Tessera Technologies Hungary Kft.

Organization

Budapest, HU

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Wafer-level fabrication of lidded chips with electrodeposited diele...
- Patent number 7,807,508
- Issue date Oct 5, 2010
- Tessera Technologies Hungary Kft
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 7,781,240
- Issue date Aug 24, 2010
- Tessera Technologies Hungary Kft
- Avner Badehi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for packaging integrated circuit devices
- Patent number 7,642,629
- Issue date Jan 5, 2010
- Tessera Technologies Hungary Kft
- Gil Zilber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for packaging integrated circuit devices
- Patent number 7,495,341
- Issue date Feb 24, 2009
- Tessera Technologies Hungary Kft
- Gil Zilber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for packaging integrated circuit devices
- Patent number 7,479,398
- Issue date Jan 20, 2009
- Tessera Technologies Hungary Kft
- Gil Zilber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuits and methods of producing thereof
- Patent number 7,408,249
- Issue date Aug 5, 2008
- Tessera Technologies Hungary Kft
- Avner Badihi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for packaging integrated circuit devices
- Patent number 7,265,440
- Issue date Sep 4, 2007
- Tessera Technologies Hungary Kft
- Gil Zilber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for packaging integrated circuit devices
- Patent number 7,192,796
- Issue date Mar 20, 2007
- Tessera Technologies Hungary Kft
- Gil Zilber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 7,157,742
- Issue date Jan 2, 2007
- Tessera Technologies Hungary Kft
- Avner Badehi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing packaged integrated circuit devices and packa...
- Patent number 7,144,745
- Issue date Dec 5, 2006
- Tessera Technologies Hungary Kft
- Avner Pierre Badehi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for producing packaged integrated circuit devices and packa...
- Patent number 7,033,664
- Issue date Apr 25, 2006
- Tessera Technologies Hungary Kft
- Gil Zilber
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Reducing Erroneous Colors in Edge Areas with Chromatic Abberation
- Publication number 20120008859
- Publication date Jan 12, 2012
- Tessera Technologies Hungary Kft.
- Tomer Schwartz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FIXED FOCAL LENGTH OPTICAL LENS ARCHITECTURE PROVIDING A CUSTOMIZED...
- Publication number 20110115965
- Publication date May 19, 2011
- Tessera Technologies Hungary Kft.
- Kai Engelhardt
- G02 - OPTICS
Information Patent Application
Integrated circuit device
- Publication number 20100323475
- Publication date Dec 23, 2010
- Tessera Technologies Hungary Kft.
- Avner Badehi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC ASSEMBLIES HAVING VIAS EXTENDING THROUGH BO...
- Publication number 20100230795
- Publication date Sep 16, 2010
- Tessera Technologies Hungary Kft.
- Moshe Kriman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assemblies having compliancy and methods therefor
- Publication number 20080150121
- Publication date Jun 26, 2008
- Tessera Technologies Hungary Kft.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level fabrication of lidded chips with electrodeposited diele...
- Publication number 20080099900
- Publication date May 1, 2008
- Tessera Technologies Hungary Kft.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level fabrication of lidded chips with electrodeposited diele...
- Publication number 20080099907
- Publication date May 1, 2008
- Tessera Technologies Hungary Kft.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for packaging integrated circuit devices
- Publication number 20080017879
- Publication date Jan 24, 2008
- Tessera Technologies Hungary Kft.
- Gil Zilber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for packaging integrated circuit devices
- Publication number 20080012115
- Publication date Jan 17, 2008
- Tessera Technologies Hungary Kft.
- Gil Zilber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level chip packaging
- Publication number 20070190691
- Publication date Aug 16, 2007
- Tessera Technologies Hungary Kft.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level packaging to lidded chips
- Publication number 20070190747
- Publication date Aug 16, 2007
- Tessera Technologies Hungary Kft.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and apparatus for packaging integrated circuit devices
- Publication number 20070138498
- Publication date Jun 21, 2007
- Tessera Technologies Hungary Kft.
- Gil Zilber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device
- Publication number 20070042562
- Publication date Feb 22, 2007
- Tessera Technologies Hungary Kft.
- Avner Badehi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip packages with covers
- Publication number 20070040257
- Publication date Feb 22, 2007
- Tessera Technologies Hungary Kft.
- Avner Pierre Badehi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated circuit device
- Publication number 20070040180
- Publication date Feb 22, 2007
- Tessera Technologies Hungary Kft.
- Avner Badehi
- H01 - BASIC ELECTRIC ELEMENTS

Tessera Technologies Hungary Kft.

Organization

Patents Grantslast 30 patents

Wafer-level fabrication of lidded chips with electrodeposited diele...

Integrated circuit device

Methods and apparatus for packaging integrated circuit devices

Methods and apparatus for packaging integrated circuit devices

Methods and apparatus for packaging integrated circuit devices

Packaged integrated circuits and methods of producing thereof

Methods and apparatus for packaging integrated circuit devices

Methods and apparatus for packaging integrated circuit devices

Integrated circuit device

Methods for producing packaged integrated circuit devices and packa...

Methods for producing packaged integrated circuit devices and packa...

Patents Applicationslast 30 patents

Reducing Erroneous Colors in Edge Areas with Chromatic Abberation

FIXED FOCAL LENGTH OPTICAL LENS ARCHITECTURE PROVIDING A CUSTOMIZED...

Integrated circuit device

STACKED MICROELECTRONIC ASSEMBLIES HAVING VIAS EXTENDING THROUGH BO...

Microelectronic assemblies having compliancy and methods therefor

Wafer-level fabrication of lidded chips with electrodeposited diele...

Wafer-level fabrication of lidded chips with electrodeposited diele...

Methods and apparatus for packaging integrated circuit devices

Methods and apparatus for packaging integrated circuit devices

Wafer level chip packaging

Wafer level packaging to lidded chips

Methods and apparatus for packaging integrated circuit devices

Integrated circuit device

Chip packages with covers

Integrated circuit device

Trademarklast 30 trademarks