Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.

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Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Method of erasing flash memory and electronic system
- Patent number 11,978,520
- Issue date May 7, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Jong Bae Jeong
- G11 - INFORMATION STORAGE
Information Patent Grant
Pad structure and testkey structure and testing method for semicond...
- Patent number 11,906,577
- Issue date Feb 20, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Linzhi Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,869,935
- Issue date Jan 9, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Le Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage device and manufacturing method thereof
- Patent number 11,844,210
- Issue date Dec 12, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Jongbae Jeong
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of fabricating integrated circuit device
- Patent number 11,804,458
- Issue date Oct 31, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,791,367
- Issue date Oct 17, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Fan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive array and imaging apparatus having the same
- Patent number 11,729,527
- Issue date Aug 15, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Kaiwei Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal lead, semiconductor device and methods of fabricating the same
- Patent number 11,646,223
- Issue date May 9, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Tian Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage device and manufacturing method thereof
- Patent number 11,605,640
- Issue date Mar 14, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Jongbae Jeong
- G11 - INFORMATION STORAGE
Information Patent Grant
Grinding control method and device for wafer, and grinding device
- Patent number 11,587,838
- Issue date Feb 21, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Hongsheng Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage structure and erase method thereof
- Patent number 11,366,603
- Issue date Jun 21, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Jongbae Jeong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer structure and chip structure having through-hole electrical c...
- Patent number 11,282,885
- Issue date Mar 22, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guomin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for determining expansion compensation in phot...
- Patent number 11,264,242
- Issue date Mar 1, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Changlin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer thinning method and wafer structure
- Patent number 11,227,760
- Issue date Jan 18, 2022
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Hongsheng Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First wafer, fabricating method thereof and wafer stack
- Patent number 11,211,348
- Issue date Dec 28, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Xing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip interconnection structure, wafer interconnection structure and...
- Patent number 11,164,840
- Issue date Nov 2, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Hongsheng Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure and method for manufacturing the same, and chip str...
- Patent number 11,164,834
- Issue date Nov 2, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Di Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer structure with capacitive chip interconnection, method for ma...
- Patent number 11,114,414
- Issue date Sep 7, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method for manufacturing the same
- Patent number 11,114,401
- Issue date Sep 7, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Fei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer stack structure and forming method thereof
- Patent number 11,107,794
- Issue date Aug 31, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Changlin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of image sensing device
- Patent number 11,107,856
- Issue date Aug 31, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Peng Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating gate fabrication method
- Patent number 11,107,697
- Issue date Aug 31, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Chaoran Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonding pad in semiconductor device
- Patent number 11,107,726
- Issue date Aug 31, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yan Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a bonding structure
- Patent number 11,081,462
- Issue date Aug 3, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Tian Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer, bonding structure and wafer bonding method
- Patent number 11,069,647
- Issue date Jul 20, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yunpeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for calibrating wafer bonding apparatus
- Patent number 11,049,752
- Issue date Jun 29, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Chao Tao
- G05 - CONTROLLING REGULATING
Information Patent Grant
Semiconductor device with vertically separated openings and manufac...
- Patent number 11,043,448
- Issue date Jun 22, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yu Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having opening and via hole and method for man...
- Patent number 11,024,534
- Issue date Jun 1, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Beibei Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,943,853
- Issue date Mar 9, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Xing Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer bonding structure and bonding method
- Patent number 10,930,619
- Issue date Feb 23, 2021
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang Ye
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
STORAGE CELL, STORAGE BLOCK, AND MEMORY
- Publication number 20240172430
- Publication date May 23, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Kaiwei CAO
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY BLOCK, MEMORY-CELL GROUP AND MEMORY DEVICE
- Publication number 20240172438
- Publication date May 23, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
- Publication number 20240170549
- Publication date May 23, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Le LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FA...
- Publication number 20240153911
- Publication date May 9, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yu ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240153999
- Publication date May 9, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yajie CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY BLOCK AND CONTROL METHOD THEREOF
- Publication number 20240145005
- Publication date May 2, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- KAIWEI CAO
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY BLOCK AND MANUFACTURING METHOD THEREOF
- Publication number 20240145003
- Publication date May 2, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Kaiwei CAO
- G11 - INFORMATION STORAGE
Information Patent Application
IMAGE SENSOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240136387
- Publication date Apr 25, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS FOR THE SAME
- Publication number 20240128339
- Publication date Apr 18, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Guangjie XUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CHIP, OPERATING METHOD THEREOF, AND JUDGING METHOD
- Publication number 20240118812
- Publication date Apr 11, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yini LUO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MEMORY CHIP
- Publication number 20240111415
- Publication date Apr 4, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Yini LUO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
- Publication number 20240105532
- Publication date Mar 28, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Zhigang PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD
- Publication number 20240063174
- Publication date Feb 22, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Wanli GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR
- Publication number 20240055459
- Publication date Feb 15, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-TO-WAFER STACKING METHOD
- Publication number 20240047416
- Publication date Feb 8, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tanlin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT MODULE AND FABRICATION METHOD...
- Publication number 20240038631
- Publication date Feb 1, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Sheng HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREFOR
- Publication number 20240040807
- Publication date Feb 1, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Eunseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST CHIP AND WAFER BONDING METHOD AND CHIP STACKING STRUCTURE
- Publication number 20240021559
- Publication date Jan 18, 2024
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Di ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240021470
- Publication date Jan 18, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tianjian LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATED IMAGE SENSOR SUBSTRATE AND METHOD FOR MANUFACT...
- Publication number 20240006454
- Publication date Jan 4, 2024
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Yan XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND CHIP BO...
- Publication number 20230411435
- Publication date Dec 21, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tian ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...
- Publication number 20230402415
- Publication date Dec 14, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tian ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF HANDLING TEST PAD AND METHOD OF FABRICATING SEMICONDUCTOR...
- Publication number 20230395440
- Publication date Dec 7, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Qiong ZHAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230378232
- Publication date Nov 23, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD
- Publication number 20230377938
- Publication date Nov 23, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Wanli GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20230378233
- Publication date Nov 23, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Fan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRU...
- Publication number 20230343733
- Publication date Oct 26, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Guoliang YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MATCHING DESIGN METHOD, WAFER BONDING STRUCTURE AND CHIP BOND...
- Publication number 20230335504
- Publication date Oct 19, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Beibei SHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY PACKAGE CHIP AND SIGNAL PROCESSING MEHTHOD THEREFOR
- Publication number 20230335195
- Publication date Oct 19, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Zhiyong HAN
- G11 - INFORMATION STORAGE
Information Patent Application
MONOTONIC COUNTERS AND COUNTING METHODS BY MONOTONIC COUNTER
- Publication number 20230315318
- Publication date Oct 5, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Zhongzhou LU
- G06 - COMPUTING CALCULATING COUNTING

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Trademarklast 30 trademarks

Information Trademark
88057018 - XTACK I NG
- Serial number 88057018
- Filing date Jul 29, 2018
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- 40 - Treatment of materials
Information Trademark
88047746 - XTACK I NG
- Serial number 88047746
- Filing date Jul 23, 2018
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- 42 - Scientific and technological services and research and design relating thereto
Information Trademark
88047727 - XTACK I NG
- Serial number 88047727
- Filing date Jul 23, 2018
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- 35 - Advertising
Information Trademark
88047757 - XTACK I NG
- Serial number 88047757
- Filing date Jul 23, 2018
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- 45 - Legal services
Information Trademark
88047715 - XTACKING
- Serial number 88047715
- Registration number 6008711
- Filing date Jul 23, 2018
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
79214374 - XMC
- Serial number 79214374
- Registration number 5415196
- Filing date May 11, 2017
- Wuhan Xinxin Semiconductor ManufacturingCo., Ltd.
- 42 - Scientific and technological services and research and design relating thereto

Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.

Organization

Patents Grantslast 30 patents

Method of erasing flash memory and electronic system

Pad structure and testkey structure and testing method for semicond...

Semiconductor device and method of fabricating the same

Storage device and manufacturing method thereof

Method of fabricating integrated circuit device

Semiconductor device and method of fabricating the same

Photosensitive array and imaging apparatus having the same

Metal lead, semiconductor device and methods of fabricating the same

Storage device and manufacturing method thereof

Grinding control method and device for wafer, and grinding device

Storage structure and erase method thereof

Wafer structure and chip structure having through-hole electrical c...

Method and apparatus for determining expansion compensation in phot...

Wafer thinning method and wafer structure

First wafer, fabricating method thereof and wafer stack

Chip interconnection structure, wafer interconnection structure and...

Wafer structure and method for manufacturing the same, and chip str...

Wafer structure with capacitive chip interconnection, method for ma...

Bonding structure and method for manufacturing the same

Multi-wafer stack structure and forming method thereof

Manufacturing method of image sensing device

Floating gate fabrication method

Method for manufacturing bonding pad in semiconductor device

Method for manufacturing a bonding structure

Semiconductor wafer, bonding structure and wafer bonding method

Apparatus and method for calibrating wafer bonding apparatus

Semiconductor device with vertically separated openings and manufac...

Semiconductor device having opening and via hole and method for man...

Semiconductor device and manufacturing method thereof

Multi-wafer bonding structure and bonding method

Patents Applicationslast 30 patents

STORAGE CELL, STORAGE BLOCK, AND MEMORY

MEMORY BLOCK, MEMORY-CELL GROUP AND MEMORY DEVICE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR

METHOD FOR FORMING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FA...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

MEMORY BLOCK AND CONTROL METHOD THEREOF

MEMORY BLOCK AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS FOR THE SAME

MEMORY CHIP, OPERATING METHOD THEREOF, AND JUDGING METHOD

MEMORY CHIP

CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE

CHIP BONDING METHOD

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR

CHIP-TO-WAFER STACKING METHOD

THREE-DIMENSIONAL INTEGRATED CIRCUIT MODULE AND FABRICATION METHOD...

SEMICONDUCTOR DEVICES AND PREPARATION METHODS THEREFOR

FIRST CHIP AND WAFER BONDING METHOD AND CHIP STACKING STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

BACKSIDE ILLUMINATED IMAGE SENSOR SUBSTRATE AND METHOD FOR MANUFACT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND CHIP BO...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...

METHOD OF HANDLING TEST PAD AND METHOD OF FABRICATING SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

CHIP BONDING METHOD

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

WAFER BONDING STRUCTURE, WAFER BONDING METHOD AND CHIP BONDING STRU...

WAFER MATCHING DESIGN METHOD, WAFER BONDING STRUCTURE AND CHIP BOND...

MEMORY PACKAGE CHIP AND SIGNAL PROCESSING MEHTHOD THEREFOR

MONOTONIC COUNTERS AND COUNTING METHODS BY MONOTONIC COUNTER

Trademarklast 30 trademarks

88057018 - XTACK I NG

88047746 - XTACK I NG

88047727 - XTACK I NG

88047757 - XTACK I NG

88047715 - XTACKING

79214374 - XMC