GARUDA TECHNOLOGY CO., LTD

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Patents Grantslast 30 patents

Information Patent Grant
Buried thermistor and method of fabricating the same
- Patent number 12,191,056
- Issue date Jan 7, 2025
- HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.
- Jian Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing photoelectric composite circuit board
- Patent number 12,153,252
- Issue date Nov 26, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing thereof
- Patent number 12,120,812
- Issue date Oct 15, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Hao-Yi Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method for manufacturing thereof
- Patent number 12,108,533
- Issue date Oct 1, 2024
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Zhi Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board using thermocouple to dissipate generated heat and me...
- Patent number 12,101,871
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Huan-Yu He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board
- Patent number 12,082,352
- Issue date Sep 3, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Yao-Cai Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 12,028,967
- Issue date Jul 2, 2024
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixing belt of wearable device, method for manufacturing the same,...
- Patent number 11,968,788
- Issue date Apr 23, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Yong-Quan Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board assembly
- Patent number 11,825,595
- Issue date Nov 21, 2023
- HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly and manufacturing method thereof
- Patent number 11,792,914
- Issue date Oct 17, 2023
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Zhi-Hong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board utilizing optical signals in addition to electrical s...
- Patent number 11,754,781
- Issue date Sep 12, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 11,744,004
- Issue date Aug 29, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Wei-Xiang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 11,696,391
- Issue date Jul 4, 2023
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 11,627,668
- Issue date Apr 11, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Yong-Chao Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 11,617,263
- Issue date Mar 28, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Lin-Jie Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, method for manufacturing the same
- Patent number 11,606,862
- Issue date Mar 14, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Po-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with at least one embedded electronic component and m...
- Patent number 11,589,463
- Issue date Feb 21, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Jia-He Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,576,257
- Issue date Feb 7, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- G02 - OPTICS
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 11,570,883
- Issue date Jan 31, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Ying Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board with heat dissipation function
- Patent number 11,553,602
- Issue date Jan 10, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Yin-Ju Chen
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Flexible circuit board and method for manufacturing same
- Patent number 11,445,618
- Issue date Sep 13, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Yao-Cai Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Board-to-board connecting structure and method for manufacturing th...
- Patent number 11,424,563
- Issue date Aug 23, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Xiao-Feng Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing circuit board
- Patent number 11,399,430
- Issue date Jul 26, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Wei-Liang Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with at least one embedded electronic component and m...
- Patent number 11,324,115
- Issue date May 3, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Yong-Chao Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing an ultrathin heat dissipation structure
- Patent number 10,923,411
- Issue date Feb 16, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Ning Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin heat dissipation structure
- Patent number 10,448,540
- Issue date Oct 15, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Ning Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board and method for manufacturing same
- Patent number 10,285,260
- Issue date May 7, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation device and method for manufacturing same
- Patent number 10,012,454
- Issue date Jul 3, 2018
- Avary Holding (Shenzhen) Co., Limited.
- Xian-Qin Hu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Printed circuit board
- Patent number 9,992,858
- Issue date Jun 5, 2018
- Avary Holding (Shenzhen) Co., Limited.
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a circuit board
- Patent number 9,872,393
- Issue date Jan 16, 2018
- Avary Holding (Shenzhen) Co., Limited.
- Tzu-Chien Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250056721
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Cheng-Jia LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSDUCER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250055388
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Jun DAI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
- Publication number 20250056715
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Chao WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED RESISTORS AND METHOD FOR FABRICATING TH...
- Publication number 20250056725
- Publication date Feb 13, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Juan ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250038068
- Publication date Jan 30, 2025
- QingDing Precision Electronics (Huai’an) Co., Ltd.
- Hao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20250031306
- Publication date Jan 23, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Juan ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250031301
- Publication date Jan 23, 2025
- Avary Holding (Shenzhen) Co., Ltd.
- Hao-Wen ZHONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20250031313
- Publication date Jan 23, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Chao WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE
- Publication number 20240284608
- Publication date Aug 22, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Gang Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND MANUFACTURING...
- Publication number 20240196512
- Publication date Jun 13, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- YING WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING STRUCTURE, PACKAGING SUBSTRATE, AND MANUFACTURING METHOD...
- Publication number 20240170301
- Publication date May 23, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- ZHI-CHENG LAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...
- Publication number 20240147629
- Publication date May 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHANG-HE ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20240040687
- Publication date Feb 1, 2024
- Avary Holding (Shenzhen) Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240006748
- Publication date Jan 4, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD USING THERMOCOUPLE TO DISSIPATE GENERATED HEAT AND ME...
- Publication number 20230389170
- Publication date Nov 30, 2023
- Avary Holding (Shenzhen) Co., Limited.
- HUAN-YU HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20230389185
- Publication date Nov 30, 2023
- Avary Holding (Shenzhen) Co., Ltd.
- Zhi GUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BURIED THERMISTOR AND METHOD OF FABRICATING THE SAME
- Publication number 20230377779
- Publication date Nov 23, 2023
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Jian WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PHOTOELECTRIC COMPOSITE CIRCUIT BOARD
- Publication number 20230375780
- Publication date Nov 23, 2023
- Avary Holding (Shenzhen) Co., Limited.
- WEI-LIANG WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20230239998
- Publication date Jul 27, 2023
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230199954
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Limited.
- LIN-JIE GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD OF FABRICATING THE...
- Publication number 20230199966
- Publication date Jun 22, 2023
- Avary Holding (Shenzhen) Co., Ltd.
- Zi-Qiang GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20230171875
- Publication date Jun 1, 2023
- Avary Holding (Shenzhen) Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20230171876
- Publication date Jun 1, 2023
- Avary Holding (Shenzhen) Co., Ltd.
- Zhi-Hong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230171877
- Publication date Jun 1, 2023
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Hao-Yi WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230156906
- Publication date May 18, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- XIN LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATTERY ASSEMBLY, BATTERY MODULE, AND METHOD FOR MANUFACTURING THE...
- Publication number 20230155257
- Publication date May 18, 2023
- Avary Holding (Shenzhen) Co., Limited.
- JIN-CHENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230127697
- Publication date Apr 27, 2023
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230125928
- Publication date Apr 27, 2023
- Avary Holding (Shenzhen) Co., Limited.
- YING WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220377873
- Publication date Nov 24, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YING WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH AT LEAST ONE EMBEDDED ELECTRONIC COMPONENT AND M...
- Publication number 20220377906
- Publication date Nov 24, 2022
- Avary Holding (Shenzhen) Co., Limited.
- JIA-HE LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

GARUDA TECHNOLOGY CO., LTD

Organization

Patents Grantslast 30 patents

Buried thermistor and method of fabricating the same

Method for manufacturing photoelectric composite circuit board

Circuit board and method of manufacturing thereof

Circuit board and method for manufacturing thereof

Circuit board using thermocouple to dissipate generated heat and me...

Flexible circuit board

Method of manufacturing wiring substrate

Fixing belt of wearable device, method for manufacturing the same,...

Manufacturing method of circuit board assembly

Circuit board assembly and manufacturing method thereof

Circuit board utilizing optical signals in addition to electrical s...

Circuit board and method of manufacturing the same

Wiring substrate and method of manufacturing the same

Method for manufacturing a circuit board

Circuit board and method for manufacturing the same

Circuit board, method for manufacturing the same

Circuit board with at least one embedded electronic component and m...

Circuit board

Method for manufacturing a circuit board

Method for manufacturing circuit board with heat dissipation function

Flexible circuit board and method for manufacturing same

Board-to-board connecting structure and method for manufacturing th...

Method for manufacturing circuit board

Circuit board with at least one embedded electronic component and m...

Method for manufacturing an ultrathin heat dissipation structure

Ultrathin heat dissipation structure

Flexible printed circuit board and method for manufacturing same

Heat dissipation device and method for manufacturing same

Printed circuit board

Method for making a circuit board

Patents Applicationslast 30 patents

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

TRANSDUCER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

FLEXIBLE CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME

CIRCUIT BOARD WITH EMBEDDED RESISTORS AND METHOD FOR FABRICATING TH...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

FLEXIBLE CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

FLEXIBLE CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

CIRCUIT BOARD, MANUFACTURING METHOD, AND DISPLAY MODULE

CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND MANUFACTURING...

PACKAGING STRUCTURE, PACKAGING SUBSTRATE, AND MANUFACTURING METHOD...

CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...

CIRCUIT BOARD ASSEMBLY

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD USING THERMOCOUPLE TO DISSIPATE GENERATED HEAT AND ME...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THEREOF

BURIED THERMISTOR AND METHOD OF FABRICATING THE SAME

METHOD FOR MANUFACTURING PHOTOELECTRIC COMPOSITE CIRCUIT BOARD

METHOD OF MANUFACTURING WIRING SUBSTRATE

CIRCUIT BOARD

CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD OF FABRICATING THE...

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF

CIRCUIT BOARD ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME

BATTERY ASSEMBLY, BATTERY MODULE, AND METHOD FOR MANUFACTURING THE...

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD WITH AT LEAST ONE EMBEDDED ELECTRONIC COMPONENT AND M...

Trademarklast 30 trademarks