NIKO SEMICONDUCTOR CO., LTD.

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Taipei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Power module and power device
- Patent number 12,048,122
- Issue date Jul 23, 2024
- Niko Semiconductor Co., Ltd.
- Chung-Ming Leng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module including a carrier assembly with combination of circu...
- Patent number 11,387,180
- Issue date Jul 12, 2022
- Niko Semiconductor Co., Ltd.
- Chung-Ming Leng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brake energy recovery module
- Patent number 10,668,815
- Issue date Jun 2, 2020
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Manufacturing method of a chip package structure
- Patent number 10,629,452
- Issue date Apr 21, 2020
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
One-way conduction device
- Patent number 10,560,090
- Issue date Feb 11, 2020
- Niko Semiconductor Co., Ltd.
- Chung-Ming Leng
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Fan-out wafer level chip package structure
- Patent number 10,381,268
- Issue date Aug 13, 2019
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 10,297,522
- Issue date May 21, 2019
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor package structure and manufacturing method thereof
- Patent number 10,043,728
- Issue date Aug 7, 2018
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 9,947,551
- Issue date Apr 17, 2018
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of ultra-thin semiconductor device package ass...
- Patent number 9,881,897
- Issue date Jan 30, 2018
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level chip package structure and manufacturing method...
- Patent number 9,799,563
- Issue date Oct 24, 2017
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion apparatus and control chip thereof
- Patent number 9,537,418
- Issue date Jan 3, 2017
- Niko Semiconductor Co., Ltd.
- Ta-Ching Hsu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Manufacturing method of wafer level chip scale package structure
- Patent number 9,337,049
- Issue date May 10, 2016
- Niko Semiconductor Co., Ltd.
- Chih Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and packaging method of wafer level chip scale pa...
- Patent number 9,299,592
- Issue date Mar 29, 2016
- Niko Semiconductor Co., Ltd.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternating-current conversion system having low power consumption...
- Patent number 9,130,449
- Issue date Sep 8, 2015
- Niko Semiconductor Co., Ltd.
- Ta-Ching Hsu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Conversion control circuit and converter thereof
- Patent number 9,078,319
- Issue date Jul 7, 2015
- Niko Semiconductor Co., Ltd.
- Ta-Ching Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED current balance driving circuit
- Patent number 9,030,109
- Issue date May 12, 2015
- Niko Semiconductor Co., Ltd.
- Chien-Ching Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiphase DC-to-DC converter
- Patent number 8,988,053
- Issue date Mar 24, 2015
- Niko Semiconductor Co., Ltd.
- Ta-Ching Hsu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Alternating-current conversion system having low power consumption...
- Patent number 8,988,910
- Issue date Mar 24, 2015
- Niko Semiconductor Co., Ltd.
- Ta-Ching Hsu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Soft-switching control circuit for DC motor
- Patent number 8,853,980
- Issue date Oct 7, 2014
- Niko Semiconductor Co., Ltd.
- Chia-Jung Chang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Secondary side synchronous rectification control circuit and switch...
- Patent number 8,837,184
- Issue date Sep 16, 2014
- Niko Semiconductor Co., Ltd.
- Ta-Ching Hsu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Flyback power converter with multiple outputs and a secondary side...
- Patent number 8,730,688
- Issue date May 20, 2014
- Niko Semiconductor Co., Ltd.
- Ta-Ching Hsu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor structure with low resistance of substrate and low po...
- Patent number 8,729,632
- Issue date May 20, 2014
- Niko Semiconductor Co., Ltd.
- Hsiu Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lock protection and standby mode control circuit of motor driving a...
- Patent number 8,629,638
- Issue date Jan 14, 2014
- Niko Semiconductor Co., Ltd.
- Chia-Jung Chang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Predictive synchronous rectification controller, switching power co...
- Patent number 8,576,587
- Issue date Nov 5, 2013
- Niko Semiconductor Co., Ltd.
- Ta-Ching Hsu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
LED driving circuit and power converting circuit
- Patent number 8,492,993
- Issue date Jul 23, 2013
- Green Solution Technology Co., Ltd.
- Shian-Sung Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED driving circuit and backlight module
- Patent number 8,427,073
- Issue date Apr 23, 2013
- Green Solution Technology Co., Ltd.
- Wei Liang Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of trenched power MOSFET
- Patent number 8,426,275
- Issue date Apr 23, 2013
- Niko Semiconductor Co., Ltd.
- Kou-Way Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide semiconductor (MOS) structure and manufacturing method...
- Patent number 8,399,921
- Issue date Mar 19, 2013
- Niko Semiconductor Co., Ltd.
- Kao-Way Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secondary side post regulator of flyback power converter with multi...
- Patent number 8,310,847
- Issue date Nov 13, 2012
- Niko Semiconductor Co., Ltd.
- Ta-Ching Hsu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

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Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD
- Publication number 20240224414
- Publication date Jul 4, 2024
- NIKO SEMICONDUCTOR CO., LTD.
- CHUNG-MING LENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240204095
- Publication date Jun 20, 2024
- NIKO SEMICONDUCTOR CO., LTD.
- SUNG-NIEN TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240194776
- Publication date Jun 13, 2024
- NIKO SEMICONDUCTOR CO., LTD.
- SUNG-NIEN TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATING CURRENT CONTROL SYSTEM
- Publication number 20240178745
- Publication date May 30, 2024
- NIKO SEMICONDUCTOR CO., LTD.
- Hui-Chiang Yang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POWER MODULE PACKAGE
- Publication number 20230369163
- Publication date Nov 16, 2023
- NIKO SEMICONDUCTOR CO., LTD.
- Hui-Chiang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE
- Publication number 20230369186
- Publication date Nov 16, 2023
- NIKO SEMICONDUCTOR CO., LTD.
- Hui-Chiang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER DEVICE
- Publication number 20230225087
- Publication date Jul 13, 2023
- NIKO SEMICONDUCTOR CO., LTD.
- Chung-Ming LENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE
- Publication number 20210057324
- Publication date Feb 25, 2021
- NIKO SEMICONDUCTOR CO., LTD.
- Chung-Ming LENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ONE-WAY CONDUCTION DEVICE
- Publication number 20190140636
- Publication date May 9, 2019
- NIKO SEMICONDUCTOR CO., LTD.
- CHUNG-MING LENG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180308781
- Publication date Oct 25, 2018
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MANUFACTURING METHOD OF A CHIP PACKAGE STRUCTURE
- Publication number 20180190507
- Publication date Jul 5, 2018
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRAKE ENERGY RECOVERY MODULE
- Publication number 20180093573
- Publication date Apr 5, 2018
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- B60 - VEHICLES IN GENERAL
Information Patent Application
FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE
- Publication number 20170338154
- Publication date Nov 23, 2017
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170256473
- Publication date Sep 7, 2017
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160336232
- Publication date Nov 17, 2016
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ULTRA-THIN SEMICONDUCTOR DEVICE PACKAGE ASS...
- Publication number 20160211240
- Publication date Jul 21, 2016
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20160126228
- Publication date May 5, 2016
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH-CHENG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE
- Publication number 20160111293
- Publication date Apr 21, 2016
- NIKO SEMICONDUCTOR CO., LTD.
- CHIH CHENG HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKAGING METHOD OF WAFER LEVEL CHIP SCALE PA...
- Publication number 20150262843
- Publication date Sep 17, 2015
- SUPER GROUP SEMICONDUCTOR CO., LTD.
- Chih-Cheng Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER CONVERSION APPARATUS AND CONTROL CHIP THEREOF
- Publication number 20150180324
- Publication date Jun 25, 2015
- NIKO SEMICONDUCTOR CO., LTD.
- Ta-Ching Hsu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ALTERNATING-CURRENT CONVERSION SYSTEM HAVING LOW POWER CONSUMPTION...
- Publication number 20150109834
- Publication date Apr 23, 2015
- NIKO SEMICONDUCTOR CO., LTD.
- Ta-Ching HSU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ALTERNATING-CURRENT CONVERSION SYSTEM HAVING LOW POWER CONSUMPTION...
- Publication number 20140169047
- Publication date Jun 19, 2014
- NIKO SEMICONDUCTOR CO., LTD.
- Ta-Ching HSU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MULTIPHASE DC-to-DC CONVERTER
- Publication number 20140002038
- Publication date Jan 2, 2014
- NIKO SEMICONDUCTOR CO., LTD.
- Ta-Ching HSU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
POWER SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130313696
- Publication date Nov 28, 2013
- NIKO SEMICONDUCTOR CO., LTD.
- Chih-Cheng HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER FACTOR CORRECTION (PFC) CONTROLLER AND BRIDGELESS PFC CIRCUIT...
- Publication number 20130249504
- Publication date Sep 26, 2013
- NIKO SEMICONDUCTOR CO., LTD.
- TA-CHING HSU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CONVERSION CONTROL CIRCUIT AND CONVERTER THEREOF
- Publication number 20130187566
- Publication date Jul 25, 2013
- NIKO SEMICONDUCTOR CO., LTD.
- TA-CHING HSU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LED CURRENT BALANCE DRIVING CIRCUIT
- Publication number 20130134887
- Publication date May 30, 2013
- NIKO SEMICONDUCTOR CO., LTD.
- CHIEN-CHING LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SECONDARY SIDE SYNCHRONOUS RECTIFICATION CONTROL CIRCUIT AND SWITCH...
- Publication number 20130094249
- Publication date Apr 18, 2013
- NIKO SEMICONDUCTOR CO., LTD.
- TA-CHING HSU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SOFT-SWITCHING CONTROL CIRCUIT FOR DC MOTOR
- Publication number 20130043818
- Publication date Feb 21, 2013
- NIKO SEMICONDUCTOR CO., LTD.
- CHIA-JUNG CHANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LOCK PROTECTION AND STANDBY MODE CONTROL CIRCUIT OF MOTOR DRIVING A...
- Publication number 20130009573
- Publication date Jan 10, 2013
- NIKO SEMICONDUCTOR CO., LTD.
- CHIA-JUNG CHANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

NIKO SEMICONDUCTOR CO., LTD.

Organization

Patents Grantslast 30 patents

Power module and power device

Power module including a carrier assembly with combination of circu...

Brake energy recovery module

Manufacturing method of a chip package structure

One-way conduction device

Fan-out wafer level chip package structure

Semiconductor package structure and manufacturing method thereof

Semiconductor package structure and manufacturing method thereof

Chip package structure and manufacturing method thereof

Manufacturing method of ultra-thin semiconductor device package ass...

Fan-out wafer level chip package structure and manufacturing method...

Power conversion apparatus and control chip thereof

Manufacturing method of wafer level chip scale package structure

Package structure and packaging method of wafer level chip scale pa...

Alternating-current conversion system having low power consumption...

Conversion control circuit and converter thereof

LED current balance driving circuit

Multiphase DC-to-DC converter

Alternating-current conversion system having low power consumption...

Soft-switching control circuit for DC motor

Secondary side synchronous rectification control circuit and switch...

Flyback power converter with multiple outputs and a secondary side...

Semiconductor structure with low resistance of substrate and low po...

Lock protection and standby mode control circuit of motor driving a...

Predictive synchronous rectification controller, switching power co...

LED driving circuit and power converting circuit

LED driving circuit and backlight module

Fabrication method of trenched power MOSFET

Metal oxide semiconductor (MOS) structure and manufacturing method...

Secondary side post regulator of flyback power converter with multi...

Patents Applicationslast 30 patents

CIRCUIT BOARD

POWER DEVICE AND METHOD FOR MANUFACTURING THE SAME

POWER DEVICE AND METHOD FOR MANUFACTURING THE SAME

ALTERNATING CURRENT CONTROL SYSTEM

POWER MODULE PACKAGE

POWER MODULE PACKAGE

POWER MODULE AND POWER DEVICE

POWER MODULE

ONE-WAY CONDUCTION DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF A CHIP PACKAGE STRUCTURE

BRAKE ENERGY RECOVERY MODULE

FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF ULTRA-THIN SEMICONDUCTOR DEVICE PACKAGE ASS...

FAN-OUT WAFER LEVEL CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD...

MANUFACTURING METHOD OF WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE

PACKAGE STRUCTURE AND PACKAGING METHOD OF WAFER LEVEL CHIP SCALE PA...

POWER CONVERSION APPARATUS AND CONTROL CHIP THEREOF

ALTERNATING-CURRENT CONVERSION SYSTEM HAVING LOW POWER CONSUMPTION...

ALTERNATING-CURRENT CONVERSION SYSTEM HAVING LOW POWER CONSUMPTION...

MULTIPHASE DC-to-DC CONVERTER

POWER SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

POWER FACTOR CORRECTION (PFC) CONTROLLER AND BRIDGELESS PFC CIRCUIT...

CONVERSION CONTROL CIRCUIT AND CONVERTER THEREOF

LED CURRENT BALANCE DRIVING CIRCUIT

SECONDARY SIDE SYNCHRONOUS RECTIFICATION CONTROL CIRCUIT AND SWITCH...

SOFT-SWITCHING CONTROL CIRCUIT FOR DC MOTOR

LOCK PROTECTION AND STANDBY MODE CONTROL CIRCUIT OF MOTOR DRIVING A...