Multek Technologies Limited

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Dummy core restrict resin process and structure
- Patent number 10,772,220
- Issue date Sep 8, 2020
- Multek Technologies Limited
- J L Zhou
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Measuring complex PCB-based interconnects in a production environment
- Patent number 10,712,398
- Issue date Jul 14, 2020
- Multek Technologies Limited
- Franz Gisin
- G01 - MEASURING TESTING
Information Patent Grant
Inline metrology on air flotation for PCB applications
- Patent number 10,458,778
- Issue date Oct 29, 2019
- Multek Technologies Limited
- Michael James Glickman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dummy core plus plating resist restrict resin process and structure
- Patent number 10,321,560
- Issue date Jun 11, 2019
- Multek Technologies Limited
- Pui Yin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Disconnect cavity by plating resist process and structure
- Patent number 10,292,279
- Issue date May 14, 2019
- Multek Technologies Limited
- Jiawen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diffuse fiber optic lighting for luggage
- Patent number 10,123,603
- Issue date Nov 13, 2018
- Multek Technologies Limited
- Michael James Glickman
- F21 - LIGHTING
Information Patent Grant
Recessed cavity in printed circuit board protected by LPI
- Patent number 10,064,292
- Issue date Aug 28, 2018
- Multek Technologies Limited
- Kwan Pen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB hybrid redistribution layer
- Patent number 10,009,992
- Issue date Jun 26, 2018
- Multek Technologies Limited
- Joan K. Vrtis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-decap cavity fabrication process and structure
- Patent number 9,999,134
- Issue date Jun 12, 2018
- Multek Technologies Limited
- Mark Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid-bend printed circuit board fabrication
- Patent number 9,992,880
- Issue date Jun 5, 2018
- Multek Technologies Limited
- Pui Yin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective segment via plating process and structure
- Patent number 9,867,290
- Issue date Jan 9, 2018
- Multek Technologies Limited
- Kwan Pen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective segment via plating process and structure
- Patent number 9,763,327
- Issue date Sep 12, 2017
- Multek Technologies Limited
- Kwan Pen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded components in a substrate
- Patent number 9,521,754
- Issue date Dec 13, 2016
- Multek Technologies Limited
- Mark Bergman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RESIN FLOW RESTRICTION PROCESS AND STRUCTURE
- Publication number 20210385952
- Publication date Dec 9, 2021
- Multek Technologies Limited
- Pui Yin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUMMY CORE RESTRICT RESIN PROCESS AND STRUCTURE
- Publication number 20200015365
- Publication date Jan 9, 2020
- Multek Technologies Limited
- JL Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPLIT VIA SECOND DRILL PROCESS AND STRUCTURE
- Publication number 20170339788
- Publication date Nov 23, 2017
- Multek Technologies Limited
- Znewa Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISCONNECT CAVITY BY PLATING RESIST PROCESS AND STRUCTURE
- Publication number 20170318685
- Publication date Nov 2, 2017
- Multek Technologies Limited
- Jiawen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED CAVITY IN PRINTED CIRCUIT BOARD BY SOLDER MASK DAM
- Publication number 20170271734
- Publication date Sep 21, 2017
- Multek Technologies Limited
- Pui Yin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED CAVITY IN PRINTED CIRCUIT BOARD PROTECTED BY LPI
- Publication number 20170273195
- Publication date Sep 21, 2017
- Multek Technologies Limited
- Kwan Pen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-DECAP CAVITY FABRICATION PROCESS AND STRUCTURE
- Publication number 20170265298
- Publication date Sep 14, 2017
- Multek Technologies Limited
- Mark Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUMMY CORE RESTRICT RESIN PROCESS AND STRUCTURE
- Publication number 20170238416
- Publication date Aug 17, 2017
- Multek Technologies Limited
- JL Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB HYBRID REDISTRIBUTION LAYER
- Publication number 20170164458
- Publication date Jun 8, 2017
- Multek Technologies Limited
- Joan K. Vrtis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUMMY CORE PLUS PLATING RESIST RESTRICT RESIN PROCESS AND STRUCTURE
- Publication number 20170142828
- Publication date May 18, 2017
- Multek Technologies Limited
- Pui Yin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-BEND PRINTED CIRCUIT BOARD FABRICATION
- Publication number 20170142829
- Publication date May 18, 2017
- Multek Technologies Limited
- Pui Yin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Multek Technologies Limited

Organization

Patents Grantslast 30 patents

Dummy core restrict resin process and structure

Measuring complex PCB-based interconnects in a production environment

Inline metrology on air flotation for PCB applications

Dummy core plus plating resist restrict resin process and structure

Disconnect cavity by plating resist process and structure

Diffuse fiber optic lighting for luggage

Recessed cavity in printed circuit board protected by LPI

PCB hybrid redistribution layer

Self-decap cavity fabrication process and structure

Rigid-bend printed circuit board fabrication

Selective segment via plating process and structure

Selective segment via plating process and structure

Embedded components in a substrate

Patents Applicationslast 30 patents

RESIN FLOW RESTRICTION PROCESS AND STRUCTURE

DUMMY CORE RESTRICT RESIN PROCESS AND STRUCTURE

SPLIT VIA SECOND DRILL PROCESS AND STRUCTURE

DISCONNECT CAVITY BY PLATING RESIST PROCESS AND STRUCTURE

EMBEDDED CAVITY IN PRINTED CIRCUIT BOARD BY SOLDER MASK DAM

RECESSED CAVITY IN PRINTED CIRCUIT BOARD PROTECTED BY LPI

SELF-DECAP CAVITY FABRICATION PROCESS AND STRUCTURE

DUMMY CORE RESTRICT RESIN PROCESS AND STRUCTURE

PCB HYBRID REDISTRIBUTION LAYER

DUMMY CORE PLUS PLATING RESIST RESTRICT RESIN PROCESS AND STRUCTURE

RIGID-BEND PRINTED CIRCUIT BOARD FABRICATION

Trademarklast 30 trademarks