Pac Tech - Packaging Technologies GmbH

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Nauen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Bonding head and bonding apparatus
- Patent number 12,358,084
- Issue date Jul 15, 2025
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,349,287
- Issue date Jul 1, 2025
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing and repositioning electronic components connect...
- Patent number 12,171,066
- Issue date Dec 17, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device including laser heating of gripper for repairing...
- Patent number 12,048,972
- Issue date Jul 30, 2024
- PAC Tech-Packaging Technologies GmbH
- Thorsten Krause
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for removing electronic components connected to a circuit board
- Patent number 12,023,756
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball feeding device
- Patent number 11,618,094
- Issue date Apr 4, 2023
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and laser arrangement for fusing a solder material deposit b...
- Patent number 11,554,434
- Issue date Jan 17, 2023
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip stack arrangement and semiconductor chip for pro...
- Patent number 11,367,709
- Issue date Jun 21, 2022
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for the separate application of solder material deposits
- Patent number 11,224,928
- Issue date Jan 18, 2022
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for establishing a wire connection as well as a c...
- Patent number 11,217,558
- Issue date Jan 4, 2022
- PAC Tech-Packaging Technologies GmbH
- Andrej Kolbasow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for placing and contacting a test contact
- Patent number 10,914,759
- Issue date Feb 9, 2021
- PAC Tech-Packaging Technologies GmbH
- Thorsten Krause
- G01 - MEASURING TESTING
Information Patent Grant
Device for the separate application of bonding material deposits
- Patent number 10,695,853
- Issue date Jun 30, 2020
- PAC TECH—PACKAGING TECHNOLOGIES
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for removing a test contact of a test contact arrangement
- Patent number 10,634,699
- Issue date Apr 28, 2020
- PAC Tech-Packaging Technologies GmbH
- Thorsten Krause
- G01 - MEASURING TESTING
Information Patent Grant
Method for producing a chip module
- Patent number 10,354,971
- Issue date Jul 16, 2019
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for the separate application of connecting material deposits
- Patent number 10,286,470
- Issue date May 14, 2019
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming solder deposits
- Patent number 10,118,240
- Issue date Nov 6, 2018
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for the separate application of solder material deposits
- Patent number 10,081,068
- Issue date Sep 25, 2018
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement and method for the reproducible application of small am...
- Patent number 9,975,195
- Issue date May 22, 2018
- PAC Tech-Packaging Technologies GmbH
- Mohammad Hossein Azhdast
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip assembly and method for manufacturing the same
- Patent number 9,685,423
- Issue date Jun 20, 2017
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for electrically contacting terminal faces of two...
- Patent number 9,649,711
- Issue date May 16, 2017
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for transferring a chip to a contact substrate
- Patent number 9,401,298
- Issue date Jul 26, 2016
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for contacting, positioning and impinging a solde...
- Patent number 9,327,360
- Issue date May 3, 2016
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test contact arrangement
- Patent number 8,988,094
- Issue date Mar 24, 2015
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- G01 - MEASURING TESTING
Information Patent Grant
Diode array and method for producing a diode array
- Patent number 8,742,571
- Issue date Jun 3, 2014
- PAC Tech - Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal face contact structure and method of making same
- Patent number 8,497,578
- Issue date Jul 30, 2013
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for positioning and contacting test contacts
- Patent number 8,480,298
- Issue date Jul 9, 2013
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- G01 - MEASURING TESTING
Information Patent Grant
Method for alternately contacting two wafers
- Patent number 8,361,881
- Issue date Jan 29, 2013
- PAC Tech-Packaging Technologies GmbH
- Elke Zakel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device for receiving and transferring a solder ball arrang...
- Patent number 8,328,068
- Issue date Dec 11, 2012
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for removing solder material deposits from a subs...
- Patent number 8,330,076
- Issue date Dec 11, 2012
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Method for Establishing a Contact Connection
- Publication number 20250235961
- Publication date Jul 24, 2025
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND LASER ARRANGEMENT FOR ELECTRICALLY CONTACTING TERMINAL F...
- Publication number 20250196244
- Publication date Jun 19, 2025
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus, System and Method for Repairing a Test Contact Arrangement
- Publication number 20250076342
- Publication date Mar 6, 2025
- Pac Tech - Packaging Technologies GmbH
- Thorsten Krause
- G01 - MEASURING TESTING
Information Patent Application
Package Comprising At Least Two Contacts For Microtechnology, Metho...
- Publication number 20250038468
- Publication date Jan 30, 2025
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding Head and Bonding Apparatus
- Publication number 20240359272
- Publication date Oct 31, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device for Handling a Test Contact
- Publication number 20240337677
- Publication date Oct 10, 2024
- Pac Tech - Packaging Technologies GmbH
- Thorsten Krause
- G01 - MEASURING TESTING
Information Patent Application
Method For Producing A Solder Contact Surface On A Chip By Producin...
- Publication number 20240203913
- Publication date Jun 20, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Depositing Station And Device For Generating Contact Metallizations
- Publication number 20240110286
- Publication date Apr 4, 2024
- Pac Tech - Packaging Technologies GmbH
- Thorsten Krause
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Laser-Assisted Soldering Apparatus
- Publication number 20240109144
- Publication date Apr 4, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
- Publication number 20230369284
- Publication date Nov 16, 2023
- Pac Tech - Packaging Technologies GmbH
- RICARDO GEELHAAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ELECTROLESSLY DEPOSITING A METAL LAYER ONTO A SUBSTRATE
- Publication number 20230313383
- Publication date Oct 5, 2023
- Pac Tech - Packaging Technologies GmbH
- Vinith Bejugam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method For Monitoring A Laser Soldering Process, And Laser Solderin...
- Publication number 20230219163
- Publication date Jul 13, 2023
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser-assisted Soldering Apparatus and Solder Deposition Machine
- Publication number 20230105144
- Publication date Apr 6, 2023
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Press-Forming Device for Depositing Solder and Producing Individual...
- Publication number 20230105729
- Publication date Apr 6, 2023
- Pac Tech - Packaging Technologies GmbH
- Andrej Kolbasow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20220369473
- Publication date Nov 17, 2022
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATING BATH FOR THE ELECTROLESS PLATING OF A SUBSTRATE
- Publication number 20220259743
- Publication date Aug 18, 2022
- Pac Tech - Packaging Technologies GmbH
- ANSHUMA PATHAK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Removing Electronic Components Connected to a Circuit Board
- Publication number 20220126398
- Publication date Apr 28, 2022
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Removing and Repositioning Electronic Components Connect...
- Publication number 20220132714
- Publication date Apr 28, 2022
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR REPAIRING A TEST CONTACT ARRANGEMENT
- Publication number 20210299800
- Publication date Sep 30, 2021
- Pac Tech - Packaging Technologies GmbH
- THORSTEN KRAUSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND LASER ARRANGEMENT FOR FUSING A SOLDER MATERIAL DEPOSIT B...
- Publication number 20210220934
- Publication date Jul 22, 2021
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP STACK ARRANGEMENT AND SEMICONDUCTOR CHIP FOR PRO...
- Publication number 20210193619
- Publication date Jun 24, 2021
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL FEEDING DEVICE
- Publication number 20200269336
- Publication date Aug 27, 2020
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...
- Publication number 20200161273
- Publication date May 21, 2020
- PAC TECH - PACKAGING TECHNOLOGIES GMBH
- ANDREJ KOLBASOW
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR REMOVING A TEST CONTACT OF A TEST CONTACT ARRANGEMENT
- Publication number 20180259554
- Publication date Sep 13, 2018
- Pac Tech - Packaging Technologies GmbH
- Thorsten Krause
- G01 - MEASURING TESTING
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION
- Publication number 20180047697
- Publication date Feb 15, 2018
- Pac Tech - Packaging Technologies GmbH
- Heinrich Lüdeke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Solder Deposits
- Publication number 20170320155
- Publication date Nov 9, 2017
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR THE SEPARATE APPLICATION OF BONDING MATERIAL DEPOSITS
- Publication number 20170165773
- Publication date Jun 15, 2017
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BALL FEEDING DEVICE
- Publication number 20170165772
- Publication date Jun 15, 2017
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING A CHIP MODULE
- Publication number 20170133340
- Publication date May 11, 2017
- Pac Tech - Packaging Technologies GmbH
- Ghassem Azdasht
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
79366809 - ULTRA-SB²
- Serial number 79366809
- Registration number 7483931
- Filing date Feb 23, 2023
- Pac Tech - Packaging Technologies GmbH
- 6 - Common metals and their alloys
Information Trademark
79366807 - PACLINE
- Serial number 79366807
- Registration number 7682915
- Filing date Feb 23, 2023
- Pac Tech - Packaging Technologies GmbH
- 7 - Machines and machine tools
Information Trademark
79366806 - SB²
- Serial number 79366806
- Registration number 7483929
- Filing date Feb 23, 2023
- Pac Tech - Packaging Technologies GmbH
- 6 - Common metals and their alloys
Information Trademark
79366808 - LAPLACE
- Serial number 79366808
- Registration number 7483930
- Filing date Feb 23, 2023
- Pac Tech - Packaging Technologies GmbH
- 6 - Common metals and their alloys
Information Trademark
79251467 - 3.5 D
- Serial number 79251467
- Registration number 6092940
- Filing date Aug 30, 2018
- Pac Tech - Packaging Technologies GmbH
- 6 - Common metals and their alloys
Information Trademark
79146126 - PACTECH MEMBER OF NAGASE GROUP
- Serial number 79146126
- Registration number 4737094
- Filing date Mar 3, 2014
- Pac Tech - Packaging Technologies GmbH
- 6 - Common metals and their alloys

Pac Tech - Packaging Technologies GmbH

Organization

Patents Grantslast 30 patents

Bonding head and bonding apparatus

Method for soldering an electronic component to a circuit board by...

Method for removing and repositioning electronic components connect...

Method and device including laser heating of gripper for repairing...

Method for soldering an electronic component to a circuit board by...

Method for removing electronic components connected to a circuit board

Solder ball feeding device

Method and laser arrangement for fusing a solder material deposit b...

Semiconductor chip stack arrangement and semiconductor chip for pro...

Device for the separate application of solder material deposits

Method and device for establishing a wire connection as well as a c...

Method for placing and contacting a test contact

Device for the separate application of bonding material deposits

Device for removing a test contact of a test contact arrangement

Method for producing a chip module

Device for the separate application of connecting material deposits

Method for forming solder deposits

Device for the separate application of solder material deposits

Arrangement and method for the reproducible application of small am...

Semiconductor chip assembly and method for manufacturing the same

Method and device for electrically contacting terminal faces of two...

Method and device for transferring a chip to a contact substrate

Method and device for contacting, positioning and impinging a solde...

Test contact arrangement

Diode array and method for producing a diode array

Terminal face contact structure and method of making same

Device for positioning and contacting test contacts

Method for alternately contacting two wafers

Transfer device for receiving and transferring a solder ball arrang...

Method and device for removing solder material deposits from a subs...

Patents Applicationslast 30 patents

Apparatus and Method for Establishing a Contact Connection

METHOD AND LASER ARRANGEMENT FOR ELECTRICALLY CONTACTING TERMINAL F...

Apparatus, System and Method for Repairing a Test Contact Arrangement

Package Comprising At Least Two Contacts For Microtechnology, Metho...

Method for Soldering an Electronic Component to a Circuit Board by...

Bonding Head and Bonding Apparatus

Device for Handling a Test Contact

Method For Producing A Solder Contact Surface On A Chip By Producin...

Depositing Station And Device For Generating Contact Metallizations

Laser-Assisted Soldering Apparatus

CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION

METHOD FOR ELECTROLESSLY DEPOSITING A METAL LAYER ONTO A SUBSTRATE

Method For Monitoring A Laser Soldering Process, And Laser Solderin...

Laser-assisted Soldering Apparatus and Solder Deposition Machine

Press-Forming Device for Depositing Solder and Producing Individual...

Method for Soldering an Electronic Component to a Circuit Board by...

PLATING BATH FOR THE ELECTROLESS PLATING OF A SUBSTRATE

Method for Removing Electronic Components Connected to a Circuit Board

Method for Removing and Repositioning Electronic Components Connect...

METHOD AND DEVICE FOR REPAIRING A TEST CONTACT ARRANGEMENT

METHOD AND LASER ARRANGEMENT FOR FUSING A SOLDER MATERIAL DEPOSIT B...

SEMICONDUCTOR CHIP STACK ARRANGEMENT AND SEMICONDUCTOR CHIP FOR PRO...

SOLDER BALL FEEDING DEVICE

METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...

DEVICE FOR REMOVING A TEST CONTACT OF A TEST CONTACT ARRANGEMENT

CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION

Method for Forming Solder Deposits

DEVICE FOR THE SEPARATE APPLICATION OF BONDING MATERIAL DEPOSITS

SOLDER BALL FEEDING DEVICE

METHOD FOR PRODUCING A CHIP MODULE

Trademarklast 30 trademarks

79366809 - ULTRA-SB²

79366807 - PACLINE

79366806 - SB²

79366808 - LAPLACE

79251467 - 3.5 D

79146126 - PACTECH MEMBER OF NAGASE GROUP