Claims
- 1. A method for assembling a high-density memory module, the steps comprising:a) attaching a plurality of memory devices to at least one daughter card having a plurality of pins along at least one edge thereof, said pins being respectively and operatively connected to said plurality of memory devices; b) providing a memory board having a plurality of plated through holes adapted to detachably receive and retain said plurality of pins therein, said pins thereby providing substantially all retentive forces needed to releasably retain said daughter card to said memory board; c) after said attaching step (a), testing each of said at least one daughter card connected to said memory board; d) detaching and replacing any daughter card failing said test performed in step (c); e) retesting said replaced daughter card; and f) repeating said detaching and rep lacing step (d) and said retesting step (e) until a completely functional memory module is obtained.
- 2. The method for assembling a high-density memory module as recited in claim 1, the steps further comprising:g) soldering said at least one daughter card to said memory board upon successful completion of said testing step (c) and retesting step (e).
- 3. The method for assembling a high-density memory module as recited in claim 2, the steps further comprising:h) placing at least one heat transfer means between predetermined ones of said daughter cards.
RELATED PATENT APPLICATION
This application is a divisional of U.S. patent application Ser. No. 09/461,065 filed Dec. 14, 1999.
This application is related to U.S. Pat. No. 5,928,005, issued to Li et al. for SELF-ASSEMBLED LOW INSERTION FORCE CONNECTOR ASSEMBLY and U.S. Pat. No. 6,172,895, issued to Brown et al. for HIGH CAPACITY MEMORY MODULE WITH BUILT-IN-HIGH-SPEED BUS TERMINATIONS; and copending U.S. patent application Ser. No. 09/461,064, now abandoned, all of which are hereby incorporated by reference.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
5801924 |
Salmonson |
Sep 1998 |
A |
6275559 |
Ramani et al. |
Aug 2001 |
B1 |
6304082 |
Gualtieri et al. |
Oct 2001 |
B1 |