Claims
- 1. An adhesion pad for a substrate comprising:a metal layer having tapered sidewalls extending outwardly at an angle of at least 30 degrees from a top of said metal layer to said substrate; and a mass of solder over said metal layer.
- 2. An adhesion pad for a printed circuit board comprising:an insulating layer deposited on said printed circuit board with a substantially circular cavity having a diameter and a depth so that a portion of said printed circuit board is exposed; a metal layer having a thickness on said exposed portion of said printed circuit board and a portion of said insulating layer; and a mass of solder on said metal layer.
- 3. The adhesion pad according to claim 2, wherein said insulating layer is a photoresist and said metal layer is one of a solder wettable metal and a solder wettable alloy.
- 4. The adhesion pad according to claim 2, wherein said thickness of said metal layer is substantially smaller than said depth of said cavity, and said depth of said cavity is smaller than said diameter of said cavity.
- 5. The adhesion pad of claim 2, wherein said metal layer is substantially circular and has a diameter, said diameter of said cavity being 40-100% of said diameter of said metal layer.
- 6. An adhesion pad for a substrate comprising:a metal layer having curved sidewalls extending outwardly from a top of said metal layer to said substrate; and a mass of solder over said metal layer.
- 7. An adhesion pad for a substrate comprising:a substrate having a cavity, said cavity having sidewalls and a bottom in said substrate; a metal layer having a thickness disposed on a portion of said substrate and on said sidewalls and bottom of said cavity, and a mass of solder on said metal layer.
- 8. The adhesion pad of claim 7, wherein said cavity has a depth larger than the thickness of the metal layer, and the depth of said cavity is smaller than a diameter of said cavity.
Parent Case Info
This application is a divisional of U.S. Pat. application Ser. No. 08/815,238, filed on Mar. 12, 1997, now U.S. Pat. No. 6,002,172.
US Referenced Citations (17)
Foreign Referenced Citations (3)
Number |
Date |
Country |
59-87848 |
May 1984 |
JP |
63-175445 |
Jul 1988 |
JP |
10-135613 |
May 1998 |
JP |