Al Vindasius

Person

Saratoga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Assembly having stacked die mounted on substrate
- Patent number 8,729,690
- Issue date May 20, 2014
- Invensas Corporation
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional six surface conformal die coating
- Patent number 7,705,432
- Issue date Apr 27, 2010
- Vertical Circuits, Inc.
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micropede stacked die component assembly
- Patent number 7,245,021
- Issue date Jul 17, 2007
- Vertical Circuits, Inc.
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die BGA or LGA component assembly
- Patent number 7,215,018
- Issue date May 8, 2007
- Vertical Circuits, Inc.
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ASSEMBLY HAVING STACKED DIE MOUNTED ON SUBSTRATE
- Publication number 20130207249
- Publication date Aug 15, 2013
- Invensas Corporation
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE STACKED DIE PACKAGE
- Publication number 20090102038
- Publication date Apr 23, 2009
- Vertical Circuits, Inc.
- SIMON J.S. MCELREA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Six Surface Conformal Die Coating
- Publication number 20070290377
- Publication date Dec 20, 2007
- Vertical Circuits, Inc.
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly Having Stacked Die Mounted On Substrate
- Publication number 20070284716
- Publication date Dec 13, 2007
- Vertical Circuits, Inc.
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Assembly Having Electrical Interconnect
- Publication number 20070252262
- Publication date Nov 1, 2007
- Vertical Circuits, Inc.
- Marc Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micropede stacked die component assembly
- Publication number 20050258530
- Publication date Nov 24, 2005
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked die BGA or LGA component assembly
- Publication number 20050230802
- Publication date Oct 20, 2005
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional six surface conformal die coating
- Publication number 20050224952
- Publication date Oct 13, 2005
- Al Vindasius
- H01 - BASIC ELECTRIC ELEMENTS

Al Vindasius

Person

Patents Grantslast 30 patents

Assembly having stacked die mounted on substrate

Three dimensional six surface conformal die coating

Micropede stacked die component assembly

Stacked die BGA or LGA component assembly

Patents Applicationslast 30 patents

ASSEMBLY HAVING STACKED DIE MOUNTED ON SUBSTRATE

CHIP SCALE STACKED DIE PACKAGE

Three Dimensional Six Surface Conformal Die Coating

Assembly Having Stacked Die Mounted On Substrate

Die Assembly Having Electrical Interconnect

Micropede stacked die component assembly

Stacked die BGA or LGA component assembly

Three dimensional six surface conformal die coating