Akira Chinda

Person

Hitachi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making an electronic device and electronic device substrate
- Patent number 8,230,588
- Issue date Jul 31, 2012
- Hitachi Cable, Ltd.
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating an electronic device substrate
- Patent number 8,230,591
- Issue date Jul 31, 2012
- Hitachi Cable, Ltd.
- Akira Chinda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device substrate and its fabrication method, and electro...
- Patent number 8,101,864
- Issue date Jan 24, 2012
- Hitachi Cable, Ltd.
- Akira Chinda
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic device substrate, electronic device and methods for fabr...
- Patent number 7,939,935
- Issue date May 10, 2011
- Hitachi Cable Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device substrate, electronic device and methods for maki...
- Patent number 7,880,091
- Issue date Feb 1, 2011
- Hitachi Cable, Ltd.
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a multilayer wiring board, multilayer wiring...
- Patent number 7,780,836
- Issue date Aug 24, 2010
- Hitachi Cable, Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device substrate and its fabrication method, and electro...
- Patent number 7,705,245
- Issue date Apr 27, 2010
- Hitachi Cable, Ltd.
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating double-sided wiring board
- Patent number 7,681,310
- Issue date Mar 23, 2010
- Hitachi Cable, Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, method for manufacturing wiring board and electronic...
- Patent number 7,268,408
- Issue date Sep 11, 2007
- Hitachi Cable Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, wiring board and method of making same
- Patent number 6,969,910
- Issue date Nov 29, 2005
- Hitachi Cable, Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wiring board utilizing a conductive member...
- Patent number 6,943,100
- Issue date Sep 13, 2005
- Hitachi Cable, Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board utilizing a conductive member having a reduced thickness
- Patent number 6,670,718
- Issue date Dec 30, 2003
- Hitachi Cable, Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COPPER CIRCUIT WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100181100
- Publication date Jul 22, 2010
- HITACHI CABLE, LTD.
- Hiroshi NAKANO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE AND METHODS FOR MAKI...
- Publication number 20090323299
- Publication date Dec 31, 2009
- Hitachi Cable, Ltd.
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRO...
- Publication number 20090211796
- Publication date Aug 27, 2009
- HITACHI CABLE, LTD.
- Akira Chinda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION METHOD FOR WIRING AND VIAS
- Publication number 20090057156
- Publication date Mar 5, 2009
- HITACHI CABLE, LTD.
- Toshio Haba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Wiring Board and Production Method Thereof
- Publication number 20080251387
- Publication date Oct 16, 2008
- Toshio Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device substrate and its fabrication method, and electro...
- Publication number 20080201943
- Publication date Aug 28, 2008
- HITACHI CABLE, LTD.
- Akira Chinda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION METHOD OF CONDUCTIVE PATTERN
- Publication number 20070287289
- Publication date Dec 13, 2007
- Toshio Haba
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electronic device substrate, electronic device and methods for maki...
- Publication number 20070269590
- Publication date Nov 22, 2007
- Hitachi Cable, Ltd.
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device substrate, electronic device and methods for fabr...
- Publication number 20070268675
- Publication date Nov 22, 2007
- Hitachi Cable Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRO...
- Publication number 20070235218
- Publication date Oct 11, 2007
- HITACHI CABLE, LTD.
- Nobuaki Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating a multilayer wiring board, multilayer wiring...
- Publication number 20070034519
- Publication date Feb 15, 2007
- Hitachi Cable, Ltd.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device substrate and its fabrication method, and electro...
- Publication number 20060225918
- Publication date Oct 12, 2006
- HITACHI CABLE, LTD.
- Akira Chinda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-sided wiring board fabrication method, double-sided wiring b...
- Publication number 20060219428
- Publication date Oct 5, 2006
- Hitachi Cable, Ltd.
- AKira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board and production method thereof
- Publication number 20060163725
- Publication date Jul 27, 2006
- Toshio Haba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, wiring board and method of making same
- Publication number 20040104487
- Publication date Jun 3, 2004
- HITACHI CABLE, LTD.
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, semiconductor device, and process for production of w...
- Publication number 20040080054
- Publication date Apr 29, 2004
- HITACHI CABLE, LTD.
- Akira Chinda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring board, method for manufacturing wiring board and electronic...
- Publication number 20030178713
- Publication date Sep 25, 2003
- Akira Chinda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, semiconductor device, and process for production of w...
- Publication number 20020074667
- Publication date Jun 20, 2002
- HITACHI CABLE, LTD.
- Akira Chinda
- H01 - BASIC ELECTRIC ELEMENTS

Akira Chinda

Person

Patents Grantslast 30 patents

Method of making an electronic device and electronic device substrate

Method for fabricating an electronic device substrate

Electronic device substrate and its fabrication method, and electro...

Electronic device substrate, electronic device and methods for fabr...

Electronic device substrate, electronic device and methods for maki...

Method for fabricating a multilayer wiring board, multilayer wiring...

Electronic device substrate and its fabrication method, and electro...

Method for fabricating double-sided wiring board

Wiring board, method for manufacturing wiring board and electronic...

Semiconductor device, wiring board and method of making same

Method of fabricating a wiring board utilizing a conductive member...

Wiring board utilizing a conductive member having a reduced thickness

Patents Applicationslast 30 patents

COPPER CIRCUIT WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE AND METHODS FOR MAKI...

ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRO...

PRODUCTION METHOD FOR WIRING AND VIAS

Wiring Board and Production Method Thereof

Electronic device substrate and its fabrication method, and electro...

PRODUCTION METHOD OF CONDUCTIVE PATTERN

Electronic device substrate, electronic device and methods for maki...

Electronic device substrate, electronic device and methods for fabr...

ELECTRONIC DEVICE SUBSTRATE AND ITS FABRICATION METHOD, AND ELECTRO...

Method for fabricating a multilayer wiring board, multilayer wiring...

Electronic device substrate and its fabrication method, and electro...

Double-sided wiring board fabrication method, double-sided wiring b...

Wiring board and production method thereof

Semiconductor device, wiring board and method of making same

Wiring board, semiconductor device, and process for production of w...

Wiring board, method for manufacturing wiring board and electronic...

Wiring board, semiconductor device, and process for production of w...