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San Jose, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Bump structure formed from using removable mandrel
Patent number
8,119,516
Issue date
Feb 21, 2012
Tessera Interconnect Materials, Inc.
Kimitaka Endo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing multilayer wiring board
Patent number
8,112,881
Issue date
Feb 14, 2012
Tessera Interconnect Materials, Inc.
Kazuhiro Shimizu
B32 - LAYERED PRODUCTS
Information
Patent Grant
Structure and method of making interconnect element, and multilayer...
Patent number
7,923,828
Issue date
Apr 12, 2011
Tessera Interconnect Materials, Inc.
Kimitaka Endo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods of making microelectronic assemblies
Patent number
7,721,422
Issue date
May 25, 2010
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing method for wiring circuit substrate
Patent number
7,546,681
Issue date
Jun 16, 2009
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer wiring board for an electronic device
Patent number
7,505,281
Issue date
Mar 17, 2009
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer wiring board for an electronic device
Patent number
7,342,802
Issue date
Mar 11, 2008
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Connecting member between wiring films, manufacturing method thereo...
Patent number
7,238,603
Issue date
Jul 3, 2007
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing method for wiring circuit substrate
Patent number
7,096,578
Issue date
Aug 29, 2006
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
MICROELECTRONIC SUBSTRATE OR ELEMENT HAVING CONDUCTIVE PADS AND MET...
Publication number
20130186944
Publication date
Jul 25, 2013
Tessera Interconnect Materials, Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION ELEMENT FOR ELECTRIC CIRCUITS
Publication number
20130119012
Publication date
May 16, 2013
Tessera Interconnect Materials, Inc.
Kimitaka Endo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURE AND METHOD OF MAKING INTERCONNECT ELEMENT, AND MULTILAYER...
Publication number
20110252637
Publication date
Oct 20, 2011
Tessera Interconnect Materials, Inc.
Kimitaka Endo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Structure And Method Of Making Interconnect Element Having Metal Tr...
Publication number
20110057324
Publication date
Mar 10, 2011
Tessera Interconnect Materials, Inc.
Hideki Kotake
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CHIP CAPACITOR EMBEDDED PWB
Publication number
20100071944
Publication date
Mar 25, 2010
Tessera Interconnect Materials, Inc.
Kimitaka Endo
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Microelectronic substrate or element having conductive pads and met...
Publication number
20100044860
Publication date
Feb 25, 2010
Tessera Interconnect Materials, Inc.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnection element for electric circuits
Publication number
20090188706
Publication date
Jul 30, 2009
Tessera Interconnect Materials, Inc.
Kimitaka Endo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Process for forming a bump structure and bump structure
Publication number
20090121351
Publication date
May 14, 2009
Tessera Interconnect Materials, Inc.
Kimitaka Endo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer wiring board for an electronic device
Publication number
20080296254
Publication date
Dec 4, 2008
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Member for Interconnecting Wiring Films and Method for Producing th...
Publication number
20080264678
Publication date
Oct 30, 2008
Tessera Interconnect Materials, Inc.
Tomoo lijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Structure and method of making interconnect element having metal tr...
Publication number
20080169568
Publication date
Jul 17, 2008
Tessera Interconnect Materials, Inc.
Hideki Kotake
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Structure and method of making interconnect element having metal tr...
Publication number
20080136041
Publication date
Jun 12, 2008
Tessera Interconnect Materials, Inc.
Hideki Kotake
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method of manufacturing a multi-layer wiring board using a metal me...
Publication number
20080128288
Publication date
Jun 5, 2008
Tessera Interconnect Materials, Inc.
Yukio Hashimoto
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method For Manufacturing Multilayer Wiring Board
Publication number
20080110018
Publication date
May 15, 2008
SONY CHEMICAL & INFORMATION DEVICE CORPORATION
Kazuhiro Shimizu
B32 - LAYERED PRODUCTS
Information
Patent Application
Apparatus and method for distributing a liquid onto a surface of an...
Publication number
20070221329
Publication date
Sep 27, 2007
Tessera Interconnect Materials, Inc.
Kazuo Sakuma
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer wiring board for an electronic device
Publication number
20070121305
Publication date
May 31, 2007
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Manufacturing method for wiring circuit substrate
Publication number
20060258139
Publication date
Nov 16, 2006
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Trademark
last 30 trademarks