High Connection Density, Inc.

Organization

Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Low inductance electrical contacts and LGA connector system
- Patent number 6,846,184
- Issue date Jan 25, 2005
- High Connection Density Inc.
- Zhineng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precision cutter for elastomeric cable
- Patent number 6,742,426
- Issue date Jun 1, 2004
- High Connection Density, Inc.
- Douglas E. Cote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-reliability interposer for low cost and high reliability appli...
- Patent number 6,723,927
- Issue date Apr 20, 2004
- High Connection Density, Inc.
- Zhineng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test and burn-in connector
- Patent number 6,722,893
- Issue date Apr 20, 2004
- High Connection Density, Inc.
- Che-Yu Li
- G01 - MEASURING TESTING
Information Patent Grant
Thermally enhanced interposer and method
- Patent number 6,712,621
- Issue date Mar 30, 2004
- High Connection Density, Inc.
- Che-Yu Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coaxial elastomeric connector system
- Patent number 6,712,620
- Issue date Mar 30, 2004
- High Connection Density, Inc.
- Che-Yu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable memory module with variable bandwidth
- Patent number 6,705,877
- Issue date Mar 16, 2004
- High Connection Density, Inc.
- Che-yu Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface mount attachable land grid array connector and method of fo...
- Patent number 6,663,399
- Issue date Dec 16, 2003
- High Connection Density, Inc.
- Hassan O. Ali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High capacity memory module with built-in performance enhancing fea...
- Patent number 6,661,690
- Issue date Dec 9, 2003
- High Connection Density, Inc.
- Sharon L. Moriarty
- G11 - INFORMATION STORAGE
Information Patent Grant
Contact assembly for land grid array interposer or electrical conne...
- Patent number 6,659,778
- Issue date Dec 9, 2003
- High Connection Density, Inc.
- Che-Yu Li
- G01 - MEASURING TESTING
Information Patent Grant
Shielded carrier with components for land grid array connectors
- Patent number 6,638,077
- Issue date Oct 28, 2003
- High Connection Density, Inc.
- Zhineng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Short channel, memory module with stacked printed circuit boards
- Patent number 6,597,062
- Issue date Jul 22, 2003
- High Connection Density, Inc.
- Che-yu Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Compact stacked electronic package
- Patent number 6,590,159
- Issue date Jul 8, 2003
- High Connection Density, Inc.
- Zhineng Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test and burn-in connector
- Patent number 6,551,112
- Issue date Apr 22, 2003
- High Connection Density, Inc.
- Che-Yu Li
- G01 - MEASURING TESTING
Information Patent Grant
Method of forming a contact member cable
- Patent number 6,546,625
- Issue date Apr 15, 2003
- High Connection Density, Inc.
- Ai D. Le
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacity SDRAM memory module with stacked printed circuit boards
- Patent number 6,545,895
- Issue date Apr 8, 2003
- High Connection Density, Inc.
- Che-yu Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High I/O stacked modules for integrated circuits
- Patent number 6,540,525
- Issue date Apr 1, 2003
- High Connection Density, Inc.
- Che-Yu Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High capacity memory module with high electrical design margins
- Patent number 6,496,380
- Issue date Dec 17, 2002
- High Connection Density, Inc.
- Che-Yu Li
- G11 - INFORMATION STORAGE
Information Patent Grant
High density, high frequency memory chip modules having thermal man...
- Patent number 6,480,014
- Issue date Nov 12, 2002
- High Connection Density, Inc.
- Che-yu Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Shielded carrier for land grid array connectors and a process for f...
- Patent number 6,471,525
- Issue date Oct 29, 2002
- High Connection Density, Inc.
- Zhineng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacity memory module with higher density and improved manufa...
- Patent number 6,449,166
- Issue date Sep 10, 2002
- High Connection Density, Inc.
- Thomas R. Sly
- G11 - INFORMATION STORAGE
Information Patent Grant
Contact assembly for land grid array interposer or electrical conne...
- Patent number 6,439,894
- Issue date Aug 27, 2002
- High Connection Density, Inc.
- Che-Yu Li
- G01 - MEASURING TESTING
Information Patent Grant
Low profile, high density memory system
- Patent number 6,381,164
- Issue date Apr 30, 2002
- High Connection Density, Inc.
- Zhineng Fan
- G11 - INFORMATION STORAGE
Information Patent Grant
Carrier for land grid array connectors
- Patent number 6,370,770
- Issue date Apr 16, 2002
- High Connection Density, Inc.
- Zhineng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier for land grid array connectors
- Patent number 6,312,266
- Issue date Nov 6, 2001
- High Connection Density, Inc.
- Zhineng Fan
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
77646049 - SUPERBUTTON
- Serial number 77646049
- Registration number 3759949
- Filing date Jan 8, 2009
- HIGH CONNECTION DENSITY, INC.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
77642389 - SUPERSPRING
- Serial number 77642389
- Registration number 3759942
- Filing date Dec 31, 2008
- HIGH CONNECTION DENSITY, INC.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78076595 - NEXMOD
- Serial number 78076595
- Filing date Jul 31, 2001
- HIGH CONNECTION DENSITY, INC.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

High Connection Density, Inc.

Organization

Patents Grantslast 30 patents

Low inductance electrical contacts and LGA connector system

Precision cutter for elastomeric cable

High-reliability interposer for low cost and high reliability appli...

Test and burn-in connector

Thermally enhanced interposer and method

Coaxial elastomeric connector system

Stackable memory module with variable bandwidth

Surface mount attachable land grid array connector and method of fo...

High capacity memory module with built-in performance enhancing fea...

Contact assembly for land grid array interposer or electrical conne...

Shielded carrier with components for land grid array connectors

Short channel, memory module with stacked printed circuit boards

Compact stacked electronic package

Test and burn-in connector

Method of forming a contact member cable

High capacity SDRAM memory module with stacked printed circuit boards

High I/O stacked modules for integrated circuits

High capacity memory module with high electrical design margins

High density, high frequency memory chip modules having thermal man...

Shielded carrier for land grid array connectors and a process for f...

High capacity memory module with higher density and improved manufa...

Contact assembly for land grid array interposer or electrical conne...

Low profile, high density memory system

Carrier for land grid array connectors

Carrier for land grid array connectors

Trademarklast 30 trademarks

77646049 - SUPERBUTTON

77642389 - SUPERSPRING

78076595 - NEXMOD