Alan P. Boone

Person

Swisher, IA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical device with thermally controlled performance
- Patent number 11,474,576
- Issue date Oct 18, 2022
- Rockwell Collins, Inc.
- Alan P. Boone
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microfluidic manufactured mesoscopic microelectronics interconnect
- Patent number 11,233,030
- Issue date Jan 25, 2022
- Rockwell Collins, Inc.
- Brandon C. Hamilton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-in-die-cavity packaging
- Patent number 10,727,203
- Issue date Jul 28, 2020
- Rockwell Collins, Inc.
- Reginald D. Bean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip stacking utilizing interposer
- Patent number 9,589,913
- Issue date Mar 7, 2017
- Rockwell Collins, Inc.
- Sarah M. Shepard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alkali silicate glass based coating and method for applying
- Patent number 9,565,758
- Issue date Feb 7, 2017
- Rockwell Collins, Inc.
- Nathan P. Lower
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Shielding encapsulation for electrical circuitry
- Patent number 9,545,043
- Issue date Jan 10, 2017
- Rockwell Collins, Inc.
- Brandon C. Hamilton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit protection and ruggedization coatings and methods
- Patent number 9,196,555
- Issue date Nov 24, 2015
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing near-hermetically coated integrated circuit as...
- Patent number 8,935,848
- Issue date Jan 20, 2015
- Rockwell Collins, Inc.
- Alan P. Boone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit tampering protection and reverse engineering pre...
- Patent number 8,664,047
- Issue date Mar 4, 2014
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of polyamide thermal plastics as low cost electronics potting c...
- Patent number 8,640,619
- Issue date Feb 4, 2014
- Rockwell Collins, Inc.
- Mark T. Dimke
- F42 - AMMUNITION BLASTING
Information Patent Grant
Adhesive applications using alkali silicate glass for electronics
- Patent number 8,637,980
- Issue date Jan 28, 2014
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alkali silicate glass based coating and method for applying
- Patent number 8,617,913
- Issue date Dec 31, 2013
- Rockwell Collins, Inc.
- Nathan P. Lower
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Glass thick film embedded passive material
- Patent number 8,585,937
- Issue date Nov 19, 2013
- Rockwell Collins, Inc.
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for providing near-hermetically coated integrated circuit as...
- Patent number 8,581,108
- Issue date Nov 12, 2013
- Rockwell Collins, Inc.
- Alan P. Boone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB external ground plane via conductive coating
- Patent number 8,461,698
- Issue date Jun 11, 2013
- Rockwell Collins, Inc.
- Brandon C. Hamilton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for providing near-hermetically coated, thermally protected...
- Patent number 8,166,645
- Issue date May 1, 2012
- Rockwell Collins, Inc.
- Ross K. Wilcoxon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Glass thick film embedded passive material
- Patent number 8,119,040
- Issue date Feb 21, 2012
- Rockwell Collins, Inc.
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit tampering protection and reverse engineering pre...
- Patent number 8,084,855
- Issue date Dec 27, 2011
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit protection and ruggedization coatings and methods
- Patent number 8,076,185
- Issue date Dec 13, 2011
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tamper resistant packaging with transient liquid phase bonding
- Patent number 7,830,021
- Issue date Nov 9, 2010
- Rockwell Collins, Inc.
- Ross K. Wilcoxon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-based packaging for electronic devices
- Patent number 7,675,151
- Issue date Mar 9, 2010
- Rockwell Collins, Inc.
- Alan P. Boone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked packaging designs offering inherent anti-tamper protection
- Patent number 7,638,866
- Issue date Dec 29, 2009
- Rockwell Collins, Inc.
- Reginald D. Bean
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low modulus stress buffer coating in microelectronic devices
- Patent number 7,635,919
- Issue date Dec 22, 2009
- Rockwell Collins, Inc.
- Guy N. Smith
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE LEVEL CAVITY HEAT SINK
- Publication number 20230163040
- Publication date May 25, 2023
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Alan P. Boone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE HEAT SINK
- Publication number 20230163041
- Publication date May 25, 2023
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jacob R. Mauermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALKALI SILICATE GLASS BASED COATING AND METHOD FOR APPLYING
- Publication number 20140102776
- Publication date Apr 17, 2014
- Rockwell Collins, Inc.
- Nathan P. Lower
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GLASS THICK FILM EMBEDDED PASSIVE MATERIAL
- Publication number 20120118623
- Publication date May 17, 2012
- Rockwell Collins, Inc.
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT TAMPERING PROTECTION AND REVERSE ENGINEERING PRE...
- Publication number 20120088338
- Publication date Apr 12, 2012
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Glass thick film embedded passive material
- Publication number 20100078605
- Publication date Apr 1, 2010
- Nathan P. Lower
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit tampering protection and reverse engineering pre...
- Publication number 20090246355
- Publication date Oct 1, 2009
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALKALI SILICATE GLASS BASED COATING AND METHOD FOR APPLYING
- Publication number 20090068474
- Publication date Mar 12, 2009
- Rockwell Collins, Inc.
- Nathan P. Lower
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for providing near-hermetically coated, thermally protected...
- Publication number 20080299300
- Publication date Dec 4, 2008
- Ross K. Wilcoxon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated circuit tampering protection and reverse engineering prv...
- Publication number 20080050512
- Publication date Feb 28, 2008
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS

Alan P. Boone

Person

Patents Grantslast 30 patents

Electrical device with thermally controlled performance

Microfluidic manufactured mesoscopic microelectronics interconnect

Die-in-die-cavity packaging

Flip chip stacking utilizing interposer

Alkali silicate glass based coating and method for applying

Shielding encapsulation for electrical circuitry

Integrated circuit protection and ruggedization coatings and methods

Method for providing near-hermetically coated integrated circuit as...

Integrated circuit tampering protection and reverse engineering pre...

Use of polyamide thermal plastics as low cost electronics potting c...

Adhesive applications using alkali silicate glass for electronics

Alkali silicate glass based coating and method for applying

Glass thick film embedded passive material

Method for providing near-hermetically coated integrated circuit as...

PCB external ground plane via conductive coating

Method for providing near-hermetically coated, thermally protected...

Glass thick film embedded passive material

Integrated circuit tampering protection and reverse engineering pre...

Integrated circuit protection and ruggedization coatings and methods

Tamper resistant packaging with transient liquid phase bonding

Silicon-based packaging for electronic devices

Stacked packaging designs offering inherent anti-tamper protection

Low modulus stress buffer coating in microelectronic devices

Patents Applicationslast 30 patents

DIE LEVEL CAVITY HEAT SINK

SELECTIVE HEAT SINK

ALKALI SILICATE GLASS BASED COATING AND METHOD FOR APPLYING

GLASS THICK FILM EMBEDDED PASSIVE MATERIAL

INTEGRATED CIRCUIT TAMPERING PROTECTION AND REVERSE ENGINEERING PRE...

Glass thick film embedded passive material

Integrated circuit tampering protection and reverse engineering pre...

ALKALI SILICATE GLASS BASED COATING AND METHOD FOR APPLYING

Method for providing near-hermetically coated, thermally protected...

Integrated circuit tampering protection and reverse engineering prv...