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Patents Grants
last 30 patents
Information
Patent Grant
Pre-bonded substrate for integrated circuit package and method of m...
Patent number
8,569,110
Issue date
Oct 29, 2013
QPL Limited
John Robert McMillan
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Pre-bonded substrate for integrated circuit package and method of m...
Patent number
8,513,786
Issue date
Aug 20, 2013
QPL Limited
John Robert McMillan
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Leadframe for enhanced downbond registration during automatic wire...
Patent number
6,822,319
Issue date
Nov 23, 2004
QPL Limited
Yung Piu Lau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method for providing a lead frame with enhanced solde...
Patent number
5,531,860
Issue date
Jul 2, 1996
QPL Limited
Tung L. Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for coating materials in a vacuum chamber
Patent number
5,121,707
Issue date
Jun 16, 1992
QPL Limited
Shyamal K. Kanoo
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...