Claims
- 1. An integrated component, comprising:
a component body having a main surface with functional elements of the integrated component and with an edge region without functional elements; a plurality of contact elements disposed at said edge region of said main surface, said contact elements projecting into said edge region of said main surface and having at least one contact surface inclined with respect to said main surface; said component body being configured to be fastened to conductor tracks of a fastening device, wherein the conductor tracks are disposed to face said component body and extend parallel to said main surface of said component body.
- 2. The component according to claim 1, wherein said contact elements are arranged in said edge region of said component body such that at least a portion thereof is in contact with said edge region of said main surface of said component body, and wherein, when said component body is installed, said contact elements are brought into contact with at least two surfaces of said fastening device arranged at an angle different from 0°.
- 3. The component according to claim 1, wherein said main surface has an inner area without contact elements.
- 4. The component according to claim 3, wherein said inner area is at least one of printed and coated.
- 5. A composite element, comprising a conductor structure and an integrated component according to claim 1 disposed on said conductor structure..
- 6. A chip card, comprising:
a basic body having a recess formed therein; a component configured as an integrated electronic circuit disposed in said recess in said basic body and having a main surface; said component having, disposed within said recess, at least one contact element for electrically connecting said component, said contact element having at least one contact surface inclined relative to said main surface of said component.
- 7. The chip card according to claim 6, wherein said component has a contact region and a rear side provided with a coating.
- 8. The chip card according to claim 7, wherein said coating is a laminated film.
- 9. The chip card according to claim 6, wherein said coating contains at least one functional element.
- 10. A method of producing an integrated component, which comprises:
providing an integrated component with a main surface and an edge region; and producing at least one contact element for connecting the component to a fastening device, and thereby forming the contact element in the edge region of the integrated component with at least one contact surface inclined relative to a main surface of the integrated component.
- 11. The method according to claim 10, which comprises producing at least some functional elements of the component in the region of a main surface of a semiconductor substrate, wherein the contact elements are produced in selected regions of the area of the semiconductor substrate, and subsequently separating the functional elements of the component from the semiconductor substrate such that the contact surfaces are exposed, during the separating step, as side regions of the contact elements.
Priority Claims (1)
Number |
Date |
Country |
Kind |
198 33 929.1 |
Jul 1998 |
DE |
|
CROSS-REFERENCE TO RELATED APPLICATION
[0001] This application is a continuation of copending International Application No. PCT/DE99/02190, filed Jul. 14, 1999, which designated the United States.
Continuations (1)
|
Number |
Date |
Country |
Parent |
PCT/DE99/02190 |
Jul 1999 |
US |
Child |
09771675 |
Jan 2001 |
US |