Alex See

Person

Woodlands, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated two-terminal device with logic device for embedded appli...
- Patent number 10,608,046
- Issue date Mar 31, 2020
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Wanbing Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated two-terminal device with logic device for embedded appli...
- Patent number 10,446,607
- Issue date Oct 15, 2019
- GLOBALFOUNDARIES SINGAPORE PTE. LTD.
- Wanbing Yi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for reducing contamination for reliable bond pads
- Patent number 10,410,854
- Issue date Sep 10, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Honghui Mou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for removal of hard mask
- Patent number 10,115,625
- Issue date Oct 30, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CD control
- Patent number 10,103,097
- Issue date Oct 16, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Zheng Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with overlay marks and methods of manufacturing...
- Patent number 9,646,934
- Issue date May 9, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Shijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP wafer edge control of dielectric
- Patent number 9,627,219
- Issue date Apr 18, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated circuits with improved active re...
- Patent number 9,620,418
- Issue date Apr 11, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits having nickel silicide contacts and methods for...
- Patent number 9,548,371
- Issue date Jan 17, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Jingyan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Small pitch and high density contact array
- Patent number 9,543,502
- Issue date Jan 10, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Zheng Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with memory cells and methods of manufacturing...
- Patent number 9,537,092
- Issue date Jan 3, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Zheng Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar passivation for pads
- Patent number 9,520,371
- Issue date Dec 13, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP head structure with retaining ring
- Patent number 9,511,470
- Issue date Dec 6, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- B24 - GRINDING POLISHING
Information Patent Grant
CMP head structure with retaining ring
- Patent number 9,511,474
- Issue date Dec 6, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Through silicon vias
- Patent number 9,437,547
- Issue date Sep 6, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation for embedded devices
- Patent number 9,349,654
- Issue date May 24, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slot designs in wide metal lines
- Patent number 9,318,378
- Issue date Apr 19, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Yeow Kheng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon vias
- Patent number 9,287,197
- Issue date Mar 15, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP head structure
- Patent number 9,242,341
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- B24 - GRINDING POLISHING
Information Patent Grant
CMP head structure
- Patent number 9,242,338
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Benfu Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Method for forming through silicon via with wafer backside protection
- Patent number 9,230,886
- Issue date Jan 5, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with memory cells and methods of manufacturing...
- Patent number 9,209,275
- Issue date Dec 8, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Zheng Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with improved gap fill dielectric and methods f...
- Patent number 9,202,746
- Issue date Dec 1, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Litho scanner alignment signal improvement
- Patent number 9,034,720
- Issue date May 19, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Hui Liu
- G02 - OPTICS
Information Patent Grant
Filament free silicide formation
- Patent number 9,023,725
- Issue date May 5, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Kwee Liang Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming through silicon via with wafer backside protection
- Patent number 8,940,637
- Issue date Jan 27, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser annealing
- Patent number 8,912,102
- Issue date Dec 16, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Chyiu Hyia Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to reduce thermal variations within an integra...
- Patent number 8,860,142
- Issue date Oct 14, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Debora Chyiu Hyia Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
STI CMP under polish monitoring
- Patent number 8,852,968
- Issue date Oct 7, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CD control
- Patent number 8,836,139
- Issue date Sep 16, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Zheng Zou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED TWO-TERMINAL DEVICE WITH LOGIC DEVICE FOR EMBEDDED APPLI...
- Publication number 20190326352
- Publication date Oct 24, 2019
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Wanbing YI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR REDUCING CONTAMINATION FOR RELIABLE BOND PADS
- Publication number 20190206676
- Publication date Jul 4, 2019
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Honghui MOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REMOVAL OF HARD MASK
- Publication number 20180190537
- Publication date Jul 5, 2018
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Liang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED TWO-TERMINAL DEVICE WITH LOGIC DEVICE FOR EMBEDDED APPLI...
- Publication number 20180182810
- Publication date Jun 28, 2018
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Wanbing YI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH OVERLAY MARKS AND METHODS OF MANUFACTURING...
- Publication number 20160351507
- Publication date Dec 1, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Shijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL PITCH AND HIGH DENSITY CONTACT ARRAY
- Publication number 20160351791
- Publication date Dec 1, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Zheng ZOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH MEMORY CELLS AND METHODS OF MANUFACTURING...
- Publication number 20160284991
- Publication date Sep 29, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Zheng Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLOT DESIGNS IN WIDE METAL LINES
- Publication number 20160233157
- Publication date Aug 11, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Yeow Kheng LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIAS
- Publication number 20160190066
- Publication date Jun 30, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP HEAD STRUCTURE
- Publication number 20160136781
- Publication date May 19, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- B24 - GRINDING POLISHING
Information Patent Application
CMP HEAD STRUCTURE
- Publication number 20160136774
- Publication date May 19, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- B24 - GRINDING POLISHING
Information Patent Application
METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH IMPROVED ACTIVE RE...
- Publication number 20160133524
- Publication date May 12, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR PASSIVATION FOR PADS
- Publication number 20160118355
- Publication date Apr 28, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM POLISHING WITH FIXED ABRASIVE PAD
- Publication number 20160114457
- Publication date Apr 28, 2016
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lup San LEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS HAVING NICKEL SILICIDE CONTACTS AND METHODS FOR...
- Publication number 20150311221
- Publication date Oct 29, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Jingyan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP WAFER EDGE CONTROL OF DIELECTRIC
- Publication number 20150303068
- Publication date Oct 22, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION FOR EMBEDDED DEVICES
- Publication number 20150279743
- Publication date Oct 1, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Liang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH IMPROVED GAP FILL DIELECTRIC AND METHODS F...
- Publication number 20150187641
- Publication date Jul 2, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION
- Publication number 20150137359
- Publication date May 21, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP HEAD STRUCTURE
- Publication number 20150111467
- Publication date Apr 23, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- B24 - GRINDING POLISHING
Information Patent Application
CMP HEAD STRUCTURE
- Publication number 20150111469
- Publication date Apr 23, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- B24 - GRINDING POLISHING
Information Patent Application
CD CONTROL
- Publication number 20140374920
- Publication date Dec 25, 2014
- Zheng ZOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIAS
- Publication number 20140264911
- Publication date Sep 18, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Benfu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STI CMP UNDER POLISH MONITORING
- Publication number 20140234993
- Publication date Aug 21, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Liang LI
- G01 - MEASURING TESTING
Information Patent Application
FILAMENT FREE SILICIDE FORMATION
- Publication number 20140167121
- Publication date Jun 19, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Kwee Liang YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER HILLOCK PREVENTION WITH HYDROGEN PLASMA TREATMENT IN A DEDIC...
- Publication number 20140117545
- Publication date May 1, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Huang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CD CONTROL
- Publication number 20140110855
- Publication date Apr 24, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Zheng ZOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHO SCANNER ALIGNMENT SIGNAL IMPROVEMENT
- Publication number 20140050439
- Publication date Feb 20, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Hui LIU
- G02 - OPTICS
Information Patent Application
METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION
- Publication number 20140008810
- Publication date Jan 9, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER PROFILE ENGINEERING USING FILMS WITH CONTINUOUSLY INCREASED...
- Publication number 20130187202
- Publication date Jul 25, 2013
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated two-terminal device with logic device for embedded appli...

Integrated two-terminal device with logic device for embedded appli...

Method and device for reducing contamination for reliable bond pads

Methods for removal of hard mask

CD control

Integrated circuits with overlay marks and methods of manufacturing...

CMP wafer edge control of dielectric

Methods for fabricating integrated circuits with improved active re...

Integrated circuits having nickel silicide contacts and methods for...

Small pitch and high density contact array

Integrated circuits with memory cells and methods of manufacturing...

Planar passivation for pads

CMP head structure with retaining ring

CMP head structure with retaining ring

Through silicon vias

Isolation for embedded devices

Slot designs in wide metal lines

Through silicon vias

CMP head structure

CMP head structure

Method for forming through silicon via with wafer backside protection

Integrated circuits with memory cells and methods of manufacturing...

Integrated circuits with improved gap fill dielectric and methods f...

Litho scanner alignment signal improvement

Filament free silicide formation

Method for forming through silicon via with wafer backside protection

Laser annealing

Method and apparatus to reduce thermal variations within an integra...

STI CMP under polish monitoring

CD control

Patents Applicationslast 30 patents

INTEGRATED TWO-TERMINAL DEVICE WITH LOGIC DEVICE FOR EMBEDDED APPLI...

METHOD AND DEVICE FOR REDUCING CONTAMINATION FOR RELIABLE BOND PADS

METHODS FOR REMOVAL OF HARD MASK

INTEGRATED TWO-TERMINAL DEVICE WITH LOGIC DEVICE FOR EMBEDDED APPLI...

INTEGRATED CIRCUITS WITH OVERLAY MARKS AND METHODS OF MANUFACTURING...

SMALL PITCH AND HIGH DENSITY CONTACT ARRAY

INTEGRATED CIRCUITS WITH MEMORY CELLS AND METHODS OF MANUFACTURING...

SLOT DESIGNS IN WIDE METAL LINES

THROUGH SILICON VIAS

CMP HEAD STRUCTURE

CMP HEAD STRUCTURE

METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH IMPROVED ACTIVE RE...

PLANAR PASSIVATION FOR PADS

UNIFORM POLISHING WITH FIXED ABRASIVE PAD

INTEGRATED CIRCUITS HAVING NICKEL SILICIDE CONTACTS AND METHODS FOR...

CMP WAFER EDGE CONTROL OF DIELECTRIC

ISOLATION FOR EMBEDDED DEVICES

INTEGRATED CIRCUITS WITH IMPROVED GAP FILL DIELECTRIC AND METHODS F...

METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION

CMP HEAD STRUCTURE

CMP HEAD STRUCTURE

CD CONTROL

THROUGH SILICON VIAS

STI CMP UNDER POLISH MONITORING

FILAMENT FREE SILICIDE FORMATION

COPPER HILLOCK PREVENTION WITH HYDROGEN PLASMA TREATMENT IN A DEDIC...

CD CONTROL

LITHO SCANNER ALIGNMENT SIGNAL IMPROVEMENT

METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION

SPACER PROFILE ENGINEERING USING FILMS WITH CONTINUOUSLY INCREASED...