HSIO TECHNOLOGIES, LLC

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Maple Grove, MN, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of making a fusion bonded circuit structure
- Patent number 10,667,410
- Issue date May 26, 2020
- HSIO Technologies, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid printed circuit assembly with low density main core and embe...
- Patent number 10,609,819
- Issue date Mar 31, 2020
- HSIO Technologies, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fusion bonded liquid crystal polymer electrical circuit structure
- Patent number 10,506,722
- Issue date Dec 10, 2019
- HSIO Technologies, LLC
- James J. Rathburn
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrodeposited contact terminal for use as an electrical connecto...
- Patent number 10,453,789
- Issue date Oct 22, 2019
- HSIO Technologies, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fusion bonded liquid crystal polymer circuit structure
- Patent number 10,159,154
- Issue date Dec 18, 2018
- HSIO Technologies, LLC
- James Rathburn
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper pillar full metal via electrical circuit structure
- Patent number 9,930,775
- Issue date Mar 27, 2018
- HSIO Technologies, LLC
- Jim Rathburn
- G02 - OPTICS
Information Patent Grant
Method of making an electrical connector having electrodeposited te...
- Patent number 9,761,520
- Issue date Sep 12, 2017
- HSIO Technologies, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile electrical interconnect with fusion bonded contact rete...
- Patent number 9,755,335
- Issue date Sep 5, 2017
- HSIO Technologies, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid printed circuit assembly with low density main core and embe...
- Patent number 9,699,906
- Issue date Jul 4, 2017
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Performance enhanced semiconductor socket
- Patent number 9,689,897
- Issue date Jun 27, 2017
- HSIO Technologies, LLC
- James Rathburn
- G01 - MEASURING TESTING
Information Patent Grant
High performance surface mount electrical interconnect
- Patent number 9,660,368
- Issue date May 23, 2017
- HSIO Technologies, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area array semiconductor device package interconnect structure with...
- Patent number 9,613,841
- Issue date Apr 4, 2017
- HSIO Technologies, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct metalization of electrical circuit structures
- Patent number 9,603,249
- Issue date Mar 21, 2017
- HSIO Technologies, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical contact retention within an electrical connector
- Patent number 9,559,447
- Issue date Jan 31, 2017
- HSIO Technologies, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor socket with direct selective metalization
- Patent number 9,536,815
- Issue date Jan 3, 2017
- HSIO Technologies, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant printed flexible circuit
- Patent number 9,414,500
- Issue date Aug 9, 2016
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective metalization of electrical connector or socket housing
- Patent number 9,350,093
- Issue date May 24, 2016
- HSIO Technologies, LLC
- Jim Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed circuit assembly with integral terminal and mating bias...
- Patent number 9,350,124
- Issue date May 24, 2016
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnect IC device socket
- Patent number 9,320,133
- Issue date Apr 19, 2016
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a semiconductor socket
- Patent number 9,320,144
- Issue date Apr 19, 2016
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an electronic interconnect
- Patent number 9,318,862
- Issue date Apr 19, 2016
- HSIO Technologies, LLC
- Jim Rathburn
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Composite polymer-metal electrical contacts
- Patent number 9,277,654
- Issue date Mar 1, 2016
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnect IC device socket
- Patent number 9,276,339
- Issue date Mar 1, 2016
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metalized pad to electrical contact interface
- Patent number 9,276,336
- Issue date Mar 1, 2016
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance electrical circuit structure
- Patent number 9,232,654
- Issue date Jan 5, 2016
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resilient conductive electrical interconnect
- Patent number 9,231,328
- Issue date Jan 5, 2016
- HSIO Technologies, LLC
- James Rathburn
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
High performance surface mount electrical interconnect with externa...
- Patent number 9,196,980
- Issue date Nov 24, 2015
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector insulator housing
- Patent number 9,184,527
- Issue date Nov 10, 2015
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package adapter
- Patent number 9,184,145
- Issue date Nov 10, 2015
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Compliant printed circuit wafer level semiconductor package
- Patent number 9,136,196
- Issue date Sep 15, 2015
- HSIO Technologies, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY, HIGH PERFORMANCE ELECTRICAL INTERCONNECT CIRCUIT STRU...
- Publication number 20180124928
- Publication date May 3, 2018
- HSIO TECHNOLOGIES, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODEPOSITED CONTACT TERMINAL FOR USE AS AN ELECTRICAL CONNECTO...
- Publication number 20180012832
- Publication date Jan 11, 2018
- HSIO TECHNOLOGIES, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PRINTED CIRCUIT ASSEMBLY WITH LOW DENSITY MAIN CORE AND EMBE...
- Publication number 20170303401
- Publication date Oct 19, 2017
- HSIO TECHNOLOGIES, LLC
- James J. Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MECHANICAL CONTACT RETENTION WITHIN AN ELECTRICAL CONNECTOR
- Publication number 20160276762
- Publication date Sep 22, 2016
- HSIO TECHNOLOGIES, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE ELECTRICAL INTERCONNECT WITH FUSION BONDED CONTACT RETE...
- Publication number 20160276763
- Publication date Sep 22, 2016
- HSIO TECHNOLOGIES, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUSION BONDED LIQUID CRYSTAL POLYMER ELECTRICAL CIRCUIT STRUCTURE
- Publication number 20160212862
- Publication date Jul 21, 2016
- HSIO TECHNOLOGIES, LLC
- James J. Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODEPOSITED CONTACT TERMINAL FOR USE AS AN ELECTRICAL CONNECTO...
- Publication number 20160192507
- Publication date Jun 30, 2016
- HSIO TECHNOLOGIES, LLC
- James J. Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FUSION BONDED LIQUID CRYSTAL POLYMER CIRCUIT STRUCTURE
- Publication number 20160014908
- Publication date Jan 14, 2016
- HSIO TECHNOLOGIES, LLC
- JAMES RATHBURN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HYBRID PRINTED CIRCUIT ASSEMBLY WITH LOW DENSITY MAIN CORE AND EMBE...
- Publication number 20150181710
- Publication date Jun 25, 2015
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE SURFACE MOUNT ELECTRICAL INTERCONNECT
- Publication number 20150162678
- Publication date Jun 11, 2015
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED CIRCUIT ASSEMBLY WITH INTEGRAL TERMINAL AND MATING BIAS...
- Publication number 20150136467
- Publication date May 21, 2015
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERFORMANCE ENHANCED SEMICONDUCTOR SOCKET
- Publication number 20150091600
- Publication date Apr 2, 2015
- HSIO TECHNOLOGIES, LLC
- JAMES RATHBURN
- G01 - MEASURING TESTING
Information Patent Application
MATRIX DEFINED ELECTRICAL CIRCUIT STRUCTURE
- Publication number 20150013901
- Publication date Jan 15, 2015
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE METALIZATION OF ELECTRICAL CONNECTOR OR SOCKET HOUSING
- Publication number 20140242816
- Publication date Aug 28, 2014
- HSIO TECHNOLOGIES, LLC
- JIM RATHBURN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR FULL METAL VIA ELECTRICAL CIRCUIT STRUCTURE
- Publication number 20140225255
- Publication date Aug 14, 2014
- HSIO TECHNOLOGIES, LLC
- JIM RATHBURN
- G02 - OPTICS
Information Patent Application
HIGH PERFORMANCE ELECTRICAL CONNECTOR WITH TRANSLATED INSULATOR CON...
- Publication number 20140220797
- Publication date Aug 7, 2014
- HSIO TECHNOLOGIES, LLC
- JIM RATHBURN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT METALIZATION OF ELECTRICAL CIRCUIT STRUCTURES
- Publication number 20140192498
- Publication date Jul 10, 2014
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT PRINTED CIRCUIT SEMICONDUCTOR PACKAGE
- Publication number 20140080258
- Publication date Mar 20, 2014
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT CORE PERIPHERAL LEAD SEMICONDUCTOR SOCKET
- Publication number 20140043782
- Publication date Feb 13, 2014
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- G01 - MEASURING TESTING
Information Patent Application
HIGH PERFORMANCE SURFACE MOUNT ELECTRICAL INTERCONNECT
- Publication number 20130244490
- Publication date Sep 19, 2013
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE ELECTRICAL CIRCUIT STRUCTURE
- Publication number 20130223034
- Publication date Aug 29, 2013
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT IC DEVICE SOCKET
- Publication number 20130206468
- Publication date Aug 15, 2013
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT IC DEVICE SOCKET
- Publication number 20130210276
- Publication date Aug 15, 2013
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH SPEED BACKPLANE CONNECTOR
- Publication number 20130203273
- Publication date Aug 8, 2013
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE ADAPTER
- Publication number 20130105984
- Publication date May 2, 2013
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTOR INSULATOR HOUSING
- Publication number 20130078860
- Publication date Mar 28, 2013
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT PRINTED CIRCUIT SOCKET DIAGNOSTIC TOOL
- Publication number 20120268155
- Publication date Oct 25, 2012
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- G01 - MEASURING TESTING
Information Patent Application
HIGH PERFORMANCE SURFACE MOUNT ELECTRICAL INTERCONNECT WITH EXTERNA...
- Publication number 20120244728
- Publication date Sep 27, 2012
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPLIANT CORE PERIPHERAL LEAD SEMICONDUCTOR TEST SOCKET
- Publication number 20120199985
- Publication date Aug 9, 2012
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- G01 - MEASURING TESTING
Information Patent Application
COMPLIANT CONDUCTIVE NANO-PARTICLE ELECTRICAL INTERCONNECT
- Publication number 20120202364
- Publication date Aug 9, 2012
- HSIO TECHNOLOGIES, LLC
- James RATHBURN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

HSIO TECHNOLOGIES, LLC

Organization

Patents Grantslast 30 patents

Method of making a fusion bonded circuit structure

Hybrid printed circuit assembly with low density main core and embe...

Fusion bonded liquid crystal polymer electrical circuit structure

Electrodeposited contact terminal for use as an electrical connecto...

Fusion bonded liquid crystal polymer circuit structure

Copper pillar full metal via electrical circuit structure

Method of making an electrical connector having electrodeposited te...

Low profile electrical interconnect with fusion bonded contact rete...

Hybrid printed circuit assembly with low density main core and embe...

Performance enhanced semiconductor socket

High performance surface mount electrical interconnect

Area array semiconductor device package interconnect structure with...

Direct metalization of electrical circuit structures

Mechanical contact retention within an electrical connector

Semiconductor socket with direct selective metalization

Compliant printed flexible circuit

Selective metalization of electrical connector or socket housing

High speed circuit assembly with integral terminal and mating bias...

Electrical interconnect IC device socket

Method of forming a semiconductor socket

Method of making an electronic interconnect

Composite polymer-metal electrical contacts

Electrical interconnect IC device socket

Metalized pad to electrical contact interface

High performance electrical circuit structure

Resilient conductive electrical interconnect

High performance surface mount electrical interconnect with externa...

Electrical connector insulator housing

Semiconductor device package adapter

Compliant printed circuit wafer level semiconductor package

Patents Applicationslast 30 patents

HIGH DENSITY, HIGH PERFORMANCE ELECTRICAL INTERCONNECT CIRCUIT STRU...

ELECTRODEPOSITED CONTACT TERMINAL FOR USE AS AN ELECTRICAL CONNECTO...

HYBRID PRINTED CIRCUIT ASSEMBLY WITH LOW DENSITY MAIN CORE AND EMBE...

MECHANICAL CONTACT RETENTION WITHIN AN ELECTRICAL CONNECTOR

LOW PROFILE ELECTRICAL INTERCONNECT WITH FUSION BONDED CONTACT RETE...

FUSION BONDED LIQUID CRYSTAL POLYMER ELECTRICAL CIRCUIT STRUCTURE

ELECTRODEPOSITED CONTACT TERMINAL FOR USE AS AN ELECTRICAL CONNECTO...

FUSION BONDED LIQUID CRYSTAL POLYMER CIRCUIT STRUCTURE

HYBRID PRINTED CIRCUIT ASSEMBLY WITH LOW DENSITY MAIN CORE AND EMBE...

HIGH PERFORMANCE SURFACE MOUNT ELECTRICAL INTERCONNECT

HIGH SPEED CIRCUIT ASSEMBLY WITH INTEGRAL TERMINAL AND MATING BIAS...

PERFORMANCE ENHANCED SEMICONDUCTOR SOCKET

MATRIX DEFINED ELECTRICAL CIRCUIT STRUCTURE

SELECTIVE METALIZATION OF ELECTRICAL CONNECTOR OR SOCKET HOUSING

COPPER PILLAR FULL METAL VIA ELECTRICAL CIRCUIT STRUCTURE

HIGH PERFORMANCE ELECTRICAL CONNECTOR WITH TRANSLATED INSULATOR CON...

DIRECT METALIZATION OF ELECTRICAL CIRCUIT STRUCTURES

COMPLIANT PRINTED CIRCUIT SEMICONDUCTOR PACKAGE

COMPLIANT CORE PERIPHERAL LEAD SEMICONDUCTOR SOCKET

HIGH PERFORMANCE SURFACE MOUNT ELECTRICAL INTERCONNECT

HIGH PERFORMANCE ELECTRICAL CIRCUIT STRUCTURE

ELECTRICAL INTERCONNECT IC DEVICE SOCKET

ELECTRICAL INTERCONNECT IC DEVICE SOCKET

HIGH SPEED BACKPLANE CONNECTOR

SEMICONDUCTOR DEVICE PACKAGE ADAPTER

ELECTRICAL CONNECTOR INSULATOR HOUSING

COMPLIANT PRINTED CIRCUIT SOCKET DIAGNOSTIC TOOL

HIGH PERFORMANCE SURFACE MOUNT ELECTRICAL INTERCONNECT WITH EXTERNA...

COMPLIANT CORE PERIPHERAL LEAD SEMICONDUCTOR TEST SOCKET

COMPLIANT CONDUCTIVE NANO-PARTICLE ELECTRICAL INTERCONNECT

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