-
-
IMAGE-SENSING DEVICE
-
Publication number 20220231069
-
Publication date Jul 21, 2022
-
SILICON OPTRONICS, INC.
-
Bo-Ray LEE
-
H01 - BASIC ELECTRIC ELEMENTS
-
IMAGE-SENSING DEVICE
-
Publication number 20220173144
-
Publication date Jun 2, 2022
-
SILICON OPTRONICS, INC.
-
Bo-Ray LEE
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
-
-
-
-
-
-
-
IMAGE SENSOR DEVICES
-
Publication number 20190181164
-
Publication date Jun 13, 2019
-
SILICON OPTRONICS, INC.
-
Jun- Bo CHEN
-
H01 - BASIC ELECTRIC ELEMENTS
-
ACTIVE PIXEL SENSOR
-
Publication number 20190007640
-
Publication date Jan 3, 2019
-
SILICON OPTRONICS, INC.
-
Xinping HE
-
H04 - ELECTRIC COMMUNICATION TECHNIQUE
-
READOUT CIRCUIT AND SENSING DEVICE
-
Publication number 20180359441
-
Publication date Dec 13, 2018
-
SILICON OPTRONICS, INC.
-
XIAODONG LUO
-
H04 - ELECTRIC COMMUNICATION TECHNIQUE
-
-
OPTICAL FINGERPRINT SENSOR
-
Publication number 20180329577
-
Publication date Nov 15, 2018
-
SILICON OPTRONICS, INC.
-
XINPING HE
-
G06 - COMPUTING CALCULATING COUNTING
-
Image-Sensing Device
-
Publication number 20170256574
-
Publication date Sep 7, 2017
-
SILICON OPTRONICS, INC.
-
Bo-Ray LEE
-
H01 - BASIC ELECTRIC ELEMENTS
-
-
IMAGE SENSOR DEVICES
-
Publication number 20160351612
-
Publication date Dec 1, 2016
-
SILICON OPTRONICS, INC.
-
Pai-Chun ZUNG
-
H01 - BASIC ELECTRIC ELEMENTS
-
IMAGE-CORRECTION SYSTEM AND METHOD
-
Publication number 20160343114
-
Publication date Nov 24, 2016
-
SILICON OPTRONICS, INC.
-
Chun-Hung LIN
-
G06 - COMPUTING CALCULATING COUNTING
-
-
-
BIOCHIP PACKAGE
-
Publication number 20160059230
-
Publication date Mar 3, 2016
-
SILICON OPTRONICS, INC.
-
Chi-Hsing HSU
-
G01 - MEASURING TESTING
-
-
-
-
-
3D STACKED IMAGE SENSOR
-
Publication number 20150122971
-
Publication date May 7, 2015
-
SILICON OPTRONICS, INC.
-
Xinping He
-
H01 - BASIC ELECTRIC ELEMENTS
-
-