CIRCUIT BOARD

CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD OF FABRICATING THE...

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF

CIRCUIT BOARD ASSEMLY AND METHOD FOR MANUFACTURING THE SAME

PRESSURE SENSING CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

ANTI-SHAKE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, CAMERA MODUL...

METHOD OF MANUFACTURING DISPLAY MODULE WITH LIGHT EMITTING DIODE FR...

Trademarklast 30 trademarks

90381514 - P2HIT

88330690 - A