Tessera Research LLC

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic assembly with joined bond elements having lowered i...
- Patent number 8,008,785
- Issue date Aug 30, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly with impedance controlled wirebond and con...
- Patent number 7,923,851
- Issue date Apr 12, 2011
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH IO SUBSTRATES AND INTERPOSERS WITHOUT VIAS
- Publication number 20130068516
- Publication date Mar 21, 2013
- Tessera Research LLC
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE ASSEMBLY AND METHOD FOR MAKING SAME
- Publication number 20120313238
- Publication date Dec 13, 2012
- Tessera Research LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE ASSEMBLY AND METHOD FOR MAKING SAME
- Publication number 20120286416
- Publication date Nov 15, 2012
- Tessera Research LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL SYSTEM-IN-A-PACKAGE
- Publication number 20120273933
- Publication date Nov 1, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS IN POROUS SUBSTRATES
- Publication number 20120267789
- Publication date Oct 25, 2012
- Tessera Research LLC
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER HAVING MOLDED LOW CTE DIELECTRIC
- Publication number 20120267751
- Publication date Oct 25, 2012
- Tessera Research LLC
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CHIP MODULE WITH STACKED FACE-DOWN CONNECTED DIES
- Publication number 20120267777
- Publication date Oct 25, 2012
- Tessera Research LLC
- Belgacem Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REINFORCED FAN-OUT WAFER-LEVEL PACKAGE
- Publication number 20120268899
- Publication date Oct 25, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BSI IMAGE SENSOR PACKAGE WITH VARIABLE LIGHT TRANSMISSION FOR EVEN...
- Publication number 20120199924
- Publication date Aug 9, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS
- Publication number 20120181658
- Publication date Jul 19, 2012
- Tessera Research LLC
- Ilyas Mohammed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS
- Publication number 20120155049
- Publication date Jun 21, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING
- Publication number 20120153488
- Publication date Jun 21, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL WAFER SPIN COATING
- Publication number 20120152433
- Publication date Jun 21, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOID-FREE WAFER BONDING USING CHANNELS
- Publication number 20120153426
- Publication date Jun 21, 2012
- Tessera Research LLC
- Vage Oganesian
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS
- Publication number 20120146182
- Publication date Jun 14, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20120145442
- Publication date Jun 14, 2012
- Tessera Research LLC
- Debabrata Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN ATTACHMENT
- Publication number 20120146206
- Publication date Jun 14, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLIANT INTERCONNECTS IN WAFERS
- Publication number 20120146210
- Publication date Jun 14, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC ASSEMBY WITH TSVS FORMED IN STAGES AND CARR...
- Publication number 20120139082
- Publication date Jun 7, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC ASSEMBLY HAVING INTERPOSER CONNECTING ACTIV...
- Publication number 20120139094
- Publication date Jun 7, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PL...
- Publication number 20120139124
- Publication date Jun 7, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS A...
- Publication number 20120126389
- Publication date May 24, 2012
- Tessera Research LLC
- Kishor Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES
- Publication number 20120119367
- Publication date May 17, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO FLOW UNDERFILL
- Publication number 20120104595
- Publication date May 3, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS A...
- Publication number 20120092832
- Publication date Apr 19, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MULTI-DIE PACKAGES WITH IMPEDANCE CONTROL
- Publication number 20120068361
- Publication date Mar 22, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ASSEMBLY HAVING VIA INTERCONNECTS JOINED BY PLATING
- Publication number 20120068351
- Publication date Mar 22, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP ASSEMBLY HAVING VERTICAL VIAS
- Publication number 20120068352
- Publication date Mar 22, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGED VIA FORMATION FROM BOTH SIDES OF CHIP
- Publication number 20120068330
- Publication date Mar 22, 2012
- Tessera Research LLC
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL CAN IMPEDANCE CONTROL STRUCTURE
- Publication number 20120068365
- Publication date Mar 22, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Tessera Research LLC

Organization

Patents Grantslast 30 patents

Microelectronic assembly with joined bond elements having lowered i...

Microelectronic assembly with impedance controlled wirebond and con...

Patents Applicationslast 30 patents

HIGH IO SUBSTRATES AND INTERPOSERS WITHOUT VIAS

SEMICONDUCTOR CHIP PACKAGE ASSEMBLY AND METHOD FOR MAKING SAME

SEMICONDUCTOR CHIP PACKAGE ASSEMBLY AND METHOD FOR MAKING SAME

THREE-DIMENSIONAL SYSTEM-IN-A-PACKAGE

VIAS IN POROUS SUBSTRATES

INTERPOSER HAVING MOLDED LOW CTE DIELECTRIC

MULTI-CHIP MODULE WITH STACKED FACE-DOWN CONNECTED DIES

REINFORCED FAN-OUT WAFER-LEVEL PACKAGE

BSI IMAGE SENSOR PACKAGE WITH VARIABLE LIGHT TRANSMISSION FOR EVEN...

HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS

ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS

SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING

DUAL WAFER SPIN COATING

VOID-FREE WAFER BONDING USING CHANNELS

HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS

INTERCONNECT STRUCTURE

PIN ATTACHMENT

COMPLIANT INTERCONNECTS IN WAFERS

STACKED MICROELECTRONIC ASSEMBY WITH TSVS FORMED IN STAGES AND CARR...

STACKED MICROELECTRONIC ASSEMBLY HAVING INTERPOSER CONNECTING ACTIV...

STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES WITH PL...

ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS A...

CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES

NO FLOW UNDERFILL

ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS A...

STACKED MULTI-DIE PACKAGES WITH IMPEDANCE CONTROL

CHIP ASSEMBLY HAVING VIA INTERCONNECTS JOINED BY PLATING

STACKED CHIP ASSEMBLY HAVING VERTICAL VIAS

STAGED VIA FORMATION FROM BOTH SIDES OF CHIP

METAL CAN IMPEDANCE CONTROL STRUCTURE

Trademarklast 30 trademarks