Alexander H. Nickel

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Die bond pad design to enable different electrical configurations
- Patent number 10,490,719
- Issue date Nov 26, 2019
- LUMILEDS HOLDING B.V.
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
P—N separation metal fill for flip chip LEDs
- Patent number 10,170,675
- Issue date Jan 1, 2019
- Lumileds LLC
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealed semiconductor light emitting device
- Patent number 10,020,431
- Issue date Jul 10, 2018
- Lumileds LLC
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing solder pad topology differences by planarization
- Patent number 9,935,069
- Issue date Apr 3, 2018
- Lumileds LLC
- Jipu Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
P-n separation metal fill for flip chip LEDs
- Patent number 9,722,161
- Issue date Aug 1, 2017
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of separating a wafer of semiconductor devices
- Patent number 9,608,016
- Issue date Mar 28, 2017
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device with thick metal layers
- Patent number 9,484,513
- Issue date Nov 1, 2016
- Koninklijke Philips N.V.
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device with thick metal layers
- Patent number 9,324,927
- Issue date Apr 26, 2016
- Koninklijke Philips N.V.
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High ultraviolet light absorbance silicon oxynitride film for impro...
- Patent number 8,735,960
- Issue date May 27, 2014
- Spansion LLC
- Minh Q. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically programmable and erasable memory device and method of...
- Patent number 8,633,074
- Issue date Jan 21, 2014
- Spansion LLC
- Minh Q. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap-filling with uniform properties
- Patent number 8,415,256
- Issue date Apr 9, 2013
- Alexander Nickel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a memory cell having a top oxide spacer
- Patent number 8,384,146
- Issue date Feb 26, 2013
- Spansion LLC
- Shenqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiH4 soak for low hydrogen SiN deposition to improve flash memory d...
- Patent number 8,309,455
- Issue date Nov 13, 2012
- Spansion LLC
- Sung Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-H plasma treatment with N2 anneal for electronic memory devices
- Patent number 8,202,810
- Issue date Jun 19, 2012
- Spansion LLC
- Alexander H. Nickel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a memory cell having a top oxide spacer
- Patent number 8,202,779
- Issue date Jun 19, 2012
- Spansion LLC
- Shenqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned patterning method by using non-conformal film and etch...
- Patent number 8,035,153
- Issue date Oct 11, 2011
- Spansion LLC
- Shenqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu annealing for improved data retention in flash memory devices
- Patent number 8,026,169
- Issue date Sep 27, 2011
- Advanced Micro Devices, Inc.
- Lu You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiH4 soak for low hydrogen SiN deposition to improve flash memory d...
- Patent number 7,985,674
- Issue date Jul 26, 2011
- Spansion LLC
- Sung Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap-filling with uniform properties
- Patent number 7,884,030
- Issue date Feb 8, 2011
- Advanced Micro Devices, Inc. and Spansion LLC
- Alexander Nickel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ordered porosity to direct memory element formation
- Patent number 7,776,682
- Issue date Aug 17, 2010
- Spansion LLC
- Alexander Nickel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned patterning method by using non-conformal film and etch...
- Patent number 7,732,276
- Issue date Jun 8, 2010
- Spansion LLC
- Shenqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with copper interconnects and composite silic...
- Patent number 7,534,732
- Issue date May 19, 2009
- Spansion LLC
- Minh Van Ngo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Void free interlayer dielectric
- Patent number 7,307,027
- Issue date Dec 11, 2007
- Advanced Micro Devices, Inc.
- Minh Van Ngo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE BOND PAD DESIGN TO ENABLE DIFFERENT ELECTRICAL CONFIGURATIONS
- Publication number 20180337315
- Publication date Nov 22, 2018
- Lumileds Holding B.V.
- Wen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20180323353
- Publication date Nov 8, 2018
- Lumileds LLC
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS
- Publication number 20170373235
- Publication date Dec 28, 2017
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE WITH THICK METAL LAYERS
- Publication number 20160233400
- Publication date Aug 11, 2016
- Koninklijke Philips N.V.
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING SOLDER PAD TOPOLOGY DIFFERENCES BY PLANARIZATION
- Publication number 20160181216
- Publication date Jun 23, 2016
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS
- Publication number 20160126436
- Publication date May 5, 2016
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEPARATING A WAFER OF SEMICONDUCTOR DEVICES
- Publication number 20150140711
- Publication date May 21, 2015
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20150076538
- Publication date Mar 19, 2015
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE WITH THICK METAL LAYERS
- Publication number 20140339597
- Publication date Nov 20, 2014
- Stefano Schiaffino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY PROGRAMMABLE AND ERASEABLE MEMORY DEVICE
- Publication number 20140124848
- Publication date May 8, 2014
- SPANSION LLC
- Minh Q. TRAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A MEMORY CELL HAVING A TOP OXIDE SPACER
- Publication number 20120181601
- Publication date Jul 19, 2012
- Shenqing FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiH4 SOAK FOR LOW HYDROGEN SIN DEPOSITION TO IMPROVE FLASH MEMORY D...
- Publication number 20110266609
- Publication date Nov 3, 2011
- Sung Jin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A MEMORY CELL HAVING A TOP OXIDE SPACER
- Publication number 20110233647
- Publication date Sep 29, 2011
- Shenqing FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED PATTERNING METHOD BY USING NON-CONFORMAL FILM AND ETCH...
- Publication number 20100230743
- Publication date Sep 16, 2010
- Shenqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High ultraviolet light absorbance silicon oxynitride film for impro...
- Publication number 20100123178
- Publication date May 20, 2010
- Minh Q. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiH4 soak for low hydrogen SiN deposition to improve flash memory d...
- Publication number 20100109067
- Publication date May 6, 2010
- Spansion LLC
- Sung Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically programmable and erasable memory device and method of...
- Publication number 20100065901
- Publication date Mar 18, 2010
- Spansion LLC
- Minh Q. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-H PLASMA TREATMENT WITH N2 ANNEAL FOR ELECTRONIC MEMORY DEVICES
- Publication number 20090176369
- Publication date Jul 9, 2009
- Alexander H. Nickel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-aligned patterning method by using non-conformal film and etch...
- Publication number 20080265301
- Publication date Oct 30, 2008
- Shenqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLASH MEMORY DEVICES AND METHODS FOR FABRICATING THE SAME
- Publication number 20080153236
- Publication date Jun 26, 2008
- Ning Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cu annealing for improved data retention in flash memory devices
- Publication number 20080108193
- Publication date May 8, 2008
- Spansion LLC
- Lu You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conformal liner for gap-filling
- Publication number 20080096364
- Publication date Apr 24, 2008
- Spansion LLC
- Erik Wilson
- H01 - BASIC ELECTRIC ELEMENTS

Alexander H. Nickel

Person

Patents Grantslast 30 patents

Die bond pad design to enable different electrical configurations

P—N separation metal fill for flip chip LEDs

Sealed semiconductor light emitting device

Reducing solder pad topology differences by planarization

P-n separation metal fill for flip chip LEDs

Method of separating a wafer of semiconductor devices

Semiconductor light emitting device with thick metal layers

Semiconductor light emitting device with thick metal layers

High ultraviolet light absorbance silicon oxynitride film for impro...

Electrically programmable and erasable memory device and method of...

Gap-filling with uniform properties

Methods for forming a memory cell having a top oxide spacer

SiH4 soak for low hydrogen SiN deposition to improve flash memory d...

Low-H plasma treatment with N2 anneal for electronic memory devices

Methods for forming a memory cell having a top oxide spacer

Self-aligned patterning method by using non-conformal film and etch...

Cu annealing for improved data retention in flash memory devices

SiH4 soak for low hydrogen SiN deposition to improve flash memory d...

Gap-filling with uniform properties

Ordered porosity to direct memory element formation

Self-aligned patterning method by using non-conformal film and etch...

Semiconductor devices with copper interconnects and composite silic...

Void free interlayer dielectric

Patents Applicationslast 30 patents

DIE BOND PAD DESIGN TO ENABLE DIFFERENT ELECTRICAL CONFIGURATIONS

SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE

P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS

SEMICONDUCTOR LIGHT EMITTING DEVICE WITH THICK METAL LAYERS

REDUCING SOLDER PAD TOPOLOGY DIFFERENCES BY PLANARIZATION

P-N SEPARATION METAL FILL FOR FLIP CHIP LEDS

METHOD OF SEPARATING A WAFER OF SEMICONDUCTOR DEVICES

SEALED SEMICONDUCTOR LIGHT EMITTING DEVICE

SEMICONDUCTOR LIGHT EMITTING DEVICE WITH THICK METAL LAYERS

ELECTRICALLY PROGRAMMABLE AND ERASEABLE MEMORY DEVICE

METHODS FOR FORMING A MEMORY CELL HAVING A TOP OXIDE SPACER

SiH4 SOAK FOR LOW HYDROGEN SIN DEPOSITION TO IMPROVE FLASH MEMORY D...

METHODS FOR FORMING A MEMORY CELL HAVING A TOP OXIDE SPACER

SELF-ALIGNED PATTERNING METHOD BY USING NON-CONFORMAL FILM AND ETCH...

High ultraviolet light absorbance silicon oxynitride film for impro...

SiH4 soak for low hydrogen SiN deposition to improve flash memory d...

Electrically programmable and erasable memory device and method of...

LOW-H PLASMA TREATMENT WITH N2 ANNEAL FOR ELECTRONIC MEMORY DEVICES

Self-aligned patterning method by using non-conformal film and etch...

FLASH MEMORY DEVICES AND METHODS FOR FABRICATING THE SAME

Cu annealing for improved data retention in flash memory devices

Conformal liner for gap-filling