TREA

Alexander R. Mitwalsky

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  • Poughkeepsie, NY, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Planarized final passivation for semiconductor devices
    • Patent number 6,376,911
    • Issue date Apr 23, 2002
    • International Business Machines Corporation
    • James Gardner Ryan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Crack stops
    • Patent number 6,271,578
    • Issue date Aug 7, 2001
    • Siemens Aktiengesellschaft
    • Alexander R. Mitwalsky
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Crack stops
    • Patent number 6,084,287
    • Issue date Jul 4, 2000
    • Siemens Aktiengesellschaft
    • Alexander R. Mitwalsky
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Crack stops
    • Patent number 6,025,639
    • Issue date Feb 15, 2000
    • Siemens Aktiengesellschaft
    • Alexander R. Mitwalsky
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fuse window with controlled fuse oxide thickness
    • Patent number 5,872,390
    • Issue date Feb 16, 1999
    • International Business Machines Corporation
    • Pei-Ing Paul Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ablation patterning of multi-layered structures
    • Patent number 5,843,363
    • Issue date Dec 1, 1998
    • Siemens Aktiengesellschaft
    • Alexander Mitwalsky
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Crack stops
    • Patent number 5,789,302
    • Issue date Aug 4, 1998
    • Siemens Aktiengesellschaft
    • Alexander R. Mitwalsky
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Crack stop formation for high-productivity processes
    • Patent number 5,776,826
    • Issue date Jul 7, 1998
    • International Business Machines Corporation
    • Alexander Mitwalsky
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Ablation pattering of multilayered structures
    • Patent number 5,766,497
    • Issue date Jun 16, 1998
    • Siemens Aktiengesellschaft
    • Alexander Mitwalsky
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method and apparatus for dicing semiconductor wafers
    • Patent number 5,609,148
    • Issue date Mar 11, 1997
    • Siemens Aktiengesellschaft
    • Alexander Mitwalsky
    • B28 - WORKING CEMENT, CLAY, OR STONE
  • Information Patent Grant

    Fuse link structures through the addition of dummy structures
    • Patent number 5,589,706
    • Issue date Dec 31, 1996
    • International Business Machines Corp.
    • Alexander Mitwalsky
    • H01 - BASIC ELECTRIC ELEMENTS