Claims
- 1. A composite material, comprising:
a carrier strip said carrier strip comprising a first side said first side possessing a substantially uniform roughness; an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and said entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte; and a release layer effective to facilitate separation of said metal foil layer from said carrier strip disposed between and contacting both said first side of said carrier strip and said second side of said metal foil layer.
- 2. The composite material of claim 1 wherein said substantially uniform roughness results from smooth rolling said first side of said carrier strip.
- 3. The composite material of claim 1 wherein said substantially uniform roughness results from microetching said first side of said carrier strip.
- 4. The composite material of claim 3 wherein said microetching of said first side of said carrier strip comprises the application of ammonium persulfate.
- 5. The composite material of claim 3 wherein said microetching of said first side of said carrier strip comprises the application of a sulfuric acid mixture.
- 6. The composite material of claim 1 wherein said substantially uniform roughness results from flashing said first side of said carrier strip with copper.
- 7. The composite material of claim 1 wherein said substantially uniform roughness results from flashing said first side of said carrier strip with nickel.
- 8. The composite material of claim 1 wherein said carrier strip is comprised of oxygen free copper.
- 9. The composite material of claim 1 wherein said carrier strip is comprised of a copper-nickel-silicon based alloy.
- 10. The composite material of claim 1 wherein said carrier strip has a tensile strength of at least 30 ksi.
- 11. The composite material of claim 1 wherein said carrier strip has a tensile strength of at least 100 ksi.
- 12. A composite material, comprising:
a carrier strip said carrier strip comprising a first side said first side possessing a substantially uniform roughness; an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and said entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte; a dark layer effective to absorb light energy said dark layer having opposing first and second sides said first side of said dark layer in contact with said second side of said copper foil layer; and a release layer effective to facilitate separation of said carrier strip from said dark layer disposed between and contacting both said first side of said carrier strip and said second side of said dark layer and effective to transmit the surface characteristics of said first side of said carrier strip to said second side of said dark layer.
- 13. The composite material of claim 12 wherein said substantially uniform roughness results from rough rolling said first side of said carrier strip.
- 14. The composite material of claim 12 wherein said substantially uniform roughness results from microetching said first side of said carrier strip.
- 15. The composite material of claim 12 wherein said substantially uniform roughness results from sand blasting said first side of said carrier strip.
- 16. The composite material of claim 12 wherein said substantially uniform roughness results from nodule plating said first side of said carrier strip.
- 17. The composite material of claim 12 wherein said dark layer has a thickness between 0.05 and 0.5 microns.
- 18. The composite material of claim 17 wherein said dark layer has an approximate thickness of 0.2 microns.
- 19. The composite material of claim 12 wherein said dark layer is comprised of a material selected from the group consisting of copper, nickel, tin, manganese, iron, and copper-nickel alloys.
- 20. A method for the manufacture of a composite material comprising the steps of:
providing an electrically conductive support layer; anodically treating said electrically conductive support layer in a first aqueous electrolyte containing first metal ions and hydroxide ions; subsequent to said anodically treating step, cathodically depositing a release layer onto said electrically conductive support layer in a second aqueous electrolyte containing second metal ions and hydroxide ions; and electrolytically depositing a metal foil layer on said release layer by immersion in a copper containing alkaline electrolyte for a period of time sufficient to achieve a thickness of said metal foil layer of approximately 1.0 to 15 microns.
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This patent application is a continuation-in-part of U.S. patent application Ser. No. 09/784,547 entitled “Copper Foil With Low Profile Bond Enhancement” by Szuchain Chen, et al. that was filed Feb. 15, 2001. This patent application relates to U.S. patent application Ser. No. 09/522,544 entitled “Copper Foil Composite Including a Release Layer” by Szuchain Chen, et al. that was filed on Mar.10, 2000. The disclosures of both U.S. patent application Ser. Nos. 09/784,547 and 09/522,544 are incorporated by reference in their entireties herein.
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
09784547 |
Feb 2001 |
US |
Child |
09948166 |
Sep 2001 |
US |