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Adolf E. Wirsing
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South Hero, VT, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method for forming interconnects on thin wafers
Patent number
7,288,492
Issue date
Oct 30, 2007
International Business Machines Corporation
Leonard J. Gardecki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer integrated rigid support ring
Patent number
7,138,326
Issue date
Nov 21, 2006
International Business Machines Corp.
Harry D. Cox
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming interconnects on thin wafers
Patent number
6,951,775
Issue date
Oct 4, 2005
International Business Machines Corporation
Leonard J. Gardecki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer integrated rigid support ring
Patent number
6,706,621
Issue date
Mar 16, 2004
International Business Machines Corporation
Harry D. Cox
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metallization composite having nickel intermediate/interface
Patent number
5,719,070
Issue date
Feb 17, 1998
International Business Machines Corporaton
Herbert Carl Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metallization composite having nickle intermediate/interface
Patent number
5,457,345
Issue date
Oct 10, 1995
International Business Machines Corporation
Herbert C. Cook
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming dual height solder interconnections
Patent number
5,251,806
Issue date
Oct 12, 1993
International Business Machines Corporation
Birendra N. Agarwala
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder mass having conductive encapsulating arrangement
Patent number
5,130,779
Issue date
Jul 14, 1992
International Business Machines Corporation
Birendra N. Agarwala
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
Publication number
20070278729
Publication date
Dec 6, 2007
Leonard J. Gardecki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wafer integrated rigid support ring
Publication number
20070045830
Publication date
Mar 1, 2007
International Business Machines Corporation
Harry D. Cox
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for forming interconnects on thin wafers
Publication number
20050272241
Publication date
Dec 8, 2005
Leonard J. Gardecki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
Publication number
20040266159
Publication date
Dec 30, 2004
International Business Machines Corporation
Leonard J Gardecki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wafer integrated rigid support ring
Publication number
20040135233
Publication date
Jul 15, 2004
Harry D. Cox
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer integrated rigid support ring
Publication number
20030071329
Publication date
Apr 17, 2003
International Business Machines Corporation
Harry D. Cox
H01 - BASIC ELECTRIC ELEMENTS