Claims
- 1. A method for providing a lead frame having leads with solder wetting tips, comprising the steps of:
- forming a lead frame in which a lead of said lead frame is provided a notch at a position on said lead, said notch reducing the cross sectional area of said lead at said position;
- coating said leads of said lead frame with a solder material; and
- trimming said leads at said position.
- 2. A method as in claim 1, wherein said forming step comprises the steps of:
- providing in a photolithographical step a pattern of resist material defining said notch on said lead; and
- using an etchant to create said notch in said lead.
- 3. A method as in claim 1, wherein said step of providing a notch both narrows the width of the lead and thins the thickness of said lead at said position.
- 4. A method as in claim 3, wherein said thinning step comprises the steps of:
- providing in a photolithographical step a pattern of resist material defining a trench area on said lead at said position; and
- using an etchants to create said trench area in said lead.
- 5. A method as in claim 1, where in said notch is formed by a metal stamping technique.
- 6. A method as in claim 1, wherein said notch is formed by a metal milling technique.
Parent Case Info
This application is a division of application Ser. No. 08/125,638, filed Sep. 22, 1993, now U.S. Pat. No. 5,444,293.
US Referenced Citations (8)
Divisions (1)
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Number |
Date |
Country |
Parent |
125638 |
Sep 1993 |
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