Amit Kumar Sarkhel

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating printed circuit board with mixed metallurgy pads
- Patent number 6,931,722
- Issue date Aug 23, 2005
- International Business Machines Corporation
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder structure and method for high fatigue life
- Patent number 6,784,086
- Issue date Aug 31, 2004
- International Business Machines Corporation
- Sudipta K. Ray
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming metallic z-interconnects for laminate chip packag...
- Patent number 6,634,543
- Issue date Oct 21, 2003
- International Business Machines Corporation
- Brian E. Curcio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with mixed metallurgy pads and method of fabr...
- Patent number 6,586,683
- Issue date Jul 1, 2003
- International Business Machines Corporation
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package interconnect structure comprising lead-free solders
- Patent number 6,581,821
- Issue date Jun 24, 2003
- International Business Machines Corporation
- Amit K. Sarkhel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing circuit board assemblies using surface mount c...
- Patent number 6,545,229
- Issue date Apr 8, 2003
- International Business Machines Corporation
- Bao-Tong Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated semiconductor package
- Patent number 6,492,715
- Issue date Dec 10, 2002
- International Business Machines Corporation
- Voya R. Markovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for printed circuit board repair
- Patent number 6,437,254
- Issue date Aug 20, 2002
- International Business Machines Corporation
- Alan Harris Crudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package interconnect structure comprising lead-free solders
- Patent number 6,433,425
- Issue date Aug 13, 2002
- International Business Machines Corporation
- Amit K. Sarkhel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density column grid array connections and method thereof
- Patent number 6,429,388
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Mario J. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for printed circuit board repair
- Patent number 6,295,724
- Issue date Oct 2, 2001
- International Business Machines Corporation
- Alan Harris Crudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure for improving attachment reliability of semicon...
- Patent number 6,281,581
- Issue date Aug 28, 2001
- International Business Machines Corporation
- Kishor V. Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving attachment reliability of semiconductor chips...
- Patent number 6,251,766
- Issue date Jun 26, 2001
- International Business Machines Corporation
- Kishor V. Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing circuit board assemblies using surface mount c...
- Patent number 6,167,615
- Issue date Jan 2, 2001
- International Business Machines Corporation
- Bao-Tong Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for printed circuit board repair
- Patent number 6,115,912
- Issue date Sep 12, 2000
- International Business Machines Corporation
- Alan Harris Crudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for printed circuit board repair
- Patent number 6,018,866
- Issue date Feb 1, 2000
- International Business Machines Corporation
- Alan Harris Crudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder process
- Patent number 6,010,060
- Issue date Jan 4, 2000
- International Business Machines Corporation
- Amit Kumar Sarkhel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and method for improving attachment reliability...
- Patent number 6,002,172
- Issue date Dec 14, 1999
- International Business Machines Corporation
- Kishor V. Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free, high tin ternary solder alloy of tin, silver, and indium
- Patent number 5,874,043
- Issue date Feb 23, 1999
- International Business Machines Corporation
- Amit Kumar Sarkhel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for printed circuit board repair
- Patent number 5,809,641
- Issue date Sep 22, 1998
- International Business Machines Corporation
- Alan Harris Crudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing circuit board assemblies using surface mount c...
- Patent number 5,742,483
- Issue date Apr 21, 1998
- International Business Machines Corporation
- Bao-Tong Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free, tin-based multi-component solder alloys
- Patent number 5,730,932
- Issue date Mar 24, 1998
- International Business Machines Corporation
- Amit K. Sarkhel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder hierarchy for chip attachment to substrates
- Patent number 5,729,440
- Issue date Mar 17, 1998
- International Business Machines Corporation
- Miguel Angel Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder hierarchy for chip attachment to substrates
- Patent number 5,655,703
- Issue date Aug 12, 1997
- International Business Machines Corporation
- Miguel Angel Jimarez
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
- Publication number 20030177635
- Publication date Sep 25, 2003
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming metallic z-interconnects for laminate chip packag...
- Publication number 20030127495
- Publication date Jul 10, 2003
- International Business Machines Corporation
- Brian E. Curcio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package interconnect structure comprising lead-free solders
- Publication number 20020192443
- Publication date Dec 19, 2002
- Amit K. Sarkhel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
- Publication number 20020157861
- Publication date Oct 31, 2002
- International Business Machines Corporation
- Edward L. Arrington
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Lead-free solder structure and method for high fatigue life
- Publication number 20020149113
- Publication date Oct 17, 2002
- International Business Machines Corporation
- Sudipta K. Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for printed circuit board repair
- Publication number 20020059721
- Publication date May 23, 2002
- International Business Machines Corporation
- Alan Harris Crudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-free, high tin ternary solder alloy of tin, silver, and bismuth
- Publication number 20010002982
- Publication date Jun 7, 2001
- Amit Kumar Sarkhel
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Amit Kumar Sarkhel

Person

Patents Grantslast 30 patents

Method of fabricating printed circuit board with mixed metallurgy pads

Lead-free solder structure and method for high fatigue life

Method of forming metallic z-interconnects for laminate chip packag...

Printed circuit board with mixed metallurgy pads and method of fabr...

Electronic package interconnect structure comprising lead-free solders

Method for producing circuit board assemblies using surface mount c...

Integrated semiconductor package

Apparatus and method for printed circuit board repair

Electronic package interconnect structure comprising lead-free solders

High density column grid array connections and method thereof

Apparatus for printed circuit board repair

Substrate structure for improving attachment reliability of semicon...

Method for improving attachment reliability of semiconductor chips...

Method for producing circuit board assemblies using surface mount c...

Apparatus and method for printed circuit board repair

Apparatus and method for printed circuit board repair

Lead-free solder process

Substrate structure and method for improving attachment reliability...

Lead-free, high tin ternary solder alloy of tin, silver, and indium

Method for printed circuit board repair

Method for producing circuit board assemblies using surface mount c...

Lead-free, tin-based multi-component solder alloys

Solder hierarchy for chip attachment to substrates

Solder hierarchy for chip attachment to substrates

Patents Applicationslast 30 patents

Printed circuit board with mixed metallurgy pads and method of fabr...

Method of forming metallic z-interconnects for laminate chip packag...

Electronic package interconnect structure comprising lead-free solders

Printed circuit board with mixed metallurgy pads and method of fabr...

Lead-free solder structure and method for high fatigue life

Apparatus and method for printed circuit board repair

Lead-free, high tin ternary solder alloy of tin, silver, and bismuth