Achim Neu

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Plastic molding compound, composite body, and filler for a plastic...
- Patent number 6,469,086
- Issue date Oct 22, 2002
- Infineon Technologies AG
- Achim Neu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of producing a semiconductor device comprising a cleaning pr...
- Patent number 6,436,731
- Issue date Aug 20, 2002
- Infineon Technologies AG
- Achim Neu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with method for manufacturing
- Patent number 6,429,537
- Issue date Aug 6, 2002
- Infineon Technologies AG
- Christian Hauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated component, composite element comprising an integrated co...
- Patent number 6,400,006
- Issue date Jun 4, 2002
- Infineon Technologies AG
- Achim Neu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component with a number of substrate layers and at le...
- Patent number 6,380,616
- Issue date Apr 30, 2002
- Infineon Technologies AG
- Günter Tutsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure sensor component
- Patent number 6,313,514
- Issue date Nov 6, 2001
- Infineon Technologies AG
- Jürgen Winterer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor component and production method
- Patent number 6,201,467
- Issue date Mar 13, 2001
- Infineon Technologies AG
- Jürgen Winterer
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor element having a carrying device and a lead frame and...
- Patent number 6,036,173
- Issue date Mar 14, 2000
- Siemens Aktiengesellschaft
- Achim Neu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor component and method for manufacturing it
- Publication number 20010036720
- Publication date Nov 1, 2001
- Christian Hauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated component, composite element comprising an integrated co...
- Publication number 20010021543
- Publication date Sep 13, 2001
- Achim Neu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing a semiconductor device
- Publication number 20010006830
- Publication date Jul 5, 2001
- Achim Neu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing a pressure sensor component
- Publication number 20010002119
- Publication date May 31, 2001
- Siemens Aktiengesellschaft
- Jurgen Winterer
- G01 - MEASURING TESTING

Person

Patents Grantslast 30 patents

Plastic molding compound, composite body, and filler for a plastic...

Method of producing a semiconductor device comprising a cleaning pr...

Semiconductor component with method for manufacturing

Integrated component, composite element comprising an integrated co...

Semiconductor component with a number of substrate layers and at le...

Pressure sensor component

Pressure sensor component and production method

Semiconductor element having a carrying device and a lead frame and...

Patents Applicationslast 30 patents

Semiconductor component and method for manufacturing it

Integrated component, composite element comprising an integrated co...

Method of producing a semiconductor device

Method of producing a pressure sensor component