TREA

Andrew J. Vacco

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  • Wallingford, CT, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Peel strength enhancement of copper laminates
    • Patent number 7,749,611
    • Issue date Jul 6, 2010
    • GBC Metals, LLC
    • William L. Brenneman
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Needle holder
    • Patent number 7,681,722
    • Issue date Mar 23, 2010
    • Tyco Healthcare Group LP
    • Mark S. Buchter
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Grindless surgical needle manufacture
    • Patent number 7,415,858
    • Issue date Aug 26, 2008
    • Tyco Healthcare Group LP
    • Michael W. Bogart
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
  • Information Patent Grant

    Copper foil with low profile bond enhancement
    • Patent number 6,893,742
    • Issue date May 17, 2005
    • Olin Corporation
    • Szuchain F. Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Copper foil composite including a release layer
    • Patent number 6,689,268
    • Issue date Feb 10, 2004
    • Olin Corporation
    • Szuchain Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Copper foil composite including a release layer
    • Patent number 6,346,335
    • Issue date Feb 12, 2002
    • Olin Corporation
    • Szuchain Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Needle holder
    • Publication number 20080011633
    • Publication date Jan 17, 2008
    • Mark S. Buchter
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
  • Information Patent Application

    Grindless surgical needle manufacture
    • Publication number 20070193326
    • Publication date Aug 23, 2007
    • Michael W. Bogart
    • B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
  • Information Patent Application

    Copper foil with low profile bond enhancement
    • Publication number 20050123782
    • Publication date Jun 9, 2005
    • Szuchain F. Chen
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Peel strength enhancement of copper laminates
    • Publication number 20040180225
    • Publication date Sep 16, 2004
    • William L. Brenneman
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Copper foil with low profile bond enhancement
    • Publication number 20020192486
    • Publication date Dec 19, 2002
    • Olin Corporation, a corporation of the State of Virginia
    • Szuchain F. Chen
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    Copper foil composite including a release layer
    • Publication number 20010027922
    • Publication date Oct 11, 2001
    • Szuchain Chen
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC