Abdallah Bacha

Person

Munich, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor memory arrangement
- Patent number 8,040,710
- Issue date Oct 18, 2011
- Qimonda AG
- Abdallah Bacha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory module
- Patent number 7,869,243
- Issue date Jan 11, 2011
- Qimonda AG
- Abdallah Bacha
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory module with an electronic printed circuit board and a plural...
- Patent number 7,375,971
- Issue date May 20, 2008
- Infineon Technologies AG
- Siva RaghuRam
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory module with a clock signal regeneration circuit and a regist...
- Patent number 7,334,150
- Issue date Feb 19, 2008
- Infineon Technologies AG
- Hermann Ruckerbauer
- G11 - INFORMATION STORAGE
Information Patent Grant
Method and device for time measurement on semiconductor modules emp...
- Patent number 6,894,525
- Issue date May 17, 2005
- Infineon Technologies AG
- Simon Muff
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
THIN CLIENT FORM FACTOR ASSEMBLY
- Publication number 20230317705
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS FOR SEMICONDUCTOR DEVICES
- Publication number 20230317620
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS
- Publication number 20230317551
- Publication date Oct 5, 2023
- Intel Corporation
- Vishnu Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION
- Publication number 20230317582
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS BRIDGE FOR CONNECTING DIES
- Publication number 20230317618
- Publication date Oct 5, 2023
- Intel Corporation
- Carlton Hanna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACK COOLING WINGS
- Publication number 20230317681
- Publication date Oct 5, 2023
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
- Publication number 20230299014
- Publication date Sep 21, 2023
- Intel Corporation
- Abdallah Bacha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
- Publication number 20230299012
- Publication date Sep 21, 2023
- Intel Corporation
- Mohan Prashanth Javare Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS
- Publication number 20230299013
- Publication date Sep 21, 2023
- Intel Corporation
- Abdallah Bacha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER
- Publication number 20230282615
- Publication date Sep 7, 2023
- Intel Corporation
- Thomas Wagner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Module
- Publication number 20090027940
- Publication date Jan 29, 2009
- Abdallah Bacha
- G11 - INFORMATION STORAGE
Information Patent Application
Semiconductor Memory Arrangement
- Publication number 20080301349
- Publication date Dec 4, 2008
- Abdallah Bacha
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC SYSTEM WITH INTEGRATED CIRCUIT DEVICE AND PASSIVE COMPONENT
- Publication number 20080225503
- Publication date Sep 18, 2008
- QIMONDA AG
- Markus Wollmann
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Memory module and methods for making and using the same
- Publication number 20070258278
- Publication date Nov 8, 2007
- Abdallah Bacha
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Memory module, method of manufacturing a memory module and computer...
- Publication number 20070224854
- Publication date Sep 27, 2007
- Abdallah Bacha
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Memory module with an electronic printed circuit board and a plural...
- Publication number 20070091704
- Publication date Apr 26, 2007
- Siva RaghuRam
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor memory module
- Publication number 20060123265
- Publication date Jun 8, 2006
- Hermann Ruckerbauer
- G11 - INFORMATION STORAGE
Information Patent Application
Method and device for time measurement on semiconductor modules emp...
- Publication number 20040251926
- Publication date Dec 16, 2004
- Simon Muff
- G01 - MEASURING TESTING
Information Patent Application
Topology for providing clock signals to multiple circuit units on a...
- Publication number 20040201405
- Publication date Oct 14, 2004
- Abdallah Bacha
- G06 - COMPUTING CALCULATING COUNTING

Abdallah Bacha

Person

Patents Grantslast 30 patents

Semiconductor memory arrangement

Memory module

Memory module with an electronic printed circuit board and a plural...

Memory module with a clock signal regeneration circuit and a regist...

Method and device for time measurement on semiconductor modules emp...

Patents Applicationslast 30 patents

THIN CLIENT FORM FACTOR ASSEMBLY

INTERPOSERS FOR SEMICONDUCTOR DEVICES

HETEROGENEOUS PACKAGES HAVING THERMAL TOWERS

GLASS CORE SUBSTRATE PRINTED CIRCUIT BOARD FOR WARPAGE REDUCTION

GLASS BRIDGE FOR CONNECTING DIES

THREE-DIMENSIONAL STACK COOLING WINGS

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS

STACKED DIE PACKAGING ARCHITECTURE WITH CONDUCTIVE VIAS ON INTERPOSER

Memory Module

Semiconductor Memory Arrangement

ELECTRONIC SYSTEM WITH INTEGRATED CIRCUIT DEVICE AND PASSIVE COMPONENT

Memory module and methods for making and using the same

Memory module, method of manufacturing a memory module and computer...

Memory module with an electronic printed circuit board and a plural...

Semiconductor memory module

Method and device for time measurement on semiconductor modules emp...

Topology for providing clock signals to multiple circuit units on a...