Carsem (M) Sdn.Bhd.

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Ipoh, MY

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Patents Grantslast 30 patents

Information Patent Grant
Molded integrated circuit packages and methods of forming the same
- Patent number 11,114,367
- Issue date Sep 7, 2021
- Carsem (M) Sdn. Bhd.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile electronic package
- Patent number 10,468,319
- Issue date Nov 5, 2019
- Carsem (M) Sdn. Bhd.
- Yan Shan Ng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible window clamp
- Patent number 10,147,700
- Issue date Dec 4, 2018
- Carsem (M) Sdn. Bhd.
- Wong Chee Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded integrated circuit packages
- Patent number 9,935,039
- Issue date Apr 3, 2018
- Carsem (M) Sdn. Bhd.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,691,688
- Issue date Jun 27, 2017
- CARSEM (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic packages
- Patent number 9,640,517
- Issue date May 2, 2017
- Carsem (M) Sdn. Bhd.
- Thong Kai Choh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,190,385
- Issue date Nov 17, 2015
- Carsem (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Color yield of white LEDs
- Patent number 9,048,397
- Issue date Jun 2, 2015
- Carsem (M) Sdn. Bhd.
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Short and low loop wire bonding
- Patent number 8,946,913
- Issue date Feb 3, 2015
- Carsem (M) Sdn. Bhd.
- Liew Siew Har
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loop wire bonding
- Patent number 8,941,249
- Issue date Jan 27, 2015
- Carsem (M) SDN, BHD.
- Liew Siew Har
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode (LED) packages
- Patent number 8,674,488
- Issue date Mar 18, 2014
- Carsem (M) Sdn. Bhd.
- Yong Lam Wai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large panel leadframe
- Patent number 8,535,988
- Issue date Sep 17, 2013
- Carsem (M) Sdn. Bhd.
- Yong Lam Wai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Short and low loop wire bonding
- Patent number 8,525,352
- Issue date Sep 3, 2013
- Carsem (M) Sdn. Bhd.
- Liew Siew Har
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low loop wire bonding
- Patent number 8,513,819
- Issue date Aug 20, 2013
- Carsem (M) Sdn. Bhd.
- Liew Siew Har
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing light emitting diode (LED) packages
- Patent number 8,394,675
- Issue date Mar 12, 2013
- Carsem (M) SDN. BHD.
- Yong Lam Wai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with recessed cavity for LED
- Patent number 8,314,479
- Issue date Nov 20, 2012
- Carsem (M) SDN. BHD.
- Yong Lam Wai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package using stud bump coated with solder
- Patent number 8,071,470
- Issue date Dec 6, 2011
- Carsem (M) SDN. BHD.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple row exposed leads for MLP high density packages
- Patent number 7,846,774
- Issue date Dec 7, 2010
- Carsem (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-free lead frame
- Patent number 7,786,554
- Issue date Aug 31, 2010
- Carsem (M) Sdn. Bhd.
- Lee Kock Huat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making integrated circuit package with transparent encaps...
- Patent number 7,741,161
- Issue date Jun 22, 2010
- Carsem (M) Sdn. Bhd.
- Ah Lek Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making the mould for encapsulating a leadframe package
- Patent number 7,351,611
- Issue date Apr 1, 2008
- Carsem (M) Sdn Bhd
- Richard Mow Lum Yee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Stress-free lead frame
- Patent number 7,288,833
- Issue date Oct 30, 2007
- Carsem (M) Sdn. Bhd.
- Lee Kock Huat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a cavity package
- Patent number 7,273,767
- Issue date Sep 25, 2007
- Carsem (M) Sdn. Bhd.
- King Hoo Ong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for encapsulating lead frame packages
- Patent number 7,214,562
- Issue date May 8, 2007
- Carsem (M) Sdn. Bhd.
- Richard Yee Mow Lum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip on lead frame
- Patent number 6,953,711
- Issue date Oct 11, 2005
- Carsem (M) Sdn. Bhd.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED INTEGRATED CIRCUIT PACKAGES
- Publication number 20200219800
- Publication date Jul 9, 2020
- Carsem (M) SDN. BHD.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED INTEGRATED CIRCUIT PACKAGES
- Publication number 20180211902
- Publication date Jul 26, 2018
- Carsem (M) Sdn.Bhd.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PROFILE ELECTRONIC PACKAGE
- Publication number 20180150673
- Publication date May 31, 2018
- Carsem (M) Sdn.Bhd.
- Yan Shan Ng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE WINDOW CLAMP
- Publication number 20170256518
- Publication date Sep 7, 2017
- Carsem (M) Sdn.Bhd.
- Wong Chee Heng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN PLASTIC LEADLESS PACKAGE WITH EXPOSED METAL DIE PADDLE
- Publication number 20160049357
- Publication date Feb 18, 2016
- Carsem (M) Sdn.Bhd.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONIC PACKAGES
- Publication number 20150237721
- Publication date Aug 20, 2015
- Carsem (M) SDN. BHD.
- Thong Kai Choh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRE-MOLDED INTEGRATED CIRCUIT PACKAGES
- Publication number 20150179553
- Publication date Jun 25, 2015
- Carsem (M) Sdn.Bhd.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLOR YIELD OF WHITE LEDS
- Publication number 20150087087
- Publication date Mar 26, 2015
- CARSEM (M) SDN. BHD.
- Edmund Sales Cabatbat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPOUND MOLDING
- Publication number 20140021491
- Publication date Jan 23, 2014
- Carsem (M) Sdn.Bhd.
- Chan Boon Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHORT AND LOW LOOP WIRE BONDING
- Publication number 20130328194
- Publication date Dec 12, 2013
- Carsem (M) Sdn.Bhd.
- Liew Siew Har
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING LIGHT EMITTING DIODE (LED) PACKAGES
- Publication number 20130221382
- Publication date Aug 29, 2013
- Carsem (M) Sdn.Bhd.
- Yong Lam Wai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE LAYERS IN SEMICONDUCTOR PACKAGING
- Publication number 20130200503
- Publication date Aug 8, 2013
- CARSEM (M) SDN, BHD.
- Chan Boon Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE PANEL LEADFRAME
- Publication number 20130109137
- Publication date May 2, 2013
- CARSEM (M) SDN. BHD.
- Yong Lam Wai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
LOW LOOP WIRE BONDING
- Publication number 20130062765
- Publication date Mar 14, 2013
- Carsem (M) Sdn.Bhd.
- Liew Siew Har
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHORT AND LOW LOOP WIRE BONDING
- Publication number 20120256314
- Publication date Oct 11, 2012
- Carsem (M) Sdn.Bhd.
- Liew Siew Har
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH RECESSED CAVITY FOR LED
- Publication number 20120104421
- Publication date May 3, 2012
- Carsem (M) Sdn.Bhd.
- Yong Lam Wai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING LIGHT EMITTING DIODE (LED) PACKAGES
- Publication number 20120107974
- Publication date May 3, 2012
- Carsem (M) Sdn.Bhd.
- Yong Lam Wai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
- Publication number 20120043655
- Publication date Feb 23, 2012
- CARSEM (M) SDN. BHD.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
- Publication number 20100102444
- Publication date Apr 29, 2010
- CARSEM (M) SDN. BHD.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Plastic Leadless Package with Exposed Metal Die Paddle
- Publication number 20090026594
- Publication date Jan 29, 2009
- Carsem (M) Sdn.Bhd.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Making Integrated Circuit Package with Transparent Encaps...
- Publication number 20080286901
- Publication date Nov 20, 2008
- Carsem (M) Sdn.Bhd.
- Ah Lek Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-FREE LEAD FRAME
- Publication number 20080023806
- Publication date Jan 31, 2008
- Carsem (M) Sdn. Bhd.
- Lee Kock Huat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE ROW EXPOSED LEADS FOR MLP HIGH DENSITY PACKAGES
- Publication number 20070281392
- Publication date Dec 6, 2007
- CARSEM (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package with transparent encapsulant and method...
- Publication number 20050167790
- Publication date Aug 4, 2005
- Carsem (M) Sdn.Bhd.
- Lek Ah Khor
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
86157444 - PPAKCSM
- Serial number 86157444
- Registration number 5130996
- Filing date Jan 4, 2014
- Carsem (M) Sdn Bhd
- 40 - Treatment of materials

Carsem (M) Sdn.Bhd.

Organization

Patents Grantslast 30 patents

Molded integrated circuit packages and methods of forming the same

Low-profile electronic package

Flexible window clamp

Pre-molded integrated circuit packages

Thin plastic leadless package with exposed metal die paddle

Stacked electronic packages

Thin plastic leadless package with exposed metal die paddle

Color yield of white LEDs

Short and low loop wire bonding

Low loop wire bonding

Light emitting diode (LED) packages

Large panel leadframe

Short and low loop wire bonding

Low loop wire bonding

Manufacturing light emitting diode (LED) packages

Leadframe package with recessed cavity for LED

Wafer level package using stud bump coated with solder

Multiple row exposed leads for MLP high density packages

Stress-free lead frame

Method of making integrated circuit package with transparent encaps...

Method of making the mould for encapsulating a leadframe package

Stress-free lead frame

Method of manufacturing a cavity package

Method for encapsulating lead frame packages

Flip chip on lead frame

Patents Applicationslast 30 patents

MOLDED INTEGRATED CIRCUIT PACKAGES

PRE-MOLDED INTEGRATED CIRCUIT PACKAGES

LOW-PROFILE ELECTRONIC PACKAGE

FLEXIBLE WINDOW CLAMP

THIN PLASTIC LEADLESS PACKAGE WITH EXPOSED METAL DIE PADDLE

STACKED ELECTRONIC PACKAGES

PRE-MOLDED INTEGRATED CIRCUIT PACKAGES

COLOR YIELD OF WHITE LEDS

MULTI-COMPOUND MOLDING

SHORT AND LOW LOOP WIRE BONDING

MANUFACTURING LIGHT EMITTING DIODE (LED) PACKAGES

PROTECTIVE LAYERS IN SEMICONDUCTOR PACKAGING

LARGE PANEL LEADFRAME

LOW LOOP WIRE BONDING

SHORT AND LOW LOOP WIRE BONDING

LEADFRAME PACKAGE WITH RECESSED CAVITY FOR LED

MANUFACTURING LIGHT EMITTING DIODE (LED) PACKAGES

WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER

WAFER LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER

Thin Plastic Leadless Package with Exposed Metal Die Paddle

Method of Making Integrated Circuit Package with Transparent Encaps...

STRESS-FREE LEAD FRAME

MULTIPLE ROW EXPOSED LEADS FOR MLP HIGH DENSITY PACKAGES

Integrated circuit package with transparent encapsulant and method...

Trademarklast 30 trademarks

86157444 - PPAKCSM