Orient Semiconductor Electronics Limited

Organization

Kaohsiung, TW

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package including electromagnetic shielding structure an...
- Patent number 11,462,485
- Issue date Oct 4, 2022
- Orient Semiconductor Electronics, Limited
- Yueh-Ming Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising heat spreader and manufacturing me...
- Patent number 11,462,454
- Issue date Oct 4, 2022
- Orient Semiconductor Electronics, Limited
- Yueh-Ming Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package comprising heat spreader
- Patent number 11,355,356
- Issue date Jun 7, 2022
- Orient Semiconductor Electronics, Limited
- Yueh-Ming Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus of checking dimensions of memory card
- Patent number 8,627,577
- Issue date Jan 14, 2014
- Orient Semiconductor Electronics, Limited
- I Chi Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Memory card
- Patent number D647096
- Issue date Oct 18, 2011
- Orient Semiconductor Electronics, Limited
- Yueh Ming Tung
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Memory card
- Patent number D647097
- Issue date Oct 18, 2011
- Orient Semiconductor Electronics, Limited
- Yueh Ming Tung
- D14 - Recording, communication, or information retrieval equipment
Information Patent Grant
Memory card with electrostatic discharge protection and manufacturi...
- Patent number 7,948,772
- Issue date May 24, 2011
- Orient Semiconductor Electronics
- Yueh-Ming Tung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame structure and applications thereof
- Patent number 7,576,418
- Issue date Aug 18, 2009
- Orient Semiconductor Electronics, Ltd.
- Chia-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 7,394,147
- Issue date Jul 1, 2008
- Orient Semiconductor Electronics, Limited
- Kuo Yang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package Structure
- Patent number 7,115,978
- Issue date Oct 3, 2006
- Orient Semiconductor Electronics, Ltd.
- Kuo-Yang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with heat-dissipating capability
- Patent number 6,847,111
- Issue date Jan 25, 2005
- Orient Semiconductor Electronics, Ltd.
- Chia-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of affixing a heat sink to a substrate and package thereof
- Patent number 6,677,185
- Issue date Jan 13, 2004
- Orient Semiconductor Electronics Limited
- Hung Chin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation method of underfill for flip chip package and the device
- Patent number 6,608,391
- Issue date Aug 19, 2003
- Orient Semiconductor Electronics Limited
- Tung-Shen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of a pin platform for integrated circuit
- Patent number 6,600,216
- Issue date Jul 29, 2003
- Orient Semiconductor Electronics Limited
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection device for wiring of an integrated circuit
- Patent number 6,577,151
- Issue date Jun 10, 2003
- Orient Semiconductor Electronics Limited
- Chon-Tsai Yang
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor chip package with cooling arrangement
- Patent number 6,567,270
- Issue date May 20, 2003
- Orient Semiconductor Electronics Limited
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold injection method for semiconductor device
- Patent number 6,521,484
- Issue date Feb 18, 2003
- Orient Semiconductor Electronics, Ltd.
- Wen-Lo Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for making a metal bump with an increased height
- Patent number 6,499,648
- Issue date Dec 31, 2002
- Orient Semiconductor Electronics Limited
- Wen-Lo Shieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming cylindrical bumps on a substrate for integrated c...
- Patent number 6,390,356
- Issue date May 21, 2002
- Orient Semiconductor Electronics Limited
- Wen Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps on wafers or substrates
- Patent number 6,358,834
- Issue date Mar 19, 2002
- Orient Semiconductor Electronics Limited
- Wen Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of a ball grid array substrate with charts for indicating...
- Patent number 6,274,883
- Issue date Aug 14, 2001
- Orient Semiconductor Electronics Ltd.
- W. L. Whieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of manufacturing thin ball grid array substrates
- Patent number 6,274,491
- Issue date Aug 14, 2001
- Orient Semiconductor Electronics Limited
- Wan Le Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation module
- Patent number 6,260,611
- Issue date Jul 17, 2001
- Orient Semiconductor Electronics Ltd.
- W. L. Whieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip fabrication method and apparatus therefor
- Patent number 6,033,934
- Issue date Mar 7, 2000
- Orient Semiconductor Electronics Ltd.
- Wen-Lo Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame for manufacturing encapsulated semiconductor devices
- Patent number 5,821,607
- Issue date Oct 13, 1998
- Orient Semiconductor Electronics, Ltd.
- Wen-Lo Hsieh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER THINNING METHOD
- Publication number 20220285217
- Publication date Sep 8, 2022
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- YUEH-MING TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MANUFACTURE THEREOF
- Publication number 20220270981
- Publication date Aug 25, 2022
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- YUEH-MING TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE COMPRISING HEAT SPREADER
- Publication number 20220199428
- Publication date Jun 23, 2022
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- YUEH-MING TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE COMPRISING HEAT SPREADER AND MANUFACTURING ME...
- Publication number 20220189842
- Publication date Jun 16, 2022
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- YUEH-MING TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210005574
- Publication date Jan 7, 2021
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- YUEH-MING TUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS OF CHECKING DIMENSIONS OF MEMORY CARD
- Publication number 20120192445
- Publication date Aug 2, 2012
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- I Chi CHENG
- G01 - MEASURING TESTING
Information Patent Application
MICRO PROJECTOR MODULE
- Publication number 20120038839
- Publication date Feb 16, 2012
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- Yueh Ming TUNG
- G02 - OPTICS
Information Patent Application
STACK CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20090189295
- Publication date Jul 30, 2009
- Orient Semiconductor Electronics, Ltd.
- Yueh-Ming TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CARD WITH ELECTROSTATIC DISCHARGE PROTECTION AND MANUFACTURI...
- Publication number 20090154040
- Publication date Jun 18, 2009
- ORIENT SEMICONDUCTOR ELECTRONICS
- Yueh-Ming Tung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR DISCHARGING ELECTRONIC DEVICES...
- Publication number 20080304245
- Publication date Dec 11, 2008
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- Chih Ming CHOU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY CARD WITH ELECTROSTATIC DISCHARGE PROTECTION
- Publication number 20080007932
- Publication date Jan 10, 2008
- ORIENT SEMICONDUCTOR ELECTRONICS
- Yueh-Ming Tung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor package structure and method for manufacturing the same
- Publication number 20070205493
- Publication date Sep 6, 2007
- Orient Semiconductor Electronics, Ltd.
- Yueh-Ming Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20060012040
- Publication date Jan 19, 2006
- ORIENT SEMICONDUCTOR ELECTRONICS, LIMITED
- Kuo Yang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with heat-dissipating capability
- Publication number 20040075166
- Publication date Apr 22, 2004
- Orient Semiconductor Electronics, Ltd.
- Chia-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
77578864 - OSE A PARTNER YOU CAN COUNT ON
- Serial number 77578864
- Registration number 3615521
- Filing date Sep 25, 2008
- Orient Semiconductor Electronics Limited
- 40 - Treatment of materials
Information Trademark
75711215 - OSE
- Serial number 75711215
- Registration number 2505128
- Filing date May 20, 1999
- Orient Semiconductor Electronics, Limited
- 40 - Treatment of materials
Information Trademark
75483713
- Serial number 75483713
- Registration number 2304835
- Filing date May 12, 1998
- Orient Semiconductor Electronics Limited
- 40 - Treatment of materials
Information Trademark
75415122 - OSE
- Serial number 75415122
- Registration number 2349025
- Filing date Jan 8, 1998
- Orient Semiconductor Electronics, Limited
- 40 - Treatment of materials

Orient Semiconductor Electronics Limited

Organization

Patents Grantslast 30 patents

Electronic package including electromagnetic shielding structure an...

Semiconductor package comprising heat spreader and manufacturing me...

Manufacturing method of semiconductor package comprising heat spreader

Apparatus of checking dimensions of memory card

Memory card

Memory card

Memory card with electrostatic discharge protection and manufacturi...

Lead frame structure and applications thereof

Semiconductor package

Package Structure

Semiconductor device with heat-dissipating capability

Method of affixing a heat sink to a substrate and package thereof

Preparation method of underfill for flip chip package and the device

Structure of a pin platform for integrated circuit

Inspection device for wiring of an integrated circuit

Semiconductor chip package with cooling arrangement

Mold injection method for semiconductor device

Method and device for making a metal bump with an increased height

Method of forming cylindrical bumps on a substrate for integrated c...

Method of forming bumps on wafers or substrates

Structure of a ball grid array substrate with charts for indicating...

Process of manufacturing thin ball grid array substrates

Heat dissipation module

Semiconductor chip fabrication method and apparatus therefor

Frame for manufacturing encapsulated semiconductor devices

Patents Applicationslast 30 patents

WAFER THINNING METHOD

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURE THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE COMPRISING HEAT SPREADER

SEMICONDUCTOR PACKAGE COMPRISING HEAT SPREADER AND MANUFACTURING ME...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

APPARATUS OF CHECKING DIMENSIONS OF MEMORY CARD

MICRO PROJECTOR MODULE

STACK CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MEMORY CARD WITH ELECTROSTATIC DISCHARGE PROTECTION AND MANUFACTURI...

SEMICONDUCTOR PACKAGE AND METHOD FOR DISCHARGING ELECTRONIC DEVICES...

MEMORY CARD WITH ELECTROSTATIC DISCHARGE PROTECTION

Semiconductor package structure and method for manufacturing the same

Semiconductor package

Semiconductor device with heat-dissipating capability

Trademarklast 30 trademarks

77578864 - OSE A PARTNER YOU CAN COUNT ON

75711215 - OSE

75483713

75415122 - OSE