Claims
- 1. A method for the manufacture of a composite material comprising the steps of:providing an electrically conductive support layer; anodically treating said electrically conductive support layer in a first aqueous electrolyte containing first metal ions and hydroxide ions to produce an anodically treated electrically conductive support layer; subsequent to said anodically treating step, cathodically depositing a release layer onto said anodically treated electrically conductive support layer in a second aqueous electrolyte containing second metal ions and hydroxide ions; and electrolytically depositing a metal foil layer on said release layer.
- 2. The method of claim 1 wherein said first aqueous electrolyte is selected to contain sodium hydroxide and chromium ions.
- 3. The method of claim 2 wherein said cathodically depositing step is effective to deposit an admixture of chromium and chromium oxide having a thickness of up to 300 angstroms.
- 4. The method of claim 3 wherein said electrolytically depositing a metal foil layer step includes first depositing a copper seed layer from an alkaline copper electrolyte and then depositing a bulk copper layer from an acidic copper electrolyte.
- 5. The method of claim 4 wherein said metal foil layer is formed to a total thickness of less than 10 microns with said copper seed layer formed to a thickness of between 0.2 micron and 0.5 micron.
- 6. The method of claim 5 including the further steps of laminating said metal foil layer to a dielectric substrate and then separating said electrically conductive support layer and said release layer from a laminate comprising said dielectric substrate and metal foil layer.
- 7. The method of claim 6 including the further step of forming said metal foil layer into a plurality of electrically isolated circuit traces.
- 8. A method for the manufacture of a composite material comprising the steps of:providing an electrically conductive support layer; forming a release layer on said electrically conductive support layer, said release layer comprising a first portion and a second portion, said forming step comprising the steps of: (i) electrolytically depositing said first portion of said release layer adjacent said electrically conductive support layer, said first portion of said release layer being a metal selected from the group consisting of nickel, chromium and mixtures thereof; and (ii) applying said second portion of said release layer over said first portion by immersion coating, said second portion of said release layer being an admixture of chromium and chromium phosphate; and electrolytically depositing a metal foil layer on said release layer.
- 9. The method of claim 8 wherein said electrolytically depositing a metal foil layer step includes first depositing a copper seed layer from an alkaline copper electrolyte and then depositing a bulk copper layer from an acidic copper electrolyte.
- 10. The method of claim 9 wherein said metal foil layer is formed to a total thickness of less than 10 microns with said copper seed layer formed to a thickness of between 0.2 micron and 0.5 micron.
CROSS REFERENCE TO RELATED APPLICATION
This patent application is a divisional of U.S. patent application Ser. No. 09/522,544 entitled “Peelable Thin Foil” by Szuchain Chen, et al. that was filed on Mar. 10, 2000 now U.S. Pat. No. 6,346,335. The disclosure of U.S. patent application Ser. No. 09/522,544 is incorporated by reference in its entirety herein.
US Referenced Citations (13)
Foreign Referenced Citations (1)
Number |
Date |
Country |
86108340.0 |
Oct 1987 |
EP |